公开(公告)号：US20160264745A1

公开(公告)日：2016-09-15

申请号：US15033299

申请日：2013-11-06

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Songgang Chai

IPC: C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08K3/30 ,  C08K5/56

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2307/71 ,  B32B2307/714 ,  C08G59/4021 ,  C08G59/686 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/01 ,  C08K3/013 ,  C08K3/11 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K3/26 ,  C08K3/30 ,  C08K3/34 ,  C08K3/36 ,  C08K3/38 ,  C08K3/40 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/39 ,  C08K5/5398 ,  C08K5/56 ,  C08K7/22 ,  C08K2003/0887 ,  C08K2003/2227 ,  C08K2003/3009 ,  C08L63/00 ,  C08L101/00 ,  C09D5/024 ,  C09D7/61 ,  C09D7/66 ,  C08L67/00

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

Abstract translation: 本发明涉及一种热固性树脂组合物。 组合物包含约20wt。 ％至约70wt。 ％的热固性树脂，约1wt。 ％至约30wt。 ％的固化剂，约0wt。 ％至约10wt。 ％的促进剂，钨化合物和无机填料。 预浸料可以以浸渍方式制备，也可以以涂布方式制备涂料。 该组合物可能会降低层压板的热膨胀系数，并可有效阻挡紫外光并降低透光率。

公开(公告)号：US10208188B2

公开(公告)日：2019-02-19

申请号：US15028578

申请日：2013-10-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Liangpeng Hao ,  Songgang Chai

IPC: B32B3/10 ,  C08K5/5398 ,  C08J5/24 ,  C08G59/40 ,  C08K13/02 ,  C08L63/00 ,  C08L83/04 ,  H05K1/03 ,  C08J5/10 ,  C08G59/06 ,  C08K3/22 ,  C08K3/36 ,  C08K5/05 ,  C08K5/39 ,  C08G59/24 ,  C08G59/68 ,  B32B15/08 ,  B32B27/20 ,  C08L61/04 ,  C08G77/12 ,  C08G77/20

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

公开(公告)号：US20180346675A1

公开(公告)日：2018-12-06

申请号：US15780621

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Wenxin Chen ,  Cuiming Du ,  Songgang Chai

IPC: C08J9/10 ,  C08J5/24 ,  C08L79/08 ,  C08L71/00 ,  C08L67/00 ,  C08L63/00 ,  C08L83/04 ,  C08K5/00

CPC classification number: B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  C08J5/24 ,  C08J9/10 ,  C08J9/28 ,  C08L61/06 ,  C08L63/00 ,  H05K1/03

Abstract: A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.

公开(公告)号：US11053352B2

公开(公告)日：2021-07-06

申请号：US16523735

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08K9/04 ,  C08G65/329 ,  C08F236/06 ,  C08J5/24 ,  C08K3/38 ,  C08K5/14 ,  C08K7/26 ,  C08L53/02 ,  C08F8/02 ,  C08F8/46

Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.

公开(公告)号：US10053547B2

公开(公告)日：2018-08-21

申请号：US15033299

申请日：2013-11-06

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Songgang Chai

IPC: C08K5/5398 ,  C08K3/30 ,  C08K3/08 ,  C08J5/24 ,  C08K3/11 ,  C08K3/013 ,  C08K3/01 ,  C08L63/00 ,  C08G59/00 ,  B32B7/12 ,  C08K3/34 ,  C08K3/40 ,  C08K3/26 ,  C08K3/38 ,  C08L101/00 ,  C08K3/36 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K7/22 ,  C08K5/56 ,  C08G59/40 ,  C08G59/68 ,  C08K5/00 ,  C08K5/057 ,  C08K5/39

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2307/71 ,  B32B2307/714 ,  C08G59/4021 ,  C08G59/686 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/01 ,  C08K3/013 ,  C08K3/11 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K3/26 ,  C08K3/30 ,  C08K3/34 ,  C08K3/36 ,  C08K3/38 ,  C08K3/40 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/39 ,  C08K5/5398 ,  C08K5/56 ,  C08K7/22 ,  C08K2003/0887 ,  C08K2003/2227 ,  C08K2003/3009 ,  C08L63/00 ,  C08L101/00 ,  C09D5/024 ,  C09D7/61 ,  C09D7/66 ,  C08L67/00

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

公开(公告)号：US11261305B2

公开(公告)日：2022-03-01

申请号：US16523753

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin Chen ,  Qianfa Liu ,  Shanyin Yan ,  Xianping Zeng ,  Cuiming Du

IPC: C08J5/24 ,  B32B15/14 ,  C08L25/10 ,  C08L47/00 ,  C08L71/12 ,  H05K1/03

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.