Power Transistor with High Voltage Counter Implant
    1.
    发明申请
    Power Transistor with High Voltage Counter Implant 有权
    功率晶体管与高压计数器植入

    公开(公告)号:US20140021539A1

    公开(公告)日:2014-01-23

    申请号:US13554880

    申请日:2012-07-20

    IPC分类号: H01L29/78 H01L21/336

    摘要: Presented herein is a field effect transistor device, optionally a lateral power transistor, and a method for forming the same, comprising providing a substrate, creating a doped buried layer, and creating a primary well in the substrate on the buried layer. A drift drain may be created in the primary well and a counter implant region implanted in the primary well and between the drift drain and the buried layer. The primary well may comprise a first and second implant region with the second implant region at a depth less than the first. The counter implant may be at a depth between the first and second implant regions. The primary well and counter implant region may comprise dopants of the same conductivity type, or both p+-type dopants. A gate may be formed over a portion of a drift drain.

    摘要翻译: 这里呈现的是场效应晶体管器件,可选地是侧向功率晶体管及其形成方法,包括提供衬底,产生掺杂掩埋层,以及在掩埋层上的衬底中产生初级阱。 可以在主阱中产生漂移漏极,并且在初级阱中以及漂移漏极和埋层之间注入计数器注入区域。 主阱可以包括第一和第二注入区域,其中第二注入区域的深度小于第一注入区域。 计数器植入物可以处于第一和第二植入区域之间的深度。 主阱和计数器注入区域可以包括相同导电类型的掺杂剂,或者两种p +型掺杂剂。 栅极可以形成在漂移漏极的一部分上。

    Power transistor with high voltage counter implant
    3.
    发明授权
    Power transistor with high voltage counter implant 有权
    功率晶体管与高压计数器植入

    公开(公告)号:US08673712B2

    公开(公告)日:2014-03-18

    申请号:US13554880

    申请日:2012-07-20

    摘要: Presented herein is a field effect transistor device, optionally a lateral power transistor, and a method for forming the same, comprising providing a substrate, creating a doped buried layer, and creating a primary well in the substrate on the buried layer. A drift drain may be created in the primary well and a counter implant region implanted in the primary well and between the drift drain and the buried layer. The primary well may comprise a first and second implant region with the second implant region at a depth less than the first. The counter implant may be at a depth between the first and second implant regions. The primary well and counter implant region may comprise dopants of the same conductivity type, or both p+-type dopants. A gate may be formed over a portion of a drift drain.

    摘要翻译: 这里呈现的是场效应晶体管器件,可选地是侧向功率晶体管及其形成方法,包括提供衬底,产生掺杂掩埋层,以及在掩埋层上的衬底中产生初级阱。 可以在主阱中产生漂移漏极,并且在初级阱中以及漂移漏极和埋层之间注入计数器注入区域。 主阱可以包括第一和第二注入区域,其中第二注入区域的深度小于第一注入区域。 计数器植入物可以处于第一和第二植入区域之间的深度。 主阱和计数器注入区域可以包括相同导电类型的掺杂剂,或者两种p +型掺杂剂。 栅极可以形成在漂移漏极的一部分上。

    Alternating-doping profile for source/drain of a FET
    4.
    发明授权
    Alternating-doping profile for source/drain of a FET 有权
    FET的源极/漏极的交替掺杂分布

    公开(公告)号:US08377787B2

    公开(公告)日:2013-02-19

    申请号:US13155957

    申请日:2011-06-08

    IPC分类号: H01L21/336

    摘要: A semiconductor device is provided. In an embodiment, the device includes a substrate and a transistor formed on the semiconductor substrate. The transistor may include a gate structure, a source region, and a drain region. The drain region includes an alternating-doping profile region. The alternating-doping profile region may include alternating regions of high and low concentrations of a dopant. In an embodiment, the transistor is a high voltage transistor.

    摘要翻译: 提供半导体器件。 在一个实施例中,该器件包括形成在半导体衬底上的衬底和晶体管。 晶体管可以包括栅极结构,源极区和漏极区。 漏极区域包括交替掺杂分布区域。 交变掺杂剖面区域可以包括掺杂剂的高浓度和低浓度的交替区域。 在一个实施例中,晶体管是高压晶体管。

    ALTERNATING-DOPING PROFILE FOR SOURCE/DRAIN OF A FET
    5.
    发明申请
    ALTERNATING-DOPING PROFILE FOR SOURCE/DRAIN OF A FET 有权
    FET的源/漏极的替代配置

    公开(公告)号:US20110237041A1

    公开(公告)日:2011-09-29

    申请号:US13155957

    申请日:2011-06-08

    IPC分类号: H01L21/336

    摘要: A semiconductor device is provided. In an embodiment, the device includes a substrate and a transistor formed on the semiconductor substrate. The transistor may include a gate structure, a source region, and a drain region. The drain region includes an alternating-doping profile region. The alternating-doping profile region may include alternating regions of high and low concentrations of a dopant. In an embodiment, the transistor is a high voltage transistor.

    摘要翻译: 提供半导体器件。 在一个实施例中,该器件包括形成在半导体衬底上的衬底和晶体管。 晶体管可以包括栅极结构,源极区和漏极区。 漏极区域包括交替掺杂分布区域。 交变掺杂剖面区域可以包括掺杂剂的高浓度和低浓度的交替区域。 在一个实施例中,晶体管是高压晶体管。

    High-voltage MOS devices having gates extending into recesses of substrates
    6.
    发明授权
    High-voltage MOS devices having gates extending into recesses of substrates 有权
    具有延伸到衬底凹槽中的栅极的高压MOS器件

    公开(公告)号:US07888734B2

    公开(公告)日:2011-02-15

    申请号:US12328277

    申请日:2008-12-04

    IPC分类号: H01L29/66

    摘要: An integrated circuit structure includes a high-voltage well (HVW) region in a semiconductor substrate; a first double diffusion (DD) region in the HVW region; and a second DD region in the HVW region. The first DD region and the second DD region are spaced apart from each other by an intermediate portion of the HVW region. A recess extends from a top surface of the semiconductor substrate into the intermediate portion of the HVW region and the second DD region. A gate dielectric extends into the recess and covers a bottom of the recess. A gate electrode is over the gate dielectric. A first source/drain region is in the first DD region. A second source/drain region is in the second DD region.

    摘要翻译: 集成电路结构包括半导体衬底中的高电压阱(HVW)区域; HVW区域中的第一双扩散(DD)区域; 和HVW区域中的第二DD区域。 第一DD区域和第二DD区域通过HVW区域的中间部分彼此间隔开。 凹部从半导体衬底的顶表面延伸到HVW区域和第二DD区域的中间部分。 栅极电介质延伸到凹部中并覆盖凹部的底部。 栅极电极在栅极电介质上方。 第一源/漏区在第一DD区。 第二个源极/漏极区域位于第二个DD区域。

    MOSFET structure and method of fabricating the same
    7.
    发明授权
    MOSFET structure and method of fabricating the same 有权
    MOSFET结构及其制造方法

    公开(公告)号:US07332387B2

    公开(公告)日:2008-02-19

    申请号:US11324454

    申请日:2006-01-03

    申请人: Chen-Liang Chu

    发明人: Chen-Liang Chu

    IPC分类号: H01L21/8234

    摘要: A MOSFET structure and a method of forming it are described. The thickness of a portion of the gate dielectric layer of the MOSFET structure adjacent to the drain region is increased to form a bird's beak structure. The gate-to-drain overlap capacitance is reduced by the bird's beak structure.

    摘要翻译: 描述MOSFET结构及其形成方法。 与漏极区相邻的MOSFET结构的栅极电介质层的一部分的厚度增加以形成鸟的喙结构。 通过鸟的喙结构减小了栅极到漏极的重叠电容。

    High-voltage MOS devices having gates extending into recesses of substrates
    9.
    发明授权
    High-voltage MOS devices having gates extending into recesses of substrates 有权
    具有延伸到衬底凹槽中的栅极的高压MOS器件

    公开(公告)号:US08183626B2

    公开(公告)日:2012-05-22

    申请号:US13027097

    申请日:2011-02-14

    IPC分类号: H01L27/06

    摘要: An integrated circuit structure includes a high-voltage well (HVW) region in a semiconductor substrate; a first double diffusion (DD) region in the HVW region; and a second DD region in the HVW region. The first DD region and the second DD region are spaced apart from each other by an intermediate portion of the HVW region. A recess extends from a top surface of the semiconductor substrate into the intermediate portion of the HVW region and the second DD region. A gate dielectric extends into the recess and covers a bottom of the recess. A gate electrode is over the gate dielectric. A first source/drain region is in the first DD region. A second source/drain region is in the second DD region.

    摘要翻译: 集成电路结构包括半导体衬底中的高电压阱(HVW)区域; HVW区域中的第一双扩散(DD)区域; 和HVW区域中的第二DD区域。 第一DD区域和第二DD区域通过HVW区域的中间部分彼此间隔开。 凹部从半导体衬底的顶表面延伸到HVW区域和第二DD区域的中间部分。 栅极电介质延伸到凹部中并覆盖凹部的底部。 栅极电极在栅极电介质上方。 第一源/漏区在第一DD区。 第二个源极/漏极区域位于第二个DD区域。

    High-Voltage MOS Devices Having Gates Extending into Recesses of Substrates
    10.
    发明申请
    High-Voltage MOS Devices Having Gates Extending into Recesses of Substrates 有权
    具有扩展到衬底的栅极的高电压MOS器件

    公开(公告)号:US20110163375A1

    公开(公告)日:2011-07-07

    申请号:US13027097

    申请日:2011-02-14

    IPC分类号: H01L29/78

    摘要: An integrated circuit structure includes a high-voltage well (HVW) region in a semiconductor substrate; a first double diffusion (DD) region in the HVW region; and a second DD region in the HVW region. The first DD region and the second DD region are spaced apart from each other by an intermediate portion of the HVW region. A recess extends from a top surface of the semiconductor substrate into the intermediate portion of the HVW region and the second DD region. A gate dielectric extends into the recess and covers a bottom of the recess. A gate electrode is over the gate dielectric. A first source/drain region is in the first DD region. A second source/drain region is in the second DD region.

    摘要翻译: 集成电路结构包括半导体衬底中的高电压阱(HVW)区域; HVW区域中的第一双扩散(DD)区域; 和HVW区域中的第二DD区域。 第一DD区域和第二DD区域通过HVW区域的中间部分彼此间隔开。 凹部从半导体衬底的顶表面延伸到HVW区域和第二DD区域的中间部分。 栅极电介质延伸到凹部中并覆盖凹部的底部。 栅极电极在栅极电介质上方。 第一源/漏区在第一DD区。 第二个源极/漏极区域位于第二个DD区域。