公开(公告)号：US07020952B2

公开(公告)日：2006-04-04

申请号：US10304744

申请日：2002-11-27

申请人： Shindo Watanabe ,  Masahiro Konishi ,  Katsuhisa Yabuta

发明人： Shindo Watanabe ,  Masahiro Konishi ,  Katsuhisa Yabuta

IPC分类号： H01C17/02

CPC分类号： F23Q7/001 ,  F23Q2007/004 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49179 ,  Y10T29/5195

摘要： A green ceramic heater including a green heating resistor formed of an electrically conductive ceramic (e.g., silicide or carbide of a metal element such as W, Ta, or Nb) and an insulative ceramic (e.g., silicon nitride) and power supply leads (e.g., made of W), a first end of each power supply lead being connected to a corresponding end of the green heating resistor, the green heating resistor and the power supply leads buried in a green substrate formed of a material (e.g., silicon nitride) is fired, and subsequently, the resultant ceramic heater is heat-treated at 900 to 1,600° C., to thereby enhance flexural strength of the ceramic heater. The heat treatment is preferably carried out prior to forming a glass layer on an outer circumferential surface of the ceramic heater. When the heat treatment is performed after the fired ceramic heater has been polished so as to expose a second end of each power supply lead from a surface of the substrate, the heat treatment is preferably carried out in an inert atmosphere.

摘要翻译： 包括由导电陶瓷（例如，诸如W，Ta或Nb的金属元素的硅化物或碳化物）和绝缘陶瓷（例如，氮化硅）和电源引线（例如，氮化硅）形成的绿色加热电阻器的绿色陶瓷加热器。 由W制成），每个电源引线的第一端连接到绿色加热电阻器的对应端，绿色加热电阻器和埋入由材料（例如，氮化硅）形成的绿色衬底中的电源引线） 烧制后，将得到的陶瓷加热器在900〜1600℃进行热处理，从而提高陶瓷加热器的弯曲强度。 热处理优选在陶瓷加热器的外周面上形成玻璃层之前进行。 在烧结的陶瓷加热器被抛光之后进行热处理以从基板的表面露出每个电源引线的第二端时，优选在惰性气氛中进行热处理。

公开(公告)号：US06744016B2

公开(公告)日：2004-06-01

申请号：US09813689

申请日：2001-03-21

申请人： Shindo Watanabe ,  Masahiro Konishi

发明人： Shindo Watanabe ,  Masahiro Konishi

IPC分类号： F23Q700

CPC分类号： C04B41/009 ,  C04B41/5155 ,  F23Q7/001 ,  F23Q2007/004 ,  H05B3/141 ,  H05B3/148 ,  H05B2203/027 ,  C04B41/455 ,  C04B35/584

摘要： A ceramic heater includes a silicon nitride ceramic substrate and a heating member embedded in the silicon nitride ceramic substrate. An Al-thickened layer is formed in a surface layer portion of the silicon nitride ceramic substrate. The Al-thickened layer has an Al concentration higher than that of an internal layer portion of the silicon nitride ceramic substrate. The Al-thickened layer assumes such a graded composition structure that the Al concentration increases toward the surface of the silicon nitride ceramic substrate.

摘要翻译： 陶瓷加热器包括氮化硅陶瓷衬底和嵌入在氮化硅陶瓷衬底中的加热构件。 在氮化硅陶瓷基板的表层部分中形成Al增厚层。 Al增厚层的Al浓度高于氮化硅陶瓷衬底的内层部分的Al浓度。 Al增厚层采用这样的梯度组成结构，使得Al浓度朝向氮化硅陶瓷衬底的表面增加。

公开(公告)号：US06423944B1

公开(公告)日：2002-07-23

申请号：US09767860

申请日：2001-01-24

申请人： Shindo Watanabe ,  Masahiro Konishi

发明人： Shindo Watanabe ,  Masahiro Konishi

IPC分类号： F23Q700

摘要： A ceramic heater extending in an axial direction to have an elongate shape includes (a) a basal body; (b) a lead wire embedded in the basal body; and (c) a heating element embedded in the basal body. This heating element includes (1) a matrix ceramic phase; (2) conductive ceramic particles dispersed in the matrix ceramic phase; (3) a portion in which an end portion of the lead wire is embedded; and (4) a reference zone in terms of concentration of a particular element (e.g., rare-earth element). The heating element may include a condensed zone in terms of concentration of the particular element. The ceramic heater can be free from the condensed zone, or at least its formation is minimized to have a thickness of not greater than 5 &mgr;m. With this, the ceramic heater is improved in bending strength.

公开(公告)号：US06599457B2

公开(公告)日：2003-07-29

申请号：US10021204

申请日：2001-12-07

申请人： Shindo Watanabe ,  Masahiro Konishi

发明人： Shindo Watanabe ,  Masahiro Konishi

IPC分类号： C04B3332

CPC分类号： H05B3/148 ,  C04B35/593 ,  C04B35/597 ,  F23Q7/001 ,  F23Q2007/004 ,  H05B3/141 ,  H05B2203/027

摘要： In the production of a silicon nitride sintered body through a hot press method, a sintering aid protecting agent is added to the raw material. The employable protecting agents are metallic elements such as Ta, W and Mo and compounds of the metallic elements such as nitrides and silicides. Conversion of these elements and compounds to carbides occurs preferentially to reduction of the sintering aid. Thus, it becomes possible to suppress reduction of the sintering aid in a reducing atmosphere formed, for example, of carbon monoxide, which is generated particularly when a graphite pressing die is employed.

摘要翻译： 在通过热压法制造氮化硅烧结体时，向原料中添加烧结助剂保护剂。 可用的保护剂是诸如Ta，W和Mo的金属元素，以及诸如氮化物和硅化物的金属元素的化合物。 这些元素和化合物转化为碳化物优先发生烧结助剂的还原。 因此，可以抑制在例如使用石墨压模时产生的例如一氧化碳形成的还原气氛中的烧结助剂的还原。

公开(公告)号：US06359261B1

公开(公告)日：2002-03-19

申请号：US09696547

申请日：2000-10-25

申请人： Shindo Watanabe ,  Masahiro Konishi

发明人： Shindo Watanabe ,  Masahiro Konishi

IPC分类号： F23Q700

CPC分类号： H05B3/148 ,  C04B35/593 ,  C04B35/597 ,  F23Q7/001 ,  F23Q2007/004 ,  H05B3/141 ,  H05B2203/027

摘要： The invention comprehends a silicon nitride sintered body having consistent qualities, a process for producing the same, a ceramic heater employing the silicon nitride sintered body as a substrate and a glow plug containing the ceramic heater as a heat source. In the production of a silicon nitride sintered body through a hot press method, a sintering aid protecting agent is added to the raw material. The employable protecting agents are metallic elements such as Ta, W and Mo and compounds of the metallic elements such as nitrides and silicides. Conversion of these elements and compounds to carbides occurs preferentially to reduction of the sintering aid. Thus, it becomes possible to suppress reduction of the sintering aid in a reducing atmosphere formed, for example, of carbon monoxide, which is generated particularly when a graphite pressing die is employed. A ceramic heater which comprises a substrate formed from the silicon nitride sintered body and a resistance heater embedded in the substrate is obtained. Further, a glow plug containing the ceramic heater serving as a heat source is obtained.

公开(公告)号：US6143238A

公开(公告)日：2000-11-07

申请号：US239685

申请日：1999-01-29

申请人： Masahiro Konishi ,  Shindo Watanabe

发明人： Masahiro Konishi ,  Shindo Watanabe

IPC分类号： C04B35/58 ,  C04B35/64 ,  C04B37/00 ,  F23Q7/00 ,  H05B3/14 ,  H05B3/18 ,  H05B3/48 ,  C04B33/32

CPC分类号： H05B3/48 ,  B32B18/00 ,  C04B35/581 ,  C04B35/593 ,  F23Q7/001 ,  H05B3/141 ,  C04B2235/3224 ,  C04B2235/3891 ,  C04B2235/5445 ,  C04B2235/6022 ,  C04B2235/6562 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2235/6584 ,  C04B2235/721 ,  C04B2235/80 ,  C04B2237/368 ,  C04B2237/66 ,  C04B2237/76 ,  C04B2237/765 ,  C04B2237/84 ,  F23Q2007/004 ,  H05B2203/018 ,  H05B2203/027

摘要： Ceramic raw powder containing conductive ceramic powder is mixed with a prescribed quantity of a molding assistant containing carbon component. This mixture is molded into a prescribed shape of a resistive heating element to thereby produce a heating element mold. A composite mold is prepared by embedding the heating element mold into molds of a ceramic substrate. The composite mold is sintered at a sintering temperature of 1700.degree. C. or higher. During a process of rising temperature to the sintering temperature, the composite mold is kept in an oxygen containing atmosphere having an oxygen partial pressure of 2.times.10.sup.-4 to 1.0 Torr for 7 minutes or longer at a temperature of 1200.degree. C. or higher.

摘要翻译： 将含有导电性陶瓷粉末的陶瓷原料粉末与规定量的含有碳成分的成型助剂混合。 将该混合物成型为电阻加热元件的规定形状，从而制造加热元件模具。 通过将加热元件模具嵌入到陶瓷基板的模具中来制备复合模具。 复合模具在1700℃以上的烧结温度下进行烧结。 在升温至烧结温度的过程中，将复合模具在1200℃或更高的温度下保持在氧分压为2×10 -4至1.0托的含氧气氛中7分钟或更长时间。

公开(公告)号：US08410502B2

公开(公告)日：2013-04-02

申请号：US12868171

申请日：2010-08-25

申请人： Kazuhiro Okamoto ,  Masahiro Konishi ,  Masaharu Kitano

发明人： Kazuhiro Okamoto ,  Masahiro Konishi ,  Masaharu Kitano

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  G02B6/0083 ,  H01L24/45 ,  H01L24/97 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/43 ,  H01L2924/00012 ,  H01L2924/01006

摘要： A light-emitting device according to an embodiment of the present invention includes a light-emitting element, and a package substrate on which this light-emitting element is placed. This package substrate includes a placement face on which the light-emitting element is placed, a back face that is opposed to the placement face, and a mounting face that is opposed, between the placement face and the back face, to a mounting substrate when the light-emitting device is mounted, and includes a first recess portion that extends, on the mounting face, from the back face toward the placement face and that has a first heat conduction member formed on the surface thereof, and an intermediate heat conduction member for conducting heat between the light-emitting element and the first heat conduction member.

摘要翻译： 根据本发明实施例的发光器件包括发光元件和放置该发光元件的封装基板。 该封装基板包括放置有发光元件的放置面，与放置面相对的背面，以及在放置面和背面之间相对的安装面，安装基板， 所述发光装置安装在所述安装面上，所述第一凹部在所述安装面上从所述背面朝向所述放置面延伸，并且具有形成在其表面上的第一导热部件，以及中间导热部件 用于在发光元件和第一导热构件之间传导热量。

公开(公告)号：US08288936B2

公开(公告)日：2012-10-16

申请号：US12134047

申请日：2008-06-05

申请人： Masayuki Ohta ,  Masahiro Konishi ,  Yasuji Takenaka

发明人： Masayuki Ohta ,  Masahiro Konishi ,  Yasuji Takenaka

IPC分类号： H05B33/14

CPC分类号： C09K11/02 ,  C09K11/0883 ,  C09K11/7721 ,  C09K11/7734 ,  H01L33/46 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A light emitting apparatus is provided, and the light emitting apparatus has a light emitting device mounted on a substrate or a resin package where a substrate surface or the resin package is resin-encapsulated by an encapsulating resin section added with a phosphor in such a manner to cover the light emitting device. A surface resin layer of a different color from that of the encapsulating resin section is provided on a surface side of the encapsulating resin section.

摘要翻译： 提供了一种发光装置，并且发光装置具有安装在基板或树脂封装上的发光器件，其中基板表面或树脂封装体以这样的方式被添加有磷光体的封装树脂部分树脂封装 以覆盖发光器件。 在密封树脂部分的表面侧设置与密封树脂部分不同颜色的表面树脂层。

公开(公告)号：US20110044029A1

公开(公告)日：2011-02-24

申请号：US12916048

申请日：2010-10-29

申请人： Masahiro Konishi ,  Makoto Agatani ,  Toshio Hata

发明人： Masahiro Konishi ,  Makoto Agatani ,  Toshio Hata

IPC分类号： G02F1/13357 ,  F21S4/00

CPC分类号： H01L33/502 ,  F21K9/00 ,  F21K9/20 ,  F21K9/232 ,  F21V23/002 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

摘要翻译： 通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件 安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件 并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。

公开(公告)号：US07872418B2

公开(公告)日：2011-01-18

申请号：US12051602

申请日：2008-03-19

申请人： Toshio Hata ,  Masahiro Konishi ,  Makoto Agatani ,  Taiji Morimoto

发明人： Toshio Hata ,  Masahiro Konishi ,  Makoto Agatani ,  Taiji Morimoto

IPC分类号： H01L33/00

CPC分类号： H01B1/10 ,  F21K9/232 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01047 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： By using a light emitting device including a substrate and a light emitting unit, the light emitting unit including: a plurality of light emitting elements that are mounted on substrate and electrically connected to external electrodes; a first sealing member layer containing a first fluorescent material, formed to cover light emitting elements; and a second sealing member layer containing a second fluorescent material, formed on first sealing member layer, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device capable of suppressing color shifts and the like by the fluorescent materials, and of being easily manufactured, as well as a method for manufacturing the same.

摘要翻译： 通过使用包括基板和发光单元的发光装置，所述发光单元包括：多个发光元件，其安装在基板上并电连接到外部电极; 包含形成为覆盖发光元件的第一荧光材料的第一密封元件层; 以及形成在第一密封部件层上的包含第二荧光材料的第二密封部件层及其制造方法，能够提供能够抑制荧光材料的色移等的发光元件， 并且易于制造，以及其制造方法。