公开(公告)号：US5504924A

公开(公告)日：1996-04-02

申请号：US317621

申请日：1994-09-26

申请人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

发明人： Shingeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Toshio Hatada ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： G06F1/00 ,  F28D15/02 ,  G06F1/20 ,  H05K7/20 ,  G06F9/00

CPC分类号： H05K7/208 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  G06F1/206 ,  H05K7/20809 ,  G06F2200/201

摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.

摘要翻译： 一种电子计算机冷却系统，其具有用于冷却电子计算机的冷却装置和用于热连接半导体装置的冷却构件，所述冷却构件的工作速度通过冷却而升高到所述冷却装置的低温源。 安装构成电子计算机的半导体装置等的电路板被紧凑地封闭在一个壳体中，诸如制冷装置等的冷却装置。 或者，电路板和冷却装置分别紧密地封闭在分离的可拆卸的外壳中。 因此，可以获得通过使用冷却部件可靠地冷却期望的半导体器件的结构。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5270572A

公开(公告)日：1993-12-14

申请号：US903458

申请日：1992-06-24

申请人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

公开(公告)号：US5021924A

公开(公告)日：1991-06-04

申请号：US407159

申请日：1989-09-14

申请人： Shigekazu Kieda ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Motohiro Sato

发明人： Shigekazu Kieda ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Motohiro Sato

IPC分类号： H01L23/44 ,  H01L23/433 ,  H01L23/473

CPC分类号： H01L23/4336 ,  H01L2224/16225 ,  Y10S165/908

摘要： A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.

摘要翻译： 具有用液体冷却介质冷却的密封结构的多芯片模块等装置，并且其中安装芯片的半导体集成电路芯片或芯片载体使用冷却液体进行强制对流冷却而单独冷却。 冷却液喷射端口被布置成使得冷却液体基本上与芯片的背面平行地流动。

公开(公告)号：US4949164A

公开(公告)日：1990-08-14

申请号：US216704

申请日：1988-07-07

申请人： Shigeo Ohashi ,  Heikichi Kuwabara ,  Tadakatsu Nakajima ,  Wataru Nakayama ,  Motohiro Sato ,  Kenichi Kasai

发明人： Shigeo Ohashi ,  Heikichi Kuwabara ,  Tadakatsu Nakajima ,  Wataru Nakayama ,  Motohiro Sato ,  Kenichi Kasai

IPC分类号： H01L23/427

CPC分类号： H01L23/427 ,  H01L23/44 ,  H01L2924/0002

摘要： High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

公开(公告)号：US4770242A

公开(公告)日：1988-09-13

申请号：US873304

申请日：1986-06-09

申请人： Takahiro Daikoku ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Keizo Kawamura ,  Motohiro Sato ,  Fumiyuki Kobayashi ,  Wataru Nakayama

发明人： Takahiro Daikoku ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Keizo Kawamura ,  Motohiro Sato ,  Fumiyuki Kobayashi ,  Wataru Nakayama

IPC分类号： H01L23/40 ,  H01L23/433 ,  F28F7/00

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

摘要翻译： 用于提供集成电路半导体芯片的冷却的冷却装置被布置成通过彼此以小间隙配合的薄翅片构件传递热量。 与翅片构件一体设置的导热构件中的一个的底面的表面积比半导体芯片的后平面更大，导热构件和半导体芯片始终保持平面接触 从而提高冷却性能。

公开(公告)号：USRE35721E

公开(公告)日：1998-02-03

申请号：US451761

申请日：1989-12-18

申请人： Takahiro Daikoku ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Keizo Kawamura ,  Motohiro Sato ,  Fumiyuki Kobayashi ,  Wataru Nakayama

发明人： Takahiro Daikoku ,  Tadakatsu Nakajima ,  Noriyuki Ashiwake ,  Keizo Kawamura ,  Motohiro Sato ,  Fumiyuki Kobayashi ,  Wataru Nakayama

IPC分类号： H01L23/433 ,  F28F7/00

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

公开(公告)号：US09230759B2

公开(公告)日：2016-01-05

申请号：US14363922

申请日：2012-10-11

申请人： Katsuhiko Horinouchi ,  Motohiro Sato ,  Kazuki Kubo ,  Yuhei Awano

发明人： Katsuhiko Horinouchi ,  Motohiro Sato ,  Kazuki Kubo ,  Yuhei Awano

IPC分类号： H01H33/22 ,  H01H33/06 ,  H01H33/78 ,  H01H33/91 ,  H01H33/74 ,  H01H33/88 ,  H01H33/90

CPC分类号： H01H33/06 ,  H01H33/74 ,  H01H33/78 ,  H01H33/88 ,  H01H33/91 ,  H01H2033/906

摘要： A gas circuit breaker includes: a pair of electrodes provided so as to be able to come in contact with and separate from each other; and an insulating material that is placed so as to generate a decomposition gas in response to a direct or indirect action from an arc occurring between the pair of electrodes when a current is broken, wherein the decomposition gas generated from the insulating material when the current is broken is configured to be utilized for extinguishing the arc, and wherein an ablative material that does not include hydrogen atoms but has a carbon-oxygen bond in a main chain or ring part is used as the insulating material.

摘要翻译： 气体断路器包括：一对电极，其设置成能够彼此接触并分离; 以及绝缘材料，其被布置成当电流破裂时响应于在一对电极之间产生的电弧的直接或间接作用而产生分解气体，其中当电流为绝缘材料时从绝缘材料产生的分解气体 断裂构造成用于熄灭电弧，并且其中使用不包括氢原子但在主链或环部分中具有碳 - 氧键的烧蚀材料作为绝缘材料。

公开(公告)号：US20130161289A1

公开(公告)日：2013-06-27

申请号：US13820333

申请日：2011-11-04

申请人： Katsuhiko Horinouchi ,  Motohiro Sato

发明人： Katsuhiko Horinouchi ,  Motohiro Sato

IPC分类号： H01H33/70

CPC分类号： H01H33/86 ,  H01H33/66261 ,  H01H33/7015 ,  H01H33/7023 ,  H01H33/703 ,  H01H33/7076 ,  H01H33/76

摘要： An arc extinguishing device of a gas circuit breaker includes: an arc chamber in which an arc generated between a movable electrode and a fixed electrode is formed; a heat puffer chamber disposed so as to surround the arc chamber; a blow port in which the arc chamber communicates with the heat puffer chamber in the circumferential direction of the arc chamber; hydrogen absorbents which are disposed on an inner wall of a pressure chamber; an exhaust port which passes to the outside of an arc extinguishing chamber; and a hydrogen absorbent disposed at a position surrounding the movable electrode. Deterioration of insulation due to a product formed by decomposition of arc extinguishing gas by the arc during a contact opening operation can be suppressed.

摘要翻译： 气体断路器的灭弧装置包括：电弧室，其中形成在可动电极和固定电极之间产生的电弧; 设置为围绕电弧室的热冲击室; 吹气口，其中所述电弧室在所述电弧室的圆周方向上与所述热冲洗室连通; 设置在压力室的内壁上的吸氢剂; 排气口，其通向灭弧室的外部; 以及设置在可动电极周围的位置的吸氢体。 可以抑制由于在接触打开操作期间通过电弧分解灭弧气体而形成的产品的绝缘的劣化。

公开(公告)号：US06484612B1

公开(公告)日：2002-11-26

申请号：US09664854

申请日：2000-09-19

申请人： Hiroshi Miyachi ,  Yoshihiro Toshimori ,  Motohiro Sato

发明人： Hiroshi Miyachi ,  Yoshihiro Toshimori ,  Motohiro Sato

IPC分类号： B23B3142

CPC分类号： B25J15/04 ,  Y10T82/2585 ,  Y10T82/2589 ,  Y10T82/2591 ,  Y10T82/30

摘要： A plurality of connecting members are provided to a tool adaptor to which a tool is mounted, a plurality of connecting jaw members having inclined faces which are engaged with and detached from the connecting members when the connecting jaw members are displaced in radial directions, a rod that expands and contracts due to operation of air pressure, and a cam-type converting mechanism for converting the expanding/contracting operation of the rod to operations of displacement of the jaw members are provided to a mounting unit mounted to a robot hand, and a stopper portion for preventing the connecting member from being detached and falling from the inclined face when the air pressure reduces is provided to each the jaw member.

摘要翻译： 多个连接构件设置到工具安装到的工具适配器上，多个连接钳口构件具有倾斜面，当连接钳口构件沿径向移动时，其具有与连接构件接合和分离的杆;杆 由于空气压力的作用而膨胀和收缩，并且将凸轮转换机构用于将安装在机器人手上的安装单元设置成将杆的伸缩操作转换成夹爪构件的位移操作， 用于防止连接构件在空气压力下降时从倾斜面脱落和落下的止动部。