摘要:
A method for etching is provided in which the etching selectivity of an amorphous semiconductor film to a crystalline semiconductor film is high. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas of a Br-based gas, a F-based gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Reduction in the film thickness of the exposed portion can be suppressed by performing the etching in such a manner. Moreover, when etching for forming a back channel portion of a thin film transistor is performed with the method for etching, favorable electric characteristics of the thin film transistor can be obtained. An insulating layer is preferably provided over the thin film transistor.
摘要:
A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF4 gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Etching for forming a back channel portion of a thin film transistor is performed with the method for etching, whereby high electric characteristics can be provided for the thin film transistor.
摘要:
To establish a processing technique in manufacture of a semiconductor device including an In—Sn—Zn—O-based semiconductor. An In—Sn—Zn—O-based semiconductor layer is selectively etched by dry etching with the use of a gas containing chlorine such as Cl2, BCl3, SiCl4, or the like. In formation of a source electrode layer and a drain electrode layer, a conductive layer on and in contact with the In—Sn—Zn—O-based semiconductor layer can be selectively etched with little removal of the In—Sn—Zn—O-based semiconductor layer with the use of a gas containing oxygen or fluorine in addition to a gas containing chlorine.
摘要:
A first insulating film in contact with an oxide semiconductor film and a second insulating film are stacked in this order over an electrode film of a transistor including the oxide semiconductor film, an etching mask is formed over the second insulating film, an opening portion exposing the electrode film is formed by etching a portion of the first insulating film and a portion of the second insulating film, the opening portion exposing the electrode film is exposed to argon plasma, the etching mask is removed, and a conductive film is formed in the opening portion exposing the electrode film. The first insulating film is an insulating film whose oxygen is partly released by heating. The second insulating film is less easily etched than the first insulating film and has a lower gas-permeability than the first insulating film.
摘要:
A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF4 gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Etching for forming a back channel portion of a thin film transistor is performed with the method for etching, whereby high electric characteristics can be provided for the thin film transistor.
摘要:
A photographing control unit comprising a drive signal generator, an analog front end, a synchronization signal generation unit, and a system control unit controls an imager under a predetermined photographing condition, so that the imager photographs an observation image of a sample observed by a microscope and formed on a light receiving surface of the imager. A computing unit obtains inputs of a plurality of photographing parameters, determines a photographing condition based on the obtained photographing parameters, and sets the photographing condition for the photographing control unit. A display unit displays the designable ranges of the photographing parameters. Here, when the computing unit obtains the input of a priority parameter, it changes the designable range of the plurality of photographing parameters other than the priority parameter based on the priority parameter and causes the display unit to display the designable range after the change.
摘要:
The microscopic imaging apparatus includes a system controlling unit for obtaining a VD time setting value, and for obtaining the number of electric charge subtracting pulses, a synchronization signal generating unit for generating a vertical synchronization signal on the basis of the VD time setting value output from the system controlling unit and the horizontal synchronization signal, and a timing generating unit for extracting the electric charge of the imaging device by supplying the horizontal synchronization signal by the number of electric charge subtracting pulses to the imaging device as the electric charge subtracting pulses, and for generating a read pulse synchronous with the vertical synchronization signal in order to stop the accumulation of the electric charge of the imaging device after exposure is started.
摘要:
A cylindrical steam reforming unit contains a plurality of cylindrical bodies consisting of a first cylindrical body, a second cylindrical body and a third cylindrical body of successively increasing diameters disposed in concentric spaced relationship, a radiation cylinder disposed within and concentrically with the first cylindrical body, a burner disposed in the radial central portion of the radiation cylinder, and a reforming catalyst layer with a reforming catalyst filled in a gap between the first and second cylindrical bodies, wherein a CO shift catalyst layer and a CO removal catalyst layer are disposed in a gap between the second and third cylindrical bodies, the CO shift catalyst layer being formed in a gap with the direction of flow reversing at one axial end of the reforming catalyst layer and through a heat recovery layer of predetermined length. According to this reforming unit, without internally disposing a heat insulation layer, a cooling mechanism or the like, the reforming catalyst layer, CO shift catalyst layer, and CO removal catalyst layer can be integrated, achieving various useful effects, including size and weight reductions and the shortening of startup time.
摘要:
An active matrix substrate has an insulating substrate, a plurality of signal lines and a plurality of scanning lines arranged in a matrix on the insulating substrate and defining a matrix of areas, each area including a pixel electrode and a switching device. The switching device has a connecting electrode for connecting the switching device to the pixel electrode. The connecting electrode includes a rectangular main portion and an extended portion connected to the main portion, and the main portion has a side which is substantially identical in length to the width of the switching device. The main portion and the extended portion are disposed between the pixel electrode and the insulating substrate.
摘要:
An active matrix display device which includes a first and a second insulating substrates, a gate bus an adjacent gate bus, and a source bus arranged on the first substrate, a pixel electrode in a segment enclosed by the gate and the source buses, a switching element connected to the pixel electrode, the gate bus and the source bus, wherein the source bus comprises a projection extending toward the pixel electrode so as to be electrically disconnected therefrom, and the adjacent gate bus comprises a projection extending toward the pixel electrode, the source bus being overlaid on the adjacent gate bus projection with an insulating layer sandwiched therebetween, the adjacent gate bus projection being provided with an electroconductive member at the top thereof with an insulating layer sandwiched therebetween, the electroconductive member being electrically connected to the pixel electrode, and electrically disconnected from the source bus projection.