Etching method using mixed gas and method for manufacturing semiconductor device
    1.
    发明授权
    Etching method using mixed gas and method for manufacturing semiconductor device 有权
    使用混合气体的蚀刻方法和制造半导体器件的方法

    公开(公告)号:US09230826B2

    公开(公告)日:2016-01-05

    申请号:US13213130

    申请日:2011-08-19

    摘要: A method for etching is provided in which the etching selectivity of an amorphous semiconductor film to a crystalline semiconductor film is high. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas of a Br-based gas, a F-based gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Reduction in the film thickness of the exposed portion can be suppressed by performing the etching in such a manner. Moreover, when etching for forming a back channel portion of a thin film transistor is performed with the method for etching, favorable electric characteristics of the thin film transistor can be obtained. An insulating layer is preferably provided over the thin film transistor.

    摘要翻译: 提供了一种用于蚀刻的方法,其中非晶半导体膜对结晶半导体膜的蚀刻选择性高。 使用Br基气体,F系气体和氧气的混合气体蚀刻在结晶半导体膜上设置非晶半导体膜的层叠半导体膜的一部分,使部分结晶半导体 提供在堆叠的半导体膜中的膜被暴露。 可以通过以这种方式进行蚀刻来抑制曝光部分的膜厚度的降低。 此外,当利用蚀刻方法进行用于形成薄膜晶体管的背沟道部分的蚀刻时,可以获得薄膜晶体管的良好的电特性。 绝缘层优选设置在薄膜晶体管的上方。

    Etching method and method for manufacturing semiconductor device
    2.
    发明授权
    Etching method and method for manufacturing semiconductor device 有权
    蚀刻方法及制造半导体器件的方法

    公开(公告)号:US08476122B2

    公开(公告)日:2013-07-02

    申请号:US13273267

    申请日:2011-10-14

    IPC分类号: H01L21/00

    摘要: A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF4 gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Etching for forming a back channel portion of a thin film transistor is performed with the method for etching, whereby high electric characteristics can be provided for the thin film transistor.

    摘要翻译: 提供一种制造具有高电特性的半导体器件的方法。 使用包含HBr气体,CF4气体和氧气的混合气体蚀刻在结晶半导体膜上设置非晶半导体膜的层叠半导体膜的一部分,使得设置在晶体半导体膜中的部分结晶半导体膜 堆叠的半导体膜被暴露。 通过蚀刻方法进行用于形成薄膜晶体管的背沟道部分的蚀刻,由此可以为薄膜晶体管提供高电特性。

    Semiconductor device and method for manufacturing the same
    3.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09093539B2

    公开(公告)日:2015-07-28

    申请号:US13466664

    申请日:2012-05-08

    摘要: To establish a processing technique in manufacture of a semiconductor device including an In—Sn—Zn—O-based semiconductor. An In—Sn—Zn—O-based semiconductor layer is selectively etched by dry etching with the use of a gas containing chlorine such as Cl2, BCl3, SiCl4, or the like. In formation of a source electrode layer and a drain electrode layer, a conductive layer on and in contact with the In—Sn—Zn—O-based semiconductor layer can be selectively etched with little removal of the In—Sn—Zn—O-based semiconductor layer with the use of a gas containing oxygen or fluorine in addition to a gas containing chlorine.

    摘要翻译: 为了建立包括In-Sn-Zn-O类半导体的半导体器件的制造中的加工技术。 通过使用含氯气体如Cl 2,BCl 3,SiCl 4等的干蚀刻来选择性地蚀刻In-Sn-Zn-O系半导体层。 在形成源极电极层和漏电极层时,可以选择性地蚀刻与In-Sn-Zn-O系半导体层接触的导电层,同时很少去除In-Sn-Zn-O系半导体层, 除了含有氯的气体之外,还使用含有氧或氟的气体。

    Semiconductor device including channel formation region including oxide semiconductor
    4.
    发明授权
    Semiconductor device including channel formation region including oxide semiconductor 有权
    包括包括氧化物半导体的沟道形成区域的半导体器件

    公开(公告)号:US08901554B2

    公开(公告)日:2014-12-02

    申请号:US13484742

    申请日:2012-05-31

    摘要: A first insulating film in contact with an oxide semiconductor film and a second insulating film are stacked in this order over an electrode film of a transistor including the oxide semiconductor film, an etching mask is formed over the second insulating film, an opening portion exposing the electrode film is formed by etching a portion of the first insulating film and a portion of the second insulating film, the opening portion exposing the electrode film is exposed to argon plasma, the etching mask is removed, and a conductive film is formed in the opening portion exposing the electrode film. The first insulating film is an insulating film whose oxygen is partly released by heating. The second insulating film is less easily etched than the first insulating film and has a lower gas-permeability than the first insulating film.

    摘要翻译: 与氧化物半导体膜和第二绝缘膜接触的第一绝缘膜依次层叠在包含氧化物半导体膜的晶体管的电极膜上,在第二绝缘膜上形成蚀刻掩模, 通过蚀刻第一绝缘膜的一部分和第二绝缘膜的一部分形成电极膜,将暴露于电极膜的开口部暴露于氩等离子体中,除去蚀刻掩模,并且在开口中形成导电膜 部分暴露电极膜。 第一绝缘膜是其氧气通过加热部分释放的绝缘膜。 第二绝缘膜比第一绝缘膜不易蚀刻,并且具有比第一绝缘膜更低的透气性。

    ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    5.
    发明申请
    ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的蚀刻方法和方法

    公开(公告)号:US20120094445A1

    公开(公告)日:2012-04-19

    申请号:US13273267

    申请日:2011-10-14

    摘要: A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF4 gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Etching for forming a back channel portion of a thin film transistor is performed with the method for etching, whereby high electric characteristics can be provided for the thin film transistor.

    摘要翻译: 提供一种制造具有高电特性的半导体器件的方法。 使用包含HBr气体,CF4气体和氧气的混合气体蚀刻在结晶半导体膜上设置非晶半导体膜的层叠半导体膜的一部分,使得设置在晶体半导体膜中的部分结晶半导体膜 堆叠的半导体膜被暴露。 通过蚀刻方法进行用于形成薄膜晶体管的背沟道部分的蚀刻,由此可以为薄膜晶体管提供高电特性。

    Photographing apparatus and microscope system
    6.
    发明授权
    Photographing apparatus and microscope system 有权
    摄影仪器和显微镜系统

    公开(公告)号:US08305434B2

    公开(公告)日:2012-11-06

    申请号:US12771256

    申请日:2010-04-30

    摘要: A photographing control unit comprising a drive signal generator, an analog front end, a synchronization signal generation unit, and a system control unit controls an imager under a predetermined photographing condition, so that the imager photographs an observation image of a sample observed by a microscope and formed on a light receiving surface of the imager. A computing unit obtains inputs of a plurality of photographing parameters, determines a photographing condition based on the obtained photographing parameters, and sets the photographing condition for the photographing control unit. A display unit displays the designable ranges of the photographing parameters. Here, when the computing unit obtains the input of a priority parameter, it changes the designable range of the plurality of photographing parameters other than the priority parameter based on the priority parameter and causes the display unit to display the designable range after the change.

    摘要翻译: 包括驱动信号发生器,模拟前端,同步信号产生单元和系统控制单元的拍摄控制单元在预定拍摄条件下控制成像器,使得成像器拍摄由显微镜观察到的样本的观察图像 并形成在成像器的光接收表面上。 计算单元获得多个拍摄参数的输入,基于所获得的拍摄参数确定拍摄条件,并设置拍摄控制单元的拍摄条件。 显示单元显示拍摄参数的可设定范围。 这里,当计算单元获得优先级参数的输入时,基于优先级参数改变除了优先级参数之外的多个拍摄参数的可设定范围,并使显示单元在改变之后显示可设置范围。

    Microscopic imaging apparatus and microscopic imaging method
    7.
    发明授权
    Microscopic imaging apparatus and microscopic imaging method 有权
    显微成像设备和显微镜成像方法

    公开(公告)号:US08179433B2

    公开(公告)日:2012-05-15

    申请号:US12332534

    申请日:2008-12-11

    申请人: Hiroshi Fujiki

    发明人: Hiroshi Fujiki

    IPC分类号: H04N5/04 H04N5/335

    摘要: The microscopic imaging apparatus includes a system controlling unit for obtaining a VD time setting value, and for obtaining the number of electric charge subtracting pulses, a synchronization signal generating unit for generating a vertical synchronization signal on the basis of the VD time setting value output from the system controlling unit and the horizontal synchronization signal, and a timing generating unit for extracting the electric charge of the imaging device by supplying the horizontal synchronization signal by the number of electric charge subtracting pulses to the imaging device as the electric charge subtracting pulses, and for generating a read pulse synchronous with the vertical synchronization signal in order to stop the accumulation of the electric charge of the imaging device after exposure is started.

    摘要翻译: 微型成像装置包括用于获得VD时间设定值并用于获得电荷减去脉冲数的系统控制单元,用于根据从...输出的VD时间设定值产生垂直同步信号的同步信号产生单元 系统控制单元和水平同步信号;以及定时生成单元,用于通过将水平同步信号提供给成像装置的电荷减去脉冲数来提取成像装置的电荷作为电荷减去脉冲,以及 用于产生与垂直同步信号同步的读取脉冲,以便在曝光开始之后停止成像装置的电荷的累积。

    Cylindrical steam reforming unit
    8.
    发明授权
    Cylindrical steam reforming unit 有权
    圆柱蒸汽重整单元

    公开(公告)号:US07182921B2

    公开(公告)日:2007-02-27

    申请号:US10477663

    申请日:2002-06-03

    摘要: A cylindrical steam reforming unit contains a plurality of cylindrical bodies consisting of a first cylindrical body, a second cylindrical body and a third cylindrical body of successively increasing diameters disposed in concentric spaced relationship, a radiation cylinder disposed within and concentrically with the first cylindrical body, a burner disposed in the radial central portion of the radiation cylinder, and a reforming catalyst layer with a reforming catalyst filled in a gap between the first and second cylindrical bodies, wherein a CO shift catalyst layer and a CO removal catalyst layer are disposed in a gap between the second and third cylindrical bodies, the CO shift catalyst layer being formed in a gap with the direction of flow reversing at one axial end of the reforming catalyst layer and through a heat recovery layer of predetermined length. According to this reforming unit, without internally disposing a heat insulation layer, a cooling mechanism or the like, the reforming catalyst layer, CO shift catalyst layer, and CO removal catalyst layer can be integrated, achieving various useful effects, including size and weight reductions and the shortening of startup time.

    摘要翻译: 圆柱形蒸汽重整单元包括多个圆柱体,其包括第一圆筒体,第二圆柱体和以同心间隔开设置的连续增加直径的第三圆柱体,设置在第一圆柱体内并与其同心的辐射圆筒, 设置在辐射筒的径向中心部分中的燃烧器,以及填充在第一和第二圆筒体之间的间隙中的重整催化剂的重整催化剂层,其中CO转移催化剂层和CO去除催化剂层设置在 在第二和第三圆柱体之间的间隙,CO变换催化剂层与在重整催化剂层的一个轴向端部处的流动反向的空间方向形成并且通​​过预定长度的热回收层形成。 根据该重整单元,在内部不设置绝热层,冷却机构等的情况下,可以一体化重整催化剂层,CO变换催化剂层和CO除去催化剂层,实现各种有用效果,包括尺寸和重量减少 并缩短启动时间。