摘要:
In a signal processing device which performs data compression, a thinning circuit 1 generates thinned data by thinning input PCM data. For example, when a sampling rate fs of the PCM data (original data) is fs=10 Hz, thinned data of fs=1 Hz is generated. The determination circuit 2 controls the selection circuit 4 so that, based on the following expression: TOTAL1=|X(n)−X(n−1)|+|X(n−1)−X(n−2)|+ . . . +|X(n−8)−X(n−9)| if TOTAL1>C1, the input PCM data is selected, and if otherwise the thinned data is selected. The selected data and the determination result information of the determination circuit 2 are written into a memory 3. Therefore, data compression is performed with respect to original data with a simple circuit configuration and without losing required information of the original data.
摘要:
A large chip includes a first set of branch wires that branch off from a first trunk wire and extend to respective wires so as to be connected to respective bond pads. Each of the branch wires of the first set includes a connection control element and a resistor. A small chip includes a second set of branch wires that branch off from a second trunk wire and extend to respective wires so as to be connected to respective bond pads. Each of the branch wires of the second set includes a connection control element and a resistor. Whether connection is properly made or not between the bond pads is determined by measuring a current value when voltage is applied to first and second test pads.
摘要:
In a reference voltage generation circuit, a bandgap reference circuit (BGR circuit) 1 includes diode element D1 and D2 having different current densities, three resistive elements R1, R2 and R3, a P-type first transistor Tr1 for supplying a current to a reference voltage output terminal O, a P-type second transistor Tr2 for determining a drain current flowing through the first transistor Tr1 by a current mirror structure, and a feedback type control circuit 11. The BGR circuit 1 is connected to a pull-down circuit 2. The pull-down circuit 2 includes a resistive element R4 and a P-type transistor Tr4 which are connected in series. The resistive element R4 is connected to a drain terminal of the second P-type transistor Tr2. The P-type transistor Tr4 has a gate terminal connected to the reference voltage output terminal O and a grounded drain terminal. Thus, the number of elements and current consumption in the start-up circuit which shifts the operation from an abnormal stabilization point to a normal stabilization point are reduced.
摘要:
In a semiconductor integrated circuit of the present invention, the main circuit 2 includes MOS transistors in which the source and the substrate are separated from each other. The substrate potential control circuit 1 controls the substrate potential of the MOS transistors of the main circuit 2 so that the actual saturation current value of the MOS transistors of the main circuit 2 is equal to the target saturation current value Ids under the operating power supply voltage Vdd of the main circuit 2. Therefore, it is possible to suppress variations in the operation speed even if the operating power supply voltage of the semiconductor integrated circuit is reduced.
摘要:
A current mirror circuit 10 is formed to have a current ratio (a transistor size ratio) of 1:m. As well, respective pairs of nMOS transistors MN1, MN3 and nMOS transistors MN2, MN4 are formed to have a current ratio of 1:m. Two currents output from the current mirror circuit 10 are each distributed to two. The distributed currents flowing in the nMOS transistors MN2, MN4 are added and are then allowed to flow into one resistor R2. Hence, for the resistor R2, only one resistor in which current of double flows suffices when m=1, for example. This effortlessly reduces the necessary resistance to one fourth.
摘要:
In a reference voltage generation circuit, a bandgap reference circuit (BGR circuit) 1 includes diode element D1 and D2 having different current densities, three resistive elements R1, R2 and R3, a P-type first transistor Tr1 for supplying a current to a reference voltage output terminal O, a P-type second transistor Tr2 for determining a drain current flowing through the first transistor Tr1 by a current mirror structure, and a feedback type control circuit 11. The BGR circuit 1 is connected to a pull-down circuit 2. The pull-down circuit 2 includes a resistive element R4 and a P-type transistor Tr4 which are connected in series. The resistive element R4 is connected to a drain terminal of the second P-type transistor Tr2. The P-type transistor Tr4 has a gate terminal connected to the reference voltage output terminal O and a grounded drain terminal. Thus, the number of elements and current consumption in the start-up circuit which shifts the operation from an abnormal stabilization point to a normal stabilization point are reduced.
摘要:
A multi-chip module is implemented by connecting a plurality of connection pads provided on, for example, two semiconductor chips via a plurality of conductive connecting members. To carry out a test for determining the quality of the connection between the two semiconductor chips, the multi-chip module is further provided with a plurality of switch elements so that the plurality of connecting members can be electrically conducted in a serial manner via the connection pads of the semiconductor chips. During the connection test, all the switch elements are turned on, and the impedance between both ends of the line including the plurality of connecting members conducted in a serial manner is measured using two probing pads.
摘要:
In a switching regulator, switching noise is reduced with keeping high conversion efficiency. The switching regulator includes plural output switching transistors 21 through 23 having different on-resistances, which are operated nadescending order of on-resistance in the on operation and are operated in an ascending order of on-resistance in the off operation. In this manner, abrupt current change can be suppressed in the switching operation, resulting in reducing di/dt noise derived from a parasitic inductor 102.
摘要:
The switching regulator of a synchronous rectifying mode comprises the first and second switches SW1, SW2 arranged in series between the power source Vdd and the ground Vss, the switch control unit 1 which controls the on-off operation of the switches SW1, SW2, and the smoothing circuit 4 which smoothes the output node potential Vnd. When the signal Sc1 indicates that the output node potential Vnd goes below the first reference potential Vr1 which is the reference to detect the occurrence of the inrush current while the first switch SW1 is in the ON state, the control circuit 10 turns off the first switch SW1. Thus, the detection of the inrush current is conducted by making use of a voltage drop due to the on resistance of the first switch SW1, so that it is unnecessary to provide a resistance element for detecting the inrush current.
摘要:
In a semiconductor integrated circuit, respective semiconductor circuits are disposed in different regions partitioned in accordance with their operation probabilities per unit time, and a supply voltage and a threshold voltage are correlatively controlled in each region. A target value for controlling the threshold voltage is determined in accordance with the operation probability of the semiconductor circuit. A threshold voltage control circuit controls substrate voltages of p-type and n-type MOS transistors included in the semiconductor circuit so that the threshold voltage can be constant at the target value regardless of the temperature change occurring in use. Simultaneously, a supply voltage control circuit controls the supply voltage for the semiconductor circuit so that an objective operating frequency can be attained. As a result, a semiconductor integrated circuit with low power consumption can be obtained.