SWITCHING DEVICE AND NONVOLATILE MEMORY DEVICE
    4.
    发明申请
    SWITCHING DEVICE AND NONVOLATILE MEMORY DEVICE 有权
    开关器件和非易失性存储器件

    公开(公告)号:US20100213435A1

    公开(公告)日:2010-08-26

    申请号:US12710942

    申请日:2010-02-23

    IPC分类号: H01L29/66 H01L29/78

    摘要: A switching device includes: a first layer including a carbon material having a six-member ring network structure; a first electrode electrically connected to a first portion of the first layer; a second electrode electrically connected to a second portion of the first layer and provided apart from the first electrode; a third electrode including a fourth portion provided opposing a third portion between the first portion and the second portion of the first layer; and a second layer provided between the third portion of the first layer and the fourth portion of the third electrode. The second layer includes: a base portion; and a functional group portion. The functional group portion is provided between the base portion and the first layer. The functional group portion is bonded to the base portion. A ratio of sp2-bonded carbon and sp3-bonded carbon of the first layer is changeable by a voltage applied between the first layer and the third electrode.

    摘要翻译: 开关装置包括:第一层,包括具有六元环网结构的碳材料; 电连接到第一层的第一部分的第一电极; 电连接到第一层的第二部分并且与第一电极分开设置的第二电极; 第三电极,包括与所述第一层的第一部分和第二部分之间的第三部分相对设置的第四部分; 以及设置在第一层的第三部分和第三电极的第四部分之间的第二层。 第二层包括:基部; 和官能团部分。 功能组部分设置在基部和第一层之间。 官能团部分结合到基部。 第一层的sp2键合碳和sp3键合碳的比例可以通过施加在第一层和第三电极之间的电压而改变。

    Switching device and nonvolatile memory device
    5.
    发明授权
    Switching device and nonvolatile memory device 有权
    开关器件和非易失性存储器件

    公开(公告)号:US08278644B2

    公开(公告)日:2012-10-02

    申请号:US12710942

    申请日:2010-02-23

    IPC分类号: H01L29/06

    摘要: A switching device includes: a first layer including a carbon material having a six-member ring network structure; a first electrode electrically connected to a first portion of the first layer; a second electrode electrically connected to a second portion of the first layer and provided apart from the first electrode; a third electrode including a fourth portion provided opposing a third portion between the first portion and the second portion of the first layer; and a second layer provided between the third portion of the first layer and the fourth portion of the third electrode. The second layer includes: a base portion; and a functional group portion. The functional group portion is provided between the base portion and the first layer. The functional group portion is bonded to the base portion. A ratio of sp2-bonded carbon and sp3-bonded carbon of the first layer is changeable by a voltage applied between the first layer and the third electrode.

    摘要翻译: 开关装置包括:第一层,包括具有六元环网结构的碳材料; 电连接到第一层的第一部分的第一电极; 电连接到第一层的第二部分并且与第一电极分开设置的第二电极; 第三电极,包括与所述第一层的第一部分和第二部分之间的第三部分相对设置的第四部分; 以及设置在第一层的第三部分和第三电极的第四部分之间的第二层。 第二层包括:基部; 和官能团部分。 功能组部分设置在基部和第一层之间。 官能团部分结合到基部。 第一层的sp2键合碳和sp3键合碳的比例可以通过施加在第一层和第三电极之间的电压而改变。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20130015519A1

    公开(公告)日:2013-01-17

    申请号:US13622612

    申请日:2012-09-19

    IPC分类号: H01L29/792 H01L21/28

    摘要: According to one embodiment, a nonvolatile semiconductor memory device includes first to n-th semiconductor layers which are stacked in a first direction perpendicular to a surface of a semiconductor substrate and which extend in a second direction parallel to the surface of the semiconductor substrate, an electrode which extends in the first direction along side surfaces of the first to n-th semiconductor layers, the side surfaces of the first to n-th semiconductor layers exposing in a third direction perpendicular to the first and second directions, and first to n-th charge storage layers located between the first to n-th semiconductor layers and the electrode respectively. The first to n-th charge storage layers are separated from each other in areas between the first to n-th semiconductor layers.

    摘要翻译: 根据一个实施例,非易失性半导体存储器件包括第一至第n半导体层,它们沿垂直于半导体衬底的表面的第一方向堆叠并且沿与半导体衬底的表面平行的第二方向延伸, 电极,其沿第一方向沿着第一至第n半导体层的侧表面延伸,第一至第n半导体层的侧表面在垂直于第一和第二方向的第三方向上暴露,以及第一至第n- 分别位于第一至第n半导体层之间的电荷存储层和电极。 第一至第n电荷存储层在第一至第n半导体层之间的区域中彼此分离。