公开(公告)号：US20130206589A1

公开(公告)日：2013-08-15

申请号：US13372579

申请日：2012-02-14

申请人： Shu-Hua Hu ,  Ming-Chang Lu ,  Pai-Ying Su ,  Jung-Sheng Chen ,  Hsin-Chun Yin

发明人： Shu-Hua Hu ,  Ming-Chang Lu ,  Pai-Ying Su ,  Jung-Sheng Chen ,  Hsin-Chun Yin

IPC分类号： C23C14/54 ,  C23C14/34

CPC分类号： C23C14/3407 ,  C23C14/54

摘要： The present invention provides a sputtering target having alarm function. The sputtering target comprises: a target body including a target material and having a bonding plane; a backing body bonded with the bonding plane of the target body; and at least one alarm body embedded in the target body. Wherein, a length of each alarm body, ratios of an area of each alarm body and the sum of area(s) of the at least one alarm body projected onto the bonding plane relative to an area of the bonding plane are controlled in a suitable range. Thus, the bonding strength and the heat-removing efficiency of the sputtering target can be maintained, and the distinguishable material of the alarm body can evolve a gas component distinguishable from a sputtering environment serving as an alarm signal for stopping the sputtering process in time.

摘要翻译： 本发明提供具有报警功能的溅射靶。 溅射靶包括：包括目标材料并具有接合平面的靶体; 与目标体的接合面接合的背衬体; 以及至少一个嵌入目标体内的报警体。 其中，每个报警主体的长度，每个报警主体的面积的比率和投影到接合平面上相对于接合平面的区域的至少一个报警体的面积之和被控制在合适的 范围。 因此，可以保持溅射靶的接合强度和除热效率，并且报警体的可区分材料可以放出与作为用于在时间上停止溅射处理的报警信号的溅射环境可区分的气体成分。

公开(公告)号：US07262078B2

公开(公告)日：2007-08-28

申请号：US10906972

申请日：2005-03-15

申请人： Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

发明人： Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

IPC分类号： H01L21/44

CPC分类号： B81C1/00365 ,  B81C2201/0132 ,  B81C2201/018 ,  H01L23/3192 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.

摘要翻译： 提供基板。 衬底包括设置在衬底中的多个器件，设置在衬底的表面上并电连接到器件的多个接触焊盘以及位于衬底表面上的表面电介质层。 此后，进行至少包括等离子体蚀刻工艺的表面处理工艺。 随后，至少进行等离子体增强化学气相沉积（PECVD）工艺以在表面电介质层上形成电介质层。 以高频/低频交替方式执行PECVD处理。 接着，形成电介质层上的掩模图案，进行各向异性蚀刻处理，以形成对应于电介质层中的接触焊盘的多个开口。 这些开口暴露接触垫，并且每个开口具有向外倾斜的侧壁。

公开(公告)号：US20090126244A1

公开(公告)日：2009-05-21

申请号：US12113949

申请日：2008-05-02

申请人： Chung-Ming Hu ,  Shu-Hua Hu ,  Yi-Chuan Teng

发明人： Chung-Ming Hu ,  Shu-Hua Hu ,  Yi-Chuan Teng

IPC分类号： G09F15/00

CPC分类号： H04N9/12 ,  G06F1/1601

摘要： Disclosed is a planar display assembled and supported through components by making use of adhesive, mainly comprising: a transparent protection board, a display element, and an adhesive. Wherein, said display element is used as a photoelectric element (for example, an LC panel or a backlight module) forming a display. Said display elements can be glued and attached onto said transparent protection board by means of said adhesive such as Velcro, so as to reduce ordinary support elements utilized, thus significantly reducing the volume and weight of said planar display.

摘要翻译： 公开了通过使用粘合剂组装和支撑通过部件的平面显示器，主要包括：透明保护板，显示元件和粘合剂。 其中，所述显示元件用作形成显示器的光电元件（例如，LC面板或背光模块）。 所述显示元件可以通过诸如魔术贴之类的粘合剂粘合并附着到所述透明保护板上，以便减少所使用的普通支撑元件，从而显着地减小了所述平面显示器的体积和重量。

公开(公告)号：US20060186523A1

公开(公告)日：2006-08-24

申请号：US10907653

申请日：2005-04-11

申请人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

发明人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L2224/05555 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.

摘要翻译： 芯片型微型连接器包括封装基板，设置在封装结构上的微型连接器，多个芯片以及设置在微型连接器和芯片上的盖层。 微连接器包括连接基板，设置在连接基板中的多个连接线，以及暴露在连接基板的表面上并分别连接到每个连接线的多个接触焊盘。 芯片通过接触焊盘和连接线相互耦合。 盖层将微型连接器和芯片封装在封装衬底上。

公开(公告)号：US20060183259A1

公开(公告)日：2006-08-17

申请号：US10906972

申请日：2005-03-15

申请人： Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

发明人： Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

IPC分类号： H01L21/00

CPC分类号： B81C1/00365 ,  B81C2201/0132 ,  B81C2201/018 ,  H01L23/3192 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.

摘要翻译： 提供基板。 衬底包括设置在衬底中的多个器件，设置在衬底的表面上并电连接到器件的多个接触焊盘以及位于衬底表面上的表面电介质层。 此后，进行至少包括等离子体蚀刻工艺的表面处理工艺。 随后，至少进行等离子体增强化学气相沉积（PECVD）工艺以在表面电介质层上形成电介质层。 以高频/低频交替方式执行PECVD处理。 接着，形成电介质层上的掩模图案，进行各向异性蚀刻处理，以形成对应于电介质层中的接触焊盘的多个开口。 这些开口暴露接触垫，并且每个开口具有向外倾斜的侧壁。

公开(公告)号：US20060263934A1

公开(公告)日：2006-11-23

申请号：US11461458

申请日：2006-08-01

申请人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

发明人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L2224/05555 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.

公开(公告)号：US20060183312A1

公开(公告)日：2006-08-17

申请号：US10906977

申请日：2005-03-15

申请人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Shih-Min Huang

发明人： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Shih-Min Huang

IPC分类号： H01L21/44 ,  H01L21/20

CPC分类号： H01L21/02118 ,  H01L21/02362 ,  H01L21/312 ,  H01L21/76804 ,  H01L23/5227 ,  H01L23/5283 ,  H01L23/53238 ,  H01L23/53252 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/19042 ,  H01L2924/00014

摘要： A substrate including a plurality of contact pads is provided. Thereafter, a photosensitive dielectric layer is formed on a surface of the substrate. Subsequently, an exposure-and-development process is preformed to partially remove the photosensitive dielectric layer so as to form a plurality of openings. The openings at least expose the contact pads, and the sidewall of each opening is inclined outwardly.

摘要翻译： 提供了包括多个接触焊盘的衬底。 此后，在基板的表面上形成感光介电层。 随后，进行曝光和显影处理以部分地去除光敏介电层以形成多个开口。 开口至少暴露接触垫，并且每个开口的侧壁向外倾斜。