公开(公告)号：US20090053852A1

公开(公告)日：2009-02-26

申请号：US12192225

申请日：2008-08-15

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

IPC分类号： H05K3/30 ,  H05K13/04

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2924/00

摘要： A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component.

摘要翻译： 提供了一种用于电子设备和制造设备的制造方法。 制造方法包括向片材的表面施加要填充到安装板和安装在安装板上的电子部件之间的空间中的粘合剂，使片材的一个表面与电子部件的背面接触 安装在安装板上，并通过使粘合剂在低压下与电子部件的周边部分接触来将粘合剂装入空间，并将加热头压在片材的另一个表面上并加热片材 在片材与电子部件接触的状态下，经由片材头部，以在大气压下设置粘合剂。

公开(公告)号：US07982295B2

公开(公告)日：2011-07-19

申请号：US12559234

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02

CPC分类号： H01L23/24 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且包括作为内部结构的同心环。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US20090146652A1

公开(公告)日：2009-06-11

申请号：US12292650

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20060030076A1

公开(公告)日：2006-02-09

申请号：US11246267

申请日：2005-10-11

申请人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

IPC分类号： H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.

摘要翻译： 本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。 半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。 每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

公开(公告)号：US20100001387A1

公开(公告)日：2010-01-07

申请号：US12559219

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/16 ,  G06K19/077 ,  G06K19/07728 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16

摘要： An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。 该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。 层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US20090146653A1

公开(公告)日：2009-06-11

申请号：US12292651

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

公开(公告)号：US20050001014A1

公开(公告)日：2005-01-06

申请号：US10816915

申请日：2004-04-05

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

IPC分类号： B23K1/00 ,  B23K1/06 ,  B23K1/20 ,  B23K3/06 ,  H01L21/56 ,  H01L21/60 ,  H01L21/607 ,  H05K3/32 ,  H05K3/34 ,  B23K20/10 ,  B23K31/02

CPC分类号： H01L21/563 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/203 ,  B23K3/0607 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/328 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2224/05599

摘要： The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.

摘要翻译： 安装电子部件的方法能够牢固地安装具有细焊锡凸块的电子部件，而不会过度加热该部件。 所述方法包括以下步骤：在其中形成电极的安装板的表面上施加用作助熔剂和未充填树脂的焊剂填充物; 分别将电子部件的焊料焊接与电极连接; 并且同时用助焊剂填充电子部件和安装板之间的间隙，其中焊料凸块与电极接触，并且在连接步骤中将超声波振动能量施加到焊料凸块和电极的接触部分 。

公开(公告)号：US20100001388A1

公开(公告)日：2010-01-07

申请号：US12559234

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/24 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且包括作为内部结构的同心环。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US20100001081A1

公开(公告)日：2010-01-07

申请号：US12559202

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： G06K19/07 ,  H05K3/30

CPC分类号： G06K19/07749 ,  G06K19/027 ,  G06K19/07728 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16 ,  Y10T29/49146

摘要： An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 电连接到所述导体图形的电路芯片; 以及加强构件，其设置在所述基座上以围绕所述电路芯片的外形为环状，并且具有这样的内部结构，使得沿所述基座的厚度方向延伸的多个列分散在预定基板中 。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07471081B2

公开(公告)日：2008-12-30

申请号：US11326598

申请日：2006-01-06

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。