公开(公告)号：US20050272608A1

公开(公告)日：2005-12-08

申请号：US11141059

申请日：2005-06-01

申请人： Shuichi Yokozawa ,  Koji Hirota ,  Naoki Nakazawa

发明人： Shuichi Yokozawa ,  Koji Hirota ,  Naoki Nakazawa

IPC分类号： G11B5/48 ,  H01B1/00 ,  H05K1/05 ,  H05K3/38

CPC分类号： G11B5/484 ,  G11B5/4826 ,  G11B5/4833 ,  H05K1/056 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317

摘要： A polyimide metal laminate comprising a stainless steel layer/a resin layer/a thermoplastic polyimide resin layer/a metal thin film layer, wherein a thickness of the metal layer is in the range of 0.001 to 1.0 μm, a method for producing the same and a hard disk suspension comprising these polyimide metal laminate are provided. The hard disk suspension can be capable of fine pitch processing such that wiring pitch is not more than 50 μm.

摘要翻译： 包含不锈钢层/树脂层/热塑性聚酰亚胺树脂层/金属薄膜层的聚酰亚胺金属层压体，其中金属层的厚度在0.001〜1.0μm的范围内，其制造方法和 提供了包含这些聚酰亚胺金属层压体的硬盘悬浮液。 硬盘悬挂能够进行细间距处理，使得布线间距不大于50μm。

公开(公告)号：US20090035541A1

公开(公告)日：2009-02-05

申请号：US11918730

申请日：2006-04-14

申请人： Shuichi Yokozawa ,  Koji Hirota ,  Shuji Tahara

发明人： Shuichi Yokozawa ,  Koji Hirota ,  Shuji Tahara

IPC分类号： B32B3/00 ,  H01B13/10

CPC分类号： C23C28/00 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/281 ,  B32B2307/202 ,  B32B2457/08 ,  H05K1/056 ,  H05K3/383 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T428/24917

摘要： The present invention relates to a polyimide metal laminate which is a metal laminate comprising a stainless steel layer/a conductor layer/a polyimide resin layer/a metal layer, wherein the conductor layer is interposed between the stainless steel layer and the polyimide resin layer as a ground, and having a strong adhesion between the conductor layer and the polyimide resin layer, thus being able to be processed and used as a hard disk suspension. Specifically, the metal laminate of the present invention is characterized in that a surface of the conductor layer in contact with the polyimide resin layer is not smooth (preferably its 10-point average surface roughness is 0.5 μm or more).

摘要翻译： 本发明涉及一种聚酰亚胺金属层压体，其是包含不锈钢层/导体层/聚酰亚胺树脂层/金属层的金属层压体，其中导体层介于不锈钢层和聚酰亚胺树脂层之间作为 接地，并且在导体层和聚酰亚胺树脂层之间具有很强的粘附性，因此能够被处理并用作硬盘悬浮液。 具体地说，本发明的金属层叠体的特征在于，与聚酰亚胺树脂层接触的导体层的表面不光滑（优选其10点平均表面粗糙度为0.5μm以上）。

公开(公告)号：US20050087509A1

公开(公告)日：2005-04-28

申请号：US10500846

申请日：2003-07-28

申请人： Koji Hirota ,  Masano Kobayashi ,  Minehiro Mori ,  Naoki Nakazawa

发明人： Koji Hirota ,  Masano Kobayashi ,  Minehiro Mori ,  Naoki Nakazawa

IPC分类号： G11B5/48 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/38 ,  H01B13/00

CPC分类号： H05K3/002 ,  G11B5/4833 ,  H05K1/0346 ,  H05K1/056 ,  H05K3/0041 ,  H05K3/385 ,  H05K2201/0154 ,  H05K2203/0315 ,  H05K2203/163 ,  Y10T428/12951 ,  Y10T428/265 ,  Y10T428/31681

摘要： The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 Å to less than 50 Å. According to the present invention, an etching time of polyimide in the polyimide metal laminate can be calculated and a flexure used for a suspension for a hard disc drive having a high productivity can be provided.

摘要翻译： 本发明涉及广泛用于柔性布线板等的金属层压体及其蚀刻方法。 特别地，本发明涉及一种金属层压体，其包括通过层压金属层和绝缘层而获得的层，其中绝缘层进行蚀刻处理，其中在该金属层的表面上 为了与绝缘层接触，根据AES（俄歇电子学（俄歇电子学），从金属层的表面到金属层的内部）以时间流逝的方式测量构成金属层的主要金属元素和氧元素的各自浓度 光谱），并且在构成金属层的主金属元素和氧元素的原子浓度变得相等的时刻测量的金属层的表面的金属氧化物膜的厚度的值在 至少从0到小于50。 根据本发明，可以计算聚酰亚胺金属层叠体中的聚酰亚胺的蚀刻时间，并且可以提供用于具有高生产率的硬盘驱动器的悬架的挠曲。

公开(公告)号：US07223480B2

公开(公告)日：2007-05-29

申请号：US10500846

申请日：2003-07-28

申请人： Koji Hirota ,  Masanao Kobayashi ,  Minehiro Mori ,  Naoki Nakazawa

发明人： Koji Hirota ,  Masanao Kobayashi ,  Minehiro Mori ,  Naoki Nakazawa

IPC分类号： B32B15/08 ,  B32B15/18 ,  G11B5/00 ,  G11B21/00 ,  H01B13/00

CPC分类号： H05K3/002 ,  G11B5/4833 ,  H05K1/0346 ,  H05K1/056 ,  H05K3/0041 ,  H05K3/385 ,  H05K2201/0154 ,  H05K2203/0315 ,  H05K2203/163 ,  Y10T428/12951 ,  Y10T428/265 ,  Y10T428/31681

摘要： The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 Å to less than 50 Å.According to the present invention, an etching time of polyimide in the polyimide metal laminate can be calculated and a flexure used for a suspension for a hard disc drive having a high productivity can be provided.

摘要翻译： 本发明涉及广泛用于柔性布线板等的金属层压体及其蚀刻方法。 特别地，本发明涉及一种金属层压体，其包括通过层压金属层和绝缘层而获得的层，其中绝缘层进行蚀刻处理，其中在该金属层的表面上 为了与绝缘层接触，根据AES（俄歇电子学（俄歇电子学），从金属层的表面到金属层的内部）以时间流逝的方式测量构成金属层的主要金属元素和氧元素的各自浓度 光谱），并且在构成金属层的主金属元素和氧元素的原子浓度变得相等的时刻测量的金属层的表面的金属氧化物膜的厚度的值在 至少从0到小于50。 根据本发明，可以计算聚酰亚胺金属层叠体中的聚酰亚胺的蚀刻时间，并且可以提供用于具有高生产率的硬盘驱动器的悬架的挠曲。

公开(公告)号：US20060127685A1

公开(公告)日：2006-06-15

申请号：US10544185

申请日：2004-02-09

申请人： Koji Hirota ,  Naoki Nakazawa ,  Youichi Kodama

发明人： Koji Hirota ,  Naoki Nakazawa ,  Youichi Kodama

IPC分类号： B32B15/08

CPC分类号： B32B27/281 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B2250/03 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/584 ,  B32B2307/734 ,  B32B2457/00 ,  G11B5/4833 ,  H05K1/056 ,  H05K3/002 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide metal laminate comprising a polyimide resin formed on a metal foil, wherein the polyimide resin does not cause the peeling of not less than 100 μm in the polyimide resin and/or at an interface between the polyimide resin and the metal foil when the polyimide resin is heated in an oven at an atmospheric temperature of from 340 to 360° C. for 5 to 10 minutes, the coefficient of humidity expansion at 320 is from 1 to 20 ppm/% RH, and an average value of the etching rate by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is not less than 1.0 μm/min. The polyimide metal laminate can provide good heat resistance, superior dimensional stability and can be etching processed by an aqueous alkaline solution.

摘要翻译： 一种聚酰亚胺金属层压体，其包含在金属箔上形成的聚酰亚胺树脂，其中，当聚酰亚胺树脂和/或聚酰亚胺树脂与金属箔之间的界面处，聚酰亚胺树脂不会在聚酰亚胺树脂中和/ 树脂在340〜360℃的大气温度的烘箱中加热5〜10分钟，320℃的湿度膨胀系数为1〜20ppm /％RH，蚀刻速度的平均值为 在80℃下氢氧化钾的50重量％水溶液不小于1.0毫姆/分钟。 聚酰亚胺金属层压体可以提供良好的耐热性，优异的尺寸稳定性，并且可以通过碱性水溶液进行蚀刻加工。

公开(公告)号：US20080268266A1

公开(公告)日：2008-10-30

申请号：US11792230

申请日：2005-12-01

申请人： Koji Hirota ,  Naoki Nakazawa

发明人： Koji Hirota ,  Naoki Nakazawa

IPC分类号： B32B15/08

CPC分类号： G11B5/4833 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/20 ,  C08G73/1042 ,  C08G73/1067 ,  H05K1/0346 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/31681

摘要： A polyimide metal laminate including a polyimide resin having a copper foil and a stainless steel foil formed on respective sides of the polyimide resin, or a polyimide resin having two stainless steel foils formed on both sides of the polyimide resin, the polyimide metal laminate having: a peel strength of 1.0 kN/m or more between the polyimide resin and the stainless steel foil or copper foil; a peel strength of 1.0 kN/m or more between the polyimide resin and the stainless steel foil or copper foil after the polyimide metal laminate has been subjected to a heat treatment at 350° C. for 60 minutes; and no expansion or deformation after the polyimide metal laminate has been subjected to the heat treatment at 350° C. for 60 minutes.

摘要翻译： 在聚酰亚胺树脂的两侧形成有具有铜箔的聚酰亚胺树脂和不锈钢箔的聚酰亚胺金属层叠体，或者在聚酰亚胺树脂的两面形成有两根不锈钢箔的聚酰亚胺树脂， 聚酰亚胺树脂与不锈钢箔或铜箔之间的剥离强度为1.0kN / m以上; 在聚酰亚胺金属层压体在350℃下进行热处理60分钟后，聚酰亚胺树脂与不锈钢箔或铜箔之间的剥离强度为1.0kN / m以上。 并且在聚酰亚胺金属层压体在350℃下经受热处理60分钟后没有膨胀或变形。

公开(公告)号：US07321066B2

公开(公告)日：2008-01-22

申请号：US10544764

申请日：2004-01-28

申请人： Hisayuki Kawamura ,  Hiroyuki Matsui ,  Koji Hirota

发明人： Hisayuki Kawamura ,  Hiroyuki Matsui ,  Koji Hirota

IPC分类号： C07C209/00 ,  C07C209/12

CPC分类号： C07C209/62 ,  C07C211/54

摘要： The invention provides a method for efficiently producing an aromatic diamine derivative represented by formula (3) at high yield, the method including reacting an aromatic amide represented by formula (1) with an aromatic halide represented by formula (2): (wherein each of Ar, Ar1 and Ar2 represents a substituted or unsubstituted aryl group or heteroaryl group; Ar3 represents a substituted or unsubstituted arylene group or heteroarylene group; and X represents a halogen atom).

摘要翻译： 本发明提供一种以高收率有效地制备式（3）表示的芳族二胺衍生物的方法，该方法包括使由式（1）表示的芳族酰胺与式（2）表示的芳族卤化物反应： Ar，Ar 1和Ar 2表示取代或未取代的芳基或杂芳基; Ar 3表示取代或未取代的亚芳基或亚杂芳基 基团; X表示卤素原子）。

公开(公告)号：US08522617B2

公开(公告)日：2013-09-03

申请号：US13055415

申请日：2009-07-17

申请人： Kozo Nakamura ,  Isao Onishi ,  Satoru Ohashi ,  Eiichi Minagawa ,  Koji Hirota ,  Ryoichi Sakai ,  Koji Ogawa ,  Koichi Miyasaka ,  Masaru Murashita

发明人： Kozo Nakamura ,  Isao Onishi ,  Satoru Ohashi ,  Eiichi Minagawa ,  Koji Hirota ,  Ryoichi Sakai ,  Koji Ogawa ,  Koichi Miyasaka ,  Masaru Murashita

IPC分类号： G01N29/00

CPC分类号： A61B8/4209 ,  A61B8/0858 ,  A61B8/4281

摘要： An acoustic matching device has a water bag (64) that contains water and a water bag support frame (66) that sandwiches and supports the water bag on the left and right sides of the knee and curves along the knee cap. The water bag becomes a plate shape curved along the shape of the water bag support frame, which touches the knee cap and fits the unevenness of the knee. When an ultrasonic probe is moved along the knee cap, the acoustic matching between the knee cap and the ultrasonic probe is obtained.

摘要翻译： 声学匹配装置具有含水的水袋（64）和水袋支撑框架（66），所述水袋支撑框架（66）夹持并支撑在膝盖的左侧和右侧并且沿着膝盖弯曲的水袋。 水袋成为沿着水袋支撑框架的形状弯曲的板形，其接触膝盖并适配膝盖的不平坦部分。 当超声波探头沿膝盖移动时，获得膝盖与超声波探头之间的声学​​匹配。

公开(公告)号：US08453511B2

公开(公告)日：2013-06-04

申请号：US13055376

申请日：2009-07-17

申请人： Kozo Nakamura ,  Isao Onishi ,  Satoru Ohashi ,  Eiichi Minagawa ,  Koji Hirota ,  Ryoichi Sakai ,  Koji Ogawa ,  Koichi Miyasaka ,  Masaru Murashita

发明人： Kozo Nakamura ,  Isao Onishi ,  Satoru Ohashi ,  Eiichi Minagawa ,  Koji Hirota ,  Ryoichi Sakai ,  Koji Ogawa ,  Koichi Miyasaka ,  Masaru Murashita

IPC分类号： G01D21/00 ,  A61B8/13

CPC分类号： A61B8/0858 ,  A61B5/4514 ,  A61B5/4528 ,  A61B8/4209 ,  A61B8/4281 ,  A61B8/4405 ,  A61B90/50 ,  A61B2090/378

摘要： A mounting unit (16) is aligned by using a mounting unit frame (58) touching the thigh and a knee-contacting portion (62) touching the knee, with the knee being bent. The mounting unit is also equipped with a probe support frame (60) used for moving an ultrasonic probe along the knee cap. The probe support frame moves rotationally about the mechanical center of the knee joint, thereby allowing the ultrasonic probe (78) to move along the knee cap while facing toward the mechanical center of the knee joint and to perform scanning of an ultrasonic beam.

摘要翻译： 安装单元（16）通过使用接触大腿的安装单元框架（58）和接触膝盖的膝盖接触部分（62）而弯曲而对准。 安装单元还配备有用于沿着膝盖帽移动超声波探头的探针支撑框架（60）。 探针支撑框架围绕膝关节的机械中心旋转移动，从而允许超声波探头（78）沿着膝盖帽移动，同时面向膝关节的机械中心并执行超声波束的扫描。

公开(公告)号：US20120171406A1

公开(公告)日：2012-07-05

申请号：US13394907

申请日：2010-09-07

申请人： Hiroshi Mase ,  Koji Hirota

发明人： Hiroshi Mase ,  Koji Hirota

IPC分类号： B32B5/00 ,  B32B5/02 ,  D02G3/36 ,  C23C14/06 ,  B32B15/08 ,  B32B15/12 ,  B32B27/06 ,  B32B29/06 ,  B32B3/02 ,  C23C14/24

CPC分类号： A61L15/46 ,  A01N59/20 ,  A61L15/18 ,  A61L2300/102 ,  A61L2300/404 ,  C22C9/02 ,  C23C14/20 ,  Y10T428/239 ,  Y10T428/265 ,  Y10T428/2958 ,  Y10T442/2525 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N2300/00

摘要： Provided is an antimicrobial raw material having excellent antibacterial and corrosion-resistance properties, which can be directly formed as a film even on a plastic substrate with low heat-resistance or a substrate whereof the color or properties are likely to change due to heat, and this can be achieved at relatively low cost. The antimicrobial raw material is a laminated structure which comprises a substrate layer and a copper-tin alloy layer disposed on the substrate layer, and which has a thickness ranging from 5 nm to 200 nm. The substrate layer is made of resin, natural fiber, or paper, the resin having the deflection temperature under load being 115° C. or lower when measured in accordance with ASTM-D648-56 under a load of 1820 kPa. The copper-tin alloy layer contains over 60 at % but no more than 90 at % of copper and 10 at % or more but less than 40 at % of tin.

摘要翻译： 本发明提供抗菌，耐腐蚀性优异的抗微生物原料，即使在低耐热性的塑料基材上也可以直接形成膜或由于热而使颜色或性质发生变化的基材， 这可以以相对低的成本实现。 抗微生物原料是层叠结构，其包含基材层和设置在基材层上的铜锡合金层，其厚度范围为5nm〜200nm。 基材层由树脂，天然纤维或纸制成，当根据ASTM-D648-56在1820kPa的负荷下测量时，负载挠曲温度为115℃或更低的树脂。 铜 - 锡合金层含有超过60原子％但不超过90原子％的铜和10原子％以上但小于40原子％的锡。