摘要:
A channel fastener, which is capable of preventing or suppressing the plastic deformation of a leaf spring when the other device such as a fuel assembly and a tool is brought into contact therewith from the upper side, is provided. The channel fastener (6) comprises a leaf spring guard (9) having a leg body (13) formed in a roughly L-shape in horizontal cross section and extending vertically and a flat upper plate (12) connected to the leg body (13) at the upper end of the leg body (13) and extending horizontally, and a leaf spring (8) having an upper plate part (15) fixed to the leaf spring guard flat upper plate (12) and extending along the leaf spring guard flat upper plate (12) and at least two legs (17) connected to the upper plate part (15) and extending downward along the leaf spring guard leg body (13). One or a plurality of projected parts (21) projected upward are formed on the leaf spring guard fiat upper plate (12).
摘要:
A pigment comprises a substrate, a metallic layer formed on at least one surface of the substrate and imparting metallic luster, and a transparent inorganic compound layer formed on surfaces of the substrate and the metallic layer. Thereby, the pigment produces color by light interference of a ray reflected on a surface of the transparent inorganic compound layer and a ray passed through the transparent inorganic compound layer and reflected on a surface of the metallic layer. Thus, the pigment is excellent in coloring power and hiding power, and particularly useful for an automotive finishing paint.
摘要:
A groove (21) is formed on an upper surface of sealing resin (2) in the form of a strip. A device (101) is pressed against a flat surface of a radiating fin (55) by a band plate shaped clamper (61) which is engaged with the groove (21). Due to the engagement of the clamper (61) and the groove (21), movement of the device (101) is limited. Namely, the device (101) is stably fixed to the radiating fin (55). Since the device (101) is fixed to the radiating fin (55) by the clamper (61), no hole for receiving a fastening screw is provided in the sealing resin (2). Therefore, the sealing resin (2) is reduced, whereby miniaturization of the device (101) is implemented. Thus, the device is miniaturized at no sacrifice of radiation efficiency.
摘要:
The invention is concerned with the method of compression molding a metallic or ceramic powders. The method includes the step of maintaining a negative pressure within a first mold of noncompactable powders for intimately contacting on its inner surface a pouch-like member of thin-walled resilient material for producing a second mold, and the step of compactly charging starting powders into the second mold and exhausting air from and sealing the second mold, taking out a pre-molded body of the metallis or ceramic powders together with the second mold and the step of processing the pre-molded body by a cold or hot isostatic press.
摘要:
It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.
摘要:
A semiconductor apparatus having a plurality of electrodes comprises two external terminals provided for each electrode for being coupled to an input signal.
摘要:
It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.
摘要:
A method of casting a powdered material. A slurry is formed by dispersing metal powder or ceramic powder into a dispersing medium mainly consisting of a substance extractable by a liquid or supercritical carbon dioxide and having a melting point between 0.degree. C. and 100.degree. C., and the slurry is poured into a liquid non-absorbing mold where the slurry is cooled to freeze and solidify into a molding. The main constituent of the dispersing medium in the molding is extracted and removed by the liquid or supercritical carbon dioxide.