Channel Fastener
    1.
    发明申请
    Channel Fastener 审中-公开
    渠道紧固件

    公开(公告)号:US20080145174A1

    公开(公告)日:2008-06-19

    申请号:US11722357

    申请日:2005-12-20

    IPC分类号: F16B27/00

    CPC分类号: G21C3/33 Y02E30/40

    摘要: A channel fastener, which is capable of preventing or suppressing the plastic deformation of a leaf spring when the other device such as a fuel assembly and a tool is brought into contact therewith from the upper side, is provided. The channel fastener (6) comprises a leaf spring guard (9) having a leg body (13) formed in a roughly L-shape in horizontal cross section and extending vertically and a flat upper plate (12) connected to the leg body (13) at the upper end of the leg body (13) and extending horizontally, and a leaf spring (8) having an upper plate part (15) fixed to the leaf spring guard flat upper plate (12) and extending along the leaf spring guard flat upper plate (12) and at least two legs (17) connected to the upper plate part (15) and extending downward along the leaf spring guard leg body (13). One or a plurality of projected parts (21) projected upward are formed on the leaf spring guard fiat upper plate (12).

    摘要翻译: 提供一种通道紧固件,其能够防止或抑制当诸如燃料组件和工具的其他装置从上侧与其接触时的板簧的塑性变形。 通道紧固件(6)包括一个板簧(9),该板簧保护件(9)具有一个大致L形的水平横截面并垂直延伸的腿体(13)和一个连接到腿体(13)的平坦的上板 ),并且水平延伸的板簧(8),其具有固定到所述板簧保护平板上板(12)并沿着所述板簧保护件延伸的上板部(15) 平板上板(12)和连接到上板部分(15)并且沿着板簧保护腿体(13)向下延伸的至少两个腿部(17)。 一个或多个向上突出的突出部分(21)形成在板簧保护板上板(12)上。

    Pigment
    2.
    发明授权
    Pigment 失效
    颜料

    公开(公告)号:US4954175A

    公开(公告)日:1990-09-04

    申请号:US306980

    申请日:1989-02-07

    IPC分类号: C09C1/00

    摘要: A pigment comprises a substrate, a metallic layer formed on at least one surface of the substrate and imparting metallic luster, and a transparent inorganic compound layer formed on surfaces of the substrate and the metallic layer. Thereby, the pigment produces color by light interference of a ray reflected on a surface of the transparent inorganic compound layer and a ray passed through the transparent inorganic compound layer and reflected on a surface of the metallic layer. Thus, the pigment is excellent in coloring power and hiding power, and particularly useful for an automotive finishing paint.

    Method for molding of powders
    4.
    发明授权
    Method for molding of powders 失效
    粉末成型方法

    公开(公告)号:US4927600A

    公开(公告)日:1990-05-22

    申请号:US105985

    申请日:1987-10-08

    摘要: The invention is concerned with the method of compression molding a metallic or ceramic powders. The method includes the step of maintaining a negative pressure within a first mold of noncompactable powders for intimately contacting on its inner surface a pouch-like member of thin-walled resilient material for producing a second mold, and the step of compactly charging starting powders into the second mold and exhausting air from and sealing the second mold, taking out a pre-molded body of the metallis or ceramic powders together with the second mold and the step of processing the pre-molded body by a cold or hot isostatic press.

    摘要翻译: 本发明涉及压缩成型金属或陶瓷粉末的方法。 该方法包括在不可压缩的粉末的第一模具内保持负压以在其内表面上紧密接触薄壁弹性材料的袋状构件以产生第二模具的步骤,以及将起始粉末紧密地装入 第二模具和排出空气来自第二模具并且密封第二模具,与第二模具一起取出金属或陶瓷粉末的预成型体,以及通过冷或热等静压机加工预成型体的步骤。

    Semiconductor device having integral structure of case and external
connection terminals
    7.
    发明授权
    Semiconductor device having integral structure of case and external connection terminals 失效
    具有壳体和外部连接端子整体结构的半导体器件

    公开(公告)号:US5686758A

    公开(公告)日:1997-11-11

    申请号:US441738

    申请日:1995-05-16

    IPC分类号: H01L25/07 H01L25/18 H01L23/12

    摘要: It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.

    摘要翻译: 本发明的目的是获得具有壳体和外部连接端子的整体结构的功率半导体器件中的具有小尺寸和高可靠性的功率半导体器件。 设置与其他部分没有电连接的虚拟焊盘(42),并且连接线(46)的端部通过依次接合连接电极(43)的暴露表面和半导体的接合焊盘(41)而连接 元件(40)与其结合。 半导体器件可以小型化,而不会劣化半导体元件的电特性和可靠性。

    Semiconductor apparatus
    8.
    发明授权
    Semiconductor apparatus 失效
    半导体装置

    公开(公告)号:US4885629A

    公开(公告)日:1989-12-05

    申请号:US517712

    申请日:1983-07-27

    申请人: Yoshio Takagi

    发明人: Yoshio Takagi

    IPC分类号: H01L25/07 H01L25/18

    CPC分类号: H01L25/072 H01L2924/0002

    摘要: A semiconductor apparatus having a plurality of electrodes comprises two external terminals provided for each electrode for being coupled to an input signal.

    摘要翻译: 具有多个电极的半导体装置包括为每个电极提供的用于耦合到输入信号的两个外部端子。