公开(公告)号：US08240034B1

公开(公告)日：2012-08-14

申请号：US12128502

申请日：2008-05-28

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  G11C16/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/50 ,  H01L27/11517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0052 ,  H05K3/0097 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/167 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a flash memory card is manufactured using COB processes on a PCB panel with multiple micro cards PCB substrates. These micro memory cards are laid out in an array of 3×5 matrixes of micro cards PCB substrates. A method of molding over a PCBA is utilized, contrary to a conventional method of having two or more pieces of package components to tape together. This results in a simpler structure without the notch which enables easier singulation process and the package is moisture resistance. The final product is a single piece versus two or three pieces glued up pieces and would not separate from pieces. The final product has high water and moisture resistance, low cost and fast manufacturing throughput, no seam and aesthetically more appeasing, can stack more layers of flash memory die, and be maximized XY spaces to accommodate larger size flash memory die.

摘要翻译： 根据本发明的某些实施例，使用COB处理在具有多个微卡PCB基板的PCB面板上制造闪存卡。 这些微型存储卡被布置在3×5矩阵的微卡PCB基板的阵列中。 利用PCBA上的成型方法，这与将两个或多个包装部件捆绑在一起的传统方法相反。 这导致更简单的结构，没有凹口，这使得更容易的分离过程和封装是防潮性的。 最终产品是单件，而不是两件或三件胶合，不会与件分离。 最终产品具有高耐水和耐湿性，低成本和快速的制造生产能力，无缝和美观上的安抚，可以堆叠多层闪存芯片，并最大化XY空间以适应更大尺寸的闪存芯片。

公开(公告)号：US07874067B1

公开(公告)日：2011-01-25

申请号：US12137432

申请日：2008-06-11

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  G06F13/36

CPC分类号： G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

摘要翻译： 根据本发明的某些实施例，单芯片COB USB制造在具有多个单独的USB PCB基板的PCB面板上使用芯片上（COB）工艺。 这种单芯片COB USB以N×M矩阵阵列布置。 该方法的优点是：1）使用PCBA成型，与传统的SMT工艺相比，在基板上安装所有必要的部件以形成PCBA; 2）更简单的矩形结构，适合任何外部装饰外壳包装附加值; 和3）如果不防水，包装是防潮的。

公开(公告)号：US07447037B2

公开(公告)日：2008-11-04

申请号：US11859685

申请日：2007-09-21

申请人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K1/14

CPC分类号： H05K3/284 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R13/665 ,  H05K1/117 ,  H05K5/0278 ,  H01L2224/85

摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

摘要翻译： 一个低调的通用串行总线（USB）组件包括一个模块化的USB内核组件和一个外壳。 模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。 然后将模块化的USB核心组件插入或以外部塑料外壳组合以提供USB组件。 公开了一种可选的手提箱。

公开(公告)号：US07440286B2

公开(公告)日：2008-10-21

申请号：US11927549

申请日：2007-10-29

申请人： Siew S. Hiew ,  Nan Nan ,  Jim Chin-Nan Ni ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Jim Chin-Nan Ni ,  Abraham C. Ma

IPC分类号： H05K7/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07741

摘要： A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.

摘要翻译： 双卡个人读卡器系统使用读卡器和扩展的9针USB插座支持USB和micro-SD设备。 读卡器包括具有四个标准USB金属接触焊盘和设置在上侧的多个扩展目的接触焊盘的PCBA，在下侧由模制壳体覆盖的部件和IC芯片，安装在PCBA上的模制引线框架连接器和 包括五个前向扩展用引脚和八个后面的micro-SD连接器引脚，其通过扩展目的接触焊盘与PCBA通信，以及壳体，其包括用于接收微型SD卡的插槽，使得其与PCBA通信 通过micro-SD连接器引脚。 扩展的9针USB插座包括标准USB触点和扩展使用触点，通过标准USB金属触点和前端扩展目的引脚与PCBA通信。 PCBA包括用于SD / USB通信的双人格电子设备。

公开(公告)号：US07517231B2

公开(公告)日：2009-04-14

申请号：US11929917

申请日：2007-10-30

申请人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Qijin Li ,  Nan Nan

发明人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Qijin Li ,  Nan Nan

IPC分类号： H01R12/00

CPC分类号： H05K9/0067

摘要： A solid state drive (SSD) device includes a printed-circuit board assembly (PCBA), a connector mounted on the circuit board, an open-frame support-type housing including first and second parallel elongated brackets extending along opposing peripheral edges of said circuit board, each bracket including a first connecting structure for securing the circuit board to the housing, and a second connecting structure for connecting the housing to an internal rack frame of a host system. The open-frame support type housing does not include a top cover and a bottom cover, whereby both of said opposing first and second surfaces are exposed by first and second openings. The housing includes optional end rails that form a box-like frame. The elongated brackets are formed using die-cast metal, stamped metal, or molded plastic with copper posts. Optional clamp-type brackets clamp along side edges of the PCBA.

摘要翻译： 固态驱动器（SSD）装置包括印刷电路板组件（PCBA），安装在电路板上的连接器，开放式框架支撑型壳体，包括沿着所述电路的相对外围边缘延伸的第一和第二平行细长支架 每个支架包括用于将电路板固定到壳体的第一连接结构，以及用于将壳体连接到主机系统的内部机架框架的第二连接结构。 开放框架支撑型壳体不包括顶盖和底盖，由此所述相对的第一表面和第二表面都由第一和第二开口暴露。 壳体包括形成盒状框架的可选端部轨道。 细长支架使用压铸金属，冲压金属或具有铜柱的模制塑料形成。 可选的夹式支架夹在PCBA的侧边缘。

公开(公告)号：US20080145968A1

公开(公告)日：2008-06-19

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/00 ,  H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。 然后执行前沿倒角处理。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US20080266816A1

公开(公告)日：2008-10-30

申请号：US12172164

申请日：2008-07-11

申请人： Jim Chin-Nan Ni ,  Siew S. Hiew ,  Abraham C. Ma

发明人： Jim Chin-Nan Ni ,  Siew S. Hiew ,  Abraham C. Ma

IPC分类号： H05K1/14 ,  H05K3/00

CPC分类号： H05K5/0269 ,  H05K5/0273 ,  Y10T29/49124

摘要： A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.

摘要翻译： 固态硬盘（SSD）设备包括定义铆钉孔的印刷电路板组件（PCBA），以及支撑结构，其包括限定铆钉开口的平行侧框架轨道和用于接收和支撑PCBA的支撑平台。 压接配合铆钉套件用于将PCBA连接到支撑结构，每个铆钉组件包括母铆钉部分和相关联的公铆钉部分。 PCBA被安装到支撑结构上，使得铆钉孔与多个铆钉开口的铆钉开口对准，然后使用自动铆钉工具将铆钉组安装和固定，使得每个铆钉组延伸通过相关联的铆钉 孔/开口并且固定地接合，使得PCBA和支撑结构保持在相应的阳和雌铆钉部分的端盖之间。

公开(公告)号：US07869218B2

公开(公告)日：2011-01-11

申请号：US12172164

申请日：2008-07-11

申请人： Jim Chin-Nan Ni ,  Siew S. Hiew ,  Abraham C. Ma

发明人： Jim Chin-Nan Ni ,  Siew S. Hiew ,  Abraham C. Ma

IPC分类号： H05K1/14

CPC分类号： H05K5/0269 ,  H05K5/0273 ,  Y10T29/49124

摘要： A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.

摘要翻译： 固态硬盘（SSD）设备包括定义铆钉孔的印刷电路板组件（PCBA），以及支撑结构，其包括限定铆钉开口的平行侧框架轨道和用于接收和支撑PCBA的支撑平台。 压接配合铆钉套件用于将PCBA连接到支撑结构，每个铆钉组件包括母铆钉部分和相关联的公铆钉部分。 PCBA被安装到支撑结构上，使得铆钉孔与多个铆钉开口的铆钉开口对准，然后使用自动铆钉工具将铆钉组安装和固定，使得每个铆钉组延伸通过相关联的铆钉 孔/开口并且固定地接合，使得PCBA和支撑结构保持在相应的阳和雌铆钉部分的端盖之间。

公开(公告)号：US07535719B2

公开(公告)日：2009-05-19

申请号：US11874174

申请日：2007-10-17

申请人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K1/14

CPC分类号： H05K5/0278 ,  H01L21/565 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2224/85

摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.

摘要翻译： 一个低调的通用串行总线（USB）组件包括可缩回地安装到外部外壳中的模块化USB内核组件。 模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 壳体包括可伸缩机构，其可以通过将模块化USB芯部件的前部部分滑入和移出壳体的前开口来促进金属触点的选择性暴露，或者通过提供可滑动地覆盖壳体的前部的盖板 模块化的USB核心组件。