公开(公告)号：US07874067B1

公开(公告)日：2011-01-25

申请号：US12137432

申请日：2008-06-11

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  G06F13/36

CPC分类号： G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

摘要翻译： 根据本发明的某些实施例，单芯片COB USB制造在具有多个单独的USB PCB基板的PCB面板上使用芯片上（COB）工艺。 这种单芯片COB USB以N×M矩阵阵列布置。 该方法的优点是：1）使用PCBA成型，与传统的SMT工艺相比，在基板上安装所有必要的部件以形成PCBA; 2）更简单的矩形结构，适合任何外部装饰外壳包装附加值; 和3）如果不防水，包装是防潮的。

公开(公告)号：US08240034B1

公开(公告)日：2012-08-14

申请号：US12128502

申请日：2008-05-28

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  G11C16/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/50 ,  H01L27/11517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0052 ,  H05K3/0097 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/167 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a flash memory card is manufactured using COB processes on a PCB panel with multiple micro cards PCB substrates. These micro memory cards are laid out in an array of 3×5 matrixes of micro cards PCB substrates. A method of molding over a PCBA is utilized, contrary to a conventional method of having two or more pieces of package components to tape together. This results in a simpler structure without the notch which enables easier singulation process and the package is moisture resistance. The final product is a single piece versus two or three pieces glued up pieces and would not separate from pieces. The final product has high water and moisture resistance, low cost and fast manufacturing throughput, no seam and aesthetically more appeasing, can stack more layers of flash memory die, and be maximized XY spaces to accommodate larger size flash memory die.

摘要翻译： 根据本发明的某些实施例，使用COB处理在具有多个微卡PCB基板的PCB面板上制造闪存卡。 这些微型存储卡被布置在3×5矩阵的微卡PCB基板的阵列中。 利用PCBA上的成型方法，这与将两个或多个包装部件捆绑在一起的传统方法相反。 这导致更简单的结构，没有凹口，这使得更容易的分离过程和封装是防潮性的。 最终产品是单件，而不是两件或三件胶合，不会与件分离。 最终产品具有高耐水和耐湿性，低成本和快速的制造生产能力，无缝和美观上的安抚，可以堆叠多层闪存芯片，并最大化XY空间以适应更大尺寸的闪存芯片。

公开(公告)号：US20080145968A1

公开(公告)日：2008-06-19

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/00 ,  H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。 然后执行前沿倒角处理。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US08297987B2

公开(公告)日：2012-10-30

申请号：US13211100

申请日：2011-08-16

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K5/03

CPC分类号： G06K19/07732

摘要： An extended universal serial bus (USB) storage device is described herein. According to one embodiment, an extended USB storage device includes a printed circuit board assembly (PCBA) having a flash memory device and a flash controller mounted thereon, and an extended USB connector plug coupled to the PCBA for providing a USB compatible interface between an external device and the flash memory device and the flash controller, wherein the extended USB connector plug includes a first end used to couple to the external device and a second end coupled to the flash memory device and the flash controller. The extended USB connector plug includes multiple communication interfaces. Other methods and apparatuses are also described.

摘要翻译： 本文描述了扩展通用串行总线（USB）存储设备。 根据一个实施例，扩展的USB存储设备包括具有闪存设备和安装在其上的闪存控制器的印刷电路板组件（PCBA），以及耦合到PCBA的扩展USB连接器插头，用于在外部 设备和闪存设备和闪存控制器，其中扩展的USB连接器插头包括用于耦合到外部设备的第一端和耦合到闪存设备和闪存控制器的第二端。 扩展的USB连接器插头包括多个通信接口。 还描述了其它方法和装置。

公开(公告)号：US20110300724A1

公开(公告)日：2011-12-08

申请号：US13211100

申请日：2011-08-16

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K5/03

CPC分类号： G06K19/07732

摘要： An extended universal serial bus (USB) storage device is described herein. According to one embodiment, an extended USB storage device includes a printed circuit board assembly (PCBA) having a flash memory device and a flash controller mounted thereon, and an extended USB connector plug coupled to the PCBA for providing a USB compatible interface between an external device and the flash memory device and the flash controller, wherein the extended USB connector plug includes a first end used to couple to the external device and a second end coupled to the flash memory device and the flash controller. The extended USB connector plug includes multiple communication interfaces. Other methods and apparatuses are also described.

摘要翻译： 本文描述了扩展通用串行总线（USB）存储设备。 根据一个实施例，扩展的USB存储设备包括具有闪存设备和安装在其上的闪存控制器的印刷电路板组件（PCBA），以及耦合到PCBA的扩展USB连接器插头，用于在外部 设备和闪存设备和闪存控制器，其中扩展的USB连接器插头包括用于耦合到外部设备的第一端和耦合到闪存设备和闪存控制器的第二端。 扩展的USB连接器插头包括多个通信接口。 还描述了其它方法和装置。

公开(公告)号：US08262416B2

公开(公告)日：2012-09-11

申请号：US12884732

申请日：2010-09-17

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H01R24/00

CPC分类号： H01R13/6658

摘要： An extended USB plug connector includes a connector substrate including a frontend having a first set of electrical contact pins disposed thereon and a backend having a second set of electrical contact pins disposed thereon. The first set includes a first row of electrical contact pins disposed on a top surface of the connector substrate and a second row of electrical contact pins disposed in parallel with the first row of electrical contact pins and interior to the first row of electrical contact pins, where the second row includes more electrical contact pins than the first row. The second set of electrical contact pins includes a number of electrical contact pins equal to the first row and second row of electrical contact pins in total. The second set of electrical contact pins are used to connect to corresponding electrical contact pads disposed on a printed circuit board assembly having a USB controller and flash memory devices disposed thereon.

摘要翻译： 扩展的USB插头连接器包括连接器基板，该连接器基板包括前端，前端具有设置在其上的第一组电接触针和具有设置在其上的第二组电接触针的后端。 第一组包括设置在连接器基板的顶表面上的第一排电接触针和与第一排电接触销平行布置并且位于第一排电触针的内部的第二排电接触针， 其中第二行包括比第一行更多的电接触引脚。 第二组电接触引脚包括总共等于第一行和第二排电接触引脚的多个电接触引脚。 第二组电接触针用于连接到布置在具有设置在其上的USB控制器和闪存器件的印刷电路板组件上的相应电接触焊盘。

公开(公告)号：US07815469B1

公开(公告)日：2010-10-19

申请号：US11876597

申请日：2007-10-22

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H01R4/38 ,  H01R13/648

CPC分类号： H01R13/6658

摘要： An extended universal serial bus (USB) storage device is described herein. According to one embodiment, an extended USB storage device includes a printed circuit board assembly (PCBA) having a flash memory device and a flash controller mounted thereon, and an extended USB connector plug coupled to the PCBA for providing a USB compatible interface between an external device and the flash memory device and the flash controller, wherein the extended USB connector plug includes a first end used to couple to the external device and a second end coupled to the flash memory device and the flash controller.In one embodiment, a front piece (1701) includes a metal case (1706) for shielding and a tongue (1709) with contact pins (1781, 1782) and a rear piece (1702) includes a tip portion (1713) with contacts (1783). When the rear tip portion (1713) is inserted into the front piece the contact pins (1783) engage the contact pins (1781, 1782). The rear piece may also include locking pieces (1715) that are to enter slots (1714) in the front piece.

摘要翻译： 本文描述了扩展通用串行总线（USB）存储设备。 根据一个实施例，扩展的USB存储设备包括具有闪存设备和安装在其上的闪存控制器的印刷电路板组件（PCBA），以及耦合到PCBA的扩展USB连接器插头，用于在外部 设备和闪存设备和闪存控制器，其中扩展的USB连接器插头包括用于耦合到外部设备的第一端和耦合到闪存设备和闪存控制器的第二端。 在一个实施例中，前部件（1701）包括用于屏蔽的金属外壳（1706）和具有接触销（1781,1782）的舌部（1709），后部件（1702）包括具有接触件的尖端部分（1713） 1783）。 当后端部分（1713）插入到前部件中时，接触销（1783）与接触销（1781,1782）接合。 后部件还可以包括要在前部件中进入槽（1714）的锁定件（1715）。

公开(公告)号：US20110003514A1

公开(公告)日：2011-01-06

申请号：US12884732

申请日：2010-09-17

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H01R24/00

CPC分类号： H01R13/6658

摘要： An extended USB plug connector includes a connector substrate including a frontend having a first set of electrical contact pins disposed thereon and a backend having a second set of electrical contact pins disposed thereon. The first set includes a first row of electrical contact pins disposed on a top surface of the connector substrate and a second row of electrical contact pins disposed in parallel with the first row of electrical contact pins and interior to the first row of electrical contact pins, where the second row includes more electrical contact pins than the first row. The second set of electrical contact pins includes a number of electrical contact pins equal to the first row and second row of electrical contact pins in total. The second set of electrical contact pins are used to connect to corresponding electrical contact pads disposed on a printed circuit board assembly having a USB controller and flash memory devices disposed thereon.

摘要翻译： 扩展的USB插头连接器包括连接器基板，该连接器基板包括前端，前端具有设置在其上的第一组电接触针和具有设置在其上的第二组电接触针的后端。 第一组包括设置在连接器基板的顶表面上的第一排电接触针和与第一排电接触销平行布置并且位于第一排电触针的内部的第二排电接触针， 其中第二行包括比第一行更多的电接触引脚。 第二组电接触引脚包括总共等于第一行和第二排电接触引脚的多个电接触引脚。 第二组电接触针用于连接到布置在具有设置在其上的USB控制器和闪存器件的印刷电路板组件上的相应电接触焊盘。

公开(公告)号：US20120309231A1

公开(公告)日：2012-12-06

申请号：US13585704

申请日：2012-08-14

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H01R13/66

CPC分类号： H01R13/6658

摘要： A USB plug receptacle includes a connector substrate having a tongue portion having a first set of electrical contact pins disposed on a top surface of the tongue portion, a second set of a plurality of electrical pins disposed on a bottom surface of the tongue portion, a third set of electrical contact pins disposed on an opposite end of the tongue portion. The USB plug receptacle further includes a metal case made of a sheet of electrically conductive metal plate by blanking the sheet into a generally tubular shape to receive and enclose the connector substrate. When the connector substrate is inserted into the metal case, the third set of electrical contact pins are exposed outside of the metal case and the third set of electrical contact pins can be mounted on first and second sets of electrical contact pads of a printed circuit board assembly.

摘要翻译： USB插头插座包括具有舌部的连接器基底，舌部具有设置在舌部的顶表面上的第一组电接触针，设置在舌部的底表面上的多个电针的第二组， 设置在舌部相对端的第三组电接触针。 USB插头插座还包括由导电金属板片制成的金属外壳，通过将片材冲压成大致管状形状以接收和封闭连接器基板。 当连接器基板插入金属壳体中时，第三组电接触销被暴露在金属外壳的外部，并且第三组电接触销可以安装在印刷电路板的第一和第二组电接触焊盘上 部件。