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    HEAT DISSIPATING PAINT WITH HIGH THERMAL RADIATING CAPABILITY
    1.
    发明申请
    HEAT DISSIPATING PAINT WITH HIGH THERMAL RADIATING CAPABILITY 有权
    具有高热辐射能力的散热涂料

    公开(公告)号：US20130112109A1

    公开(公告)日：2013-05-09

    申请号：US13655276

    申请日：2012-10-18

    Applicant: Sihai Chen ,  Ning-Cheng Lee

    Inventor： Sihai Chen ,  Ning-Cheng Lee

    IPC: C09D5/00

    CPC classification number: C09D5/00 ,  C09D7/61

    Abstract: A high emissive paint comprises organic materials with different functional groups, one or more inorganic materials, and optionally other paint property adjusting agents. The infrared absorption range of the paint derives from organic functional groups, such as C—C, C—H, N—H, C—N, C—O and C—X groups, and the one or more inorganic materials. One or more inorganic materials may also be present as micro- or nano-sized particles.

    Abstract translation: 高发射性涂料包括具有不同官能团的有机材料，一种或多种无机材料，以及任选的其它涂料性质调节剂。 油漆的红外吸收范围来自有机官能团，如C-C，C-H，N-H，C-N，C-O和C-X基团，以及一种或多种无机材料。 一种或多种无机材料也可以作为微米或纳米尺寸的颗粒存在。

    Heat dissipating paint with high thermal radiating capability
    4.
    发明授权
    Heat dissipating paint with high thermal radiating capability 有权
    具有高散热能力的散热油漆

    公开(公告)号：US09120930B2

    公开(公告)日：2015-09-01

    申请号：US13655276

    申请日：2012-10-18

    Applicant: Sihai Chen ,  Ning-Cheng Lee

    Inventor： Sihai Chen ,  Ning-Cheng Lee

    IPC: C09D5/00 ,  C09D7/12

    CPC classification number: C09D5/00 ,  C09D7/61

    Abstract: A high emissive paint comprises organic materials with different functional groups, one or more inorganic materials, and optionally other paint property adjusting agents. The infrared absorption range of the paint derives from organic functional groups, such as C—C, C—H, N—H, C—N, C—O and C—X groups, and the one or more inorganic materials. One or more inorganic materials may also be present as micro- or nano-sized particles.

    Abstract translation: 高发射性涂料包括具有不同官能团的有机材料，一种或多种无机材料，以及任选的其它涂料性质调节剂。 油漆的红外吸收范围来自有机官能团，如C-C，C-H，N-H，C-N，C-O和C-X基团，以及一种或多种无机材料。 一种或多种无机材料也可以作为微米或纳米尺寸的颗粒存在。

    Materials having increased mobility after heating
    5.
    发明授权
    Materials having increased mobility after heating 有权

    公开(公告)号：US10010981B2

    公开(公告)日：2018-07-03

    申请号：US12240396

    申请日：2008-09-29

    Applicant: Ning-Cheng Lee ,  Runsheng Mao

    Inventor： Ning-Cheng Lee ,  Runsheng Mao

    IPC: B23K35/22 ,  B23K35/24

    CPC classification number: B23K35/22 ,  B23K35/24

    Abstract: Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

    MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY
    6.
    发明申请
    MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY 有权
    MN DOPED SN-BASE焊接合金及其焊接接头，具有超级倾斜冲击可靠性

    公开(公告)号：US20120328361A1

    公开(公告)日：2012-12-27

    申请号：US13542586

    申请日：2012-07-05

    Applicant: WEIPING LIU ,  Ning-Cheng Lee

    Inventor： WEIPING LIU ,  Ning-Cheng Lee

    IPC: C22C13/00 ,  B23K35/24

    CPC classification number: C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/02 ,  Y10T403/479

    Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.

    Abstract translation: 公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。 焊料包含大于0wt。 ％且小于或等于约1.5wt。 ％Ag; 大于或等于约0.7wt。 ％且小于或等于约2.0wt。 ％Cu; 在大于或等于约0.001和小于或等于约0.2重量％之间。 ％Mn; 和Sn的剩余部分。

    COMPOSITE SOLDER ALLOY PREFORM
    8.
    发明申请
    COMPOSITE SOLDER ALLOY PREFORM 有权
    复合焊接合金预选

    公开(公告)号：US20110220704A1

    公开(公告)日：2011-09-15

    申请号：US12720532

    申请日：2010-03-09

    Applicant: Weiping Liu ,  Ning-Cheng Lee

    Inventor： Weiping Liu ,  Ning-Cheng Lee

    IPC: B23K1/20 ,  B32B15/01

    CPC classification number: B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/15747 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

    Abstract: Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

    Abstract translation: 本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。 层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。 在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。 所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。 接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

    Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver
    9.
    发明申请
    Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver 有权
    增加含银无铅焊料的合规性的技术

    公开(公告)号：US20070092396A1

    公开(公告)日：2007-04-26

    申请号：US11550640

    申请日：2006-10-18

    Applicant: Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

    Inventor： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

    IPC: C22C13/00

    CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K35/3006

    Abstract: A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.

    Abstract translation: 公开了一种提高含银无铅焊料柔顺性的技术。 在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。 在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物 。 在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

    Solder pastes for providing high elasticity, low rigidity solder joints
    10.
    发明授权
    Solder pastes for providing high elasticity, low rigidity solder joints 有权
    焊膏用于提供高弹性，低刚性焊点

    公开(公告)号：US07017795B2

    公开(公告)日：2006-03-28

    申请号：US10954570

    申请日：2004-10-01

    Applicant: Yan Liu ,  Derrick Herron ,  Ning-Cheng Lee

    Inventor： Yan Liu ,  Derrick Herron ,  Ning-Cheng Lee

    IPC: B23K35/12

    CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/302 ,  B23K35/3612 ,  B23K2101/36 ,  H05K3/3484 ,  H05K2201/0215

    Abstract: Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

    Abstract translation: 公开了用于提供高弹性，低刚性焊点的焊膏。 焊膏可以用于其热膨胀系数不匹配的两个部件和/或当两个部件被焊接在一起时机械变形的可能性很高的两个部件之间。 在一个具体的示例性实施例中，焊膏可以实现为包含焊料粉末和具有焊剂的高熔点温度颗粒的组合物，其中焊料粉末和高熔点温度颗粒之间的比例可以在2:1和1:10之间。

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