公开(公告)号：US20220139940A1

公开(公告)日：2022-05-05

申请号：US17152441

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  CHUNMING WANG ,  LEO XING ,  XIAN LIU ,  NHAN DO

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/423 ,  H01L29/78 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming memory cells, high voltage devices and logic devices on fins of a semiconductor substrate's upper surface, and the resulting memory device formed thereby. The memory cells are formed on a pair of the fins, where the floating gate is disposed between the pair of fins, the word line gate wraps around the pair of fins, the control gate is disposed over the floating gate, and the erase gate is disposed over the pair of fins and partially over the floating gate. The high voltage devices include HV gates that wrap around respective fins, and the logic devices include logic gates that are metal and wrap around respective fins.

公开(公告)号：US20230238453A1

公开(公告)日：2023-07-27

申请号：US18126954

申请日：2023-03-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  XIAN LIU ,  CHIEN-SHENG SU ,  Nhan DO ,  CHUNMING WANG

IPC: H01L29/66 ,  H01L29/788 ,  H01L27/07 ,  H01L29/08 ,  H01L21/28 ,  H01L29/423

CPC classification number: H01L29/66825 ,  H01L29/788 ,  H01L27/0705 ,  H01L29/0847 ,  H01L29/40114 ,  H01L28/00 ,  H01L29/42328 ,  H01L29/66545 ,  G11C2216/10 ,  H01L29/6653

Abstract: A simplified method for forming pairs of non-volatile memory cells using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. A pair of spaced apart insulation blocks are formed on the first polysilicon layer. Exposed portions of the first poly silicon layer are removed while maintaining a pair of polysilicon blocks of the first polysilicon layer each disposed under one of the pair of insulation blocks. A second polysilicon layer is formed over the substrate and the pair of insulation blocks in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed between the pair of insulation blocks), a second polysilicon block (disposed adjacent an outer side of one insulation block), and a third polysilicon block (disposed adjacent an outer side of the other insulation block).

公开(公告)号：US20220293756A1

公开(公告)日：2022-09-15

申请号：US17346524

申请日：2021-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Leo Xing ,  CHUNMING WANG ,  XIAN LIU ,  NHAN DO ,  GUO XIANG SONG

IPC: H01L29/423 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming a memory device that includes forming a first insulation layer, a first conductive layer, and a second insulation layer on a semiconductor substrate, forming a trench in the second insulation layer to expose the upper surface of the first conductive layer, performing an oxidation process and a sloped etch process to reshape the upper surface to a concave shape, forming a third insulation layer on the reshaped upper surface, forming a conductive spacer on the third insulation layer, removing portions of the first conductive layer leaving a floating gate under the conductive spacer with the reshaped upper surface terminating at a side surface at a sharp edge, and forming a word line gate laterally adjacent to and insulated from the floating gate. The conductive spacer includes a lower surface that faces and matches the shape of the reshaped upper surface.

公开(公告)号：US20220101920A1

公开(公告)日：2022-03-31

申请号：US17152696

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： CHUNMING WANG ,  XIAN LIU ,  GUO XIANG SONG ,  LEO XING ,  NHAN DO

IPC: G11C16/04 ,  G11C16/16 ,  H01L29/423 ,  H01L27/11521 ,  H01L27/11556

Abstract: A memory device includes a semiconductor substrate, first and second regions in the substrate having a conductivity type different than that of the substrate, with a channel region in the substrate extending between the first and second regions. The channel region is continuous between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region. A second floating gate is disposed over and insulated from a second portion of the channel region. A first coupling gate is disposed over and insulated from the first floating gate. A second coupling gate is disposed over and insulated from the second floating gate. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. An erase gate is disposed over and insulated from the word line gate.