摘要:
Apparatus and systems, as well as methods and articles, may operate to select a microprocessor clock frequency responsive to a desired voltage and/or a desired temperature of operation.
摘要:
A method and chip design are provided for reducing power consumption. A first functional block having a phase logic circuit may be provided in a first area of a chip. A second functional block having an edge-triggered circuit may be provided in a second area of the chip. Edge-triggered circuits within the second functional block may be replaced with dual edge-triggered circuits. Phase logic circuits may be clocked by a full frequency clock signal and dual edge-triggered circuits may be clocked by a half-frequency clock signal.
摘要:
A method and chip design are provided for reducing power consumption. A first functional block having a phase logic circuit may be provided in a first area of a chip. A second functional block having an edge-triggered circuit may be provided in a second area of the chip. Edge-triggered circuits within the second functional block may be replaced with dual edge-triggered circuits. Phase logic circuits may be clocked by a full frequency clock signal and dual edge-triggered circuits may be clocked by a half-frequency clock signal.
摘要:
A bias generator unit is provided that includes a central bias generator to provide a bias voltage, a local bias generator to receive the bias voltage and a reference voltage and to provide a forward body bias signal or a reverse body bias signal. The bias generator may include a charge pump to output (or provide) a reference voltage to a reference generator, which in turn provides reference signals to the central bias generator. As a result, the local bias generator may control the body bias signal provided by the local bias generator.
摘要:
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.
摘要:
In some embodiments, a method includes providing an integrated circuit (IC) die in a package. The IC die may have a metal layer on a back surface of the IC die. The method may also include applying a bias signal to the IC die via the metal layer.
摘要:
Apparatus, system and method for managing power of a main circuitry disposed on a main substrate using a control circuitry disposed on a control substrate, in a stacked relationship with the main substrate, are described herein.
摘要:
An apparatus for and method of modifying an IC design layout of an integrated circuit, comprising: accessing an initial IC design layout, with the initial layout including a plurality of MOSFET devices having a common substrate; and removing a plurality of body contacts of the MOSFET devices to create a first modified IC design layout.