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    Multilayer securing structure and method thereof for the protection of cryptographic keys and code
    1.
    发明授权
    Multilayer securing structure and method thereof for the protection of cryptographic keys and code 有权
    多层安全结构及其方法，用于保护加密密钥和密码

    公开(公告)号：US08938627B2

    公开(公告)日：2015-01-20

    申请号：US13382814

    申请日：2010-04-13

    申请人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    发明人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    IPC分类号： G06F21/00 ,  G06F21/87

    CPC分类号： G06F21/87 ,  G06F2221/2107 ,  G06F2221/2131 ,  H01L23/576 ,  H01L2224/16225 ,  Y10S257/922

    摘要： An arrangement for the protection of cryptographic keys and codes from being compromised by external tampering, wherein the arrangement is utilized within a multilayered securing structure. More particularly, there is provided a multilayered securing structure for the protection of cryptographic keys and codes, which may be subject to potential tampering when employed in computers and/or telecommunication systems. A method is provided for producing such multilayered securing structures within a modular substrate with the intent to protect cryptographic keys and codes which are employed in computers and/or telecommunication systems from the dangers of potential tampering or unauthorized access.

    摘要翻译： 用于保护加密密钥和代码免受外部篡改损害的布置，其中该布置在多层固定结构内使用。 更具体地，提供了一种用于保护加密密钥和代码的多层固定结构，当在计算机和/或电信系统中使用密钥和密码时，可能会受到潜在的篡改。 提供了一种用于在模块化基板内制造这种多层固定结构的方法，其目的是保护在计算机和/或电信系统中使用的加密密钥和代码免受潜在篡改或未授权访问的危险。

    MULTILAYER SECURING STRUCTURE AND METHOD THEREOF FOR THE PROTECTION OF CRYPTOGRAPHIC KEYS AND CODE
    2.
    发明申请
    MULTILAYER SECURING STRUCTURE AND METHOD THEREOF FOR THE PROTECTION OF CRYPTOGRAPHIC KEYS AND CODE 有权
    多层保护结构及其保护色谱和代码的方法

    公开(公告)号：US20120117666A1

    公开(公告)日：2012-05-10

    申请号：US13382814

    申请日：2010-04-13

    申请人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    发明人： Stefano S. Oggioni ,  Vincenzo Condorelli ,  Claudius Feger

    IPC分类号： G06F21/00

    CPC分类号： G06F21/87 ,  G06F2221/2107 ,  G06F2221/2131 ,  H01L23/576 ,  H01L2224/16225 ,  Y10S257/922

    摘要： An arrangement for the protection of cryptographic keys and codes from being compromised by external tampering, wherein the arrangement is utilized within a multilayered securing structure. More particularly, there is provided a multilayered securing structure for the protection of cryptographic keys and codes, which may be subject to potential tampering when employed in computers and/or telecommunication systems. A method is provided for producing such multilayered securing structures within a modular substrate with the intent to protect cryptographic keys and codes which are employed in computers and/or telecommunication systems from the dangers of potential tampering or unauthorized access.

    摘要翻译： 用于保护加密密钥和代码免受外部篡改损害的布置，其中该布置在多层固定结构内使用。 更具体地，提供了一种用于保护加密密钥和代码的多层固定结构，当在计算机和/或电信系统中使用密钥和密码时，可能会受到潜在的篡改。 提供了一种用于在模块化基板内制造这种多层固定结构的方法，其目的是保护在计算机和/或电信系统中使用的加密密钥和代码免受潜在篡改或未授权访问的危险。

    CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD
    3.
    发明申请
    CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD 审中-公开
    用于高性能计算的芯片承载大尺寸硅和相关方法

    公开(公告)号：US20100164030A1

    公开(公告)日：2010-07-01

    申请号：US12347490

    申请日：2008-12-31

    申请人： Stefano S. Oggioni ,  Edmund D. Blackshear ,  Claudius Feger

    发明人： Stefano S. Oggioni ,  Edmund D. Blackshear ,  Claudius Feger

    IPC分类号： H01L23/08 ,  H01L31/0232 ,  H01L21/71

    CPC分类号： H01L23/145 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

    摘要： Embodiments of the present invention provide a system and method for manufacturing integrated circuit (IC) chip packages. In one embodiment, the integrated circuit (IC) chip package can include an IC chip and a substrate coupled to the IC chip. The substrate can include a glass fiber re-enforced epoxy core, a plurality copper circuitry containing particle re-enforced epoxy layers symmetrically-oriented to each surface of the glass fiber re-enforced epoxy core, and an outermost amorphous glass layer on each surface of the plurality of layers. The IC chip can be coupled to copper circuitry bonded to one of the outermost amorphous glass layers.

    摘要翻译： 本发明的实施例提供一种用于制造集成电路（IC）芯片封装的系统和方法。 在一个实施例中，集成电路（IC）芯片封装可以包括IC芯片和耦合到IC芯片的衬底。 基板可以包括玻璃纤维再强化的环氧树脂芯，多个铜电路，其包含对称地定向到玻璃纤维再强化环氧树脂芯的每个表面的颗粒再强化的环氧树脂层，以及每个表面上的最外面的非晶玻璃层 多层。 IC芯片可以耦合到结合到最外面的非晶玻璃层之一的铜电路。