公开(公告)号：US06995459B2

公开(公告)日：2006-02-07

申请号：US11063299

申请日：2005-02-22

申请人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

发明人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.

摘要翻译： 根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。 半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。 除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。 电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。 裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

公开(公告)号：US06927483B1

公开(公告)日：2005-08-09

申请号：US10383504

申请日：2003-03-07

申请人： Sun Goo Lee ,  Choon Heung Lee ,  Sang Ho Lee

发明人： Sun Goo Lee ,  Choon Heung Lee ,  Sang Ho Lee

IPC分类号： H01L23/04 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48227

摘要： A semiconductor package exhibiting efficient placement of semiconductor leads in a micro lead frame design is provided. An integrated circuit die is bonded to the top surfaces of leads, thereby allowing the leads to partially reside under the die. As a result, surface area on the bottom surface of the semiconductor package is recaptured. The die can be further bonded a die paddle if so desired. One or more channels can be cut into the bottom surface of the package in order to separate first and second leads. Such channels allow separate leads to be fabricated from a single lead member which is subsequently cut.

摘要翻译： 提供了一种在微引线框架设计中显示出半导体引线的有效放置的半导体封装。 集成电路管芯结合到引线的顶表面，从而允许引线部分地位于管芯下方。 结果，重新获得半导体封装的底表面上的表面积。 如果需要，模具可以进一步粘合模片。 可以将一个或多个通道切割到包装的底表面中，以分离第一和第二引线。 这样的通道允许单独的引线由随后切割的单个引线构件制造。

公开(公告)号：US06876068B1

公开(公告)日：2005-04-05

申请号：US10447012

申请日：2003-05-28

申请人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

发明人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.

摘要翻译： 根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。 半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。 除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。 电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。 裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

公开(公告)号：US06995448B2

公开(公告)日：2006-02-07

申请号：US10107656

申请日：2002-03-25

申请人： Sang Ho Lee ,  Jun Young Yang ,  Seon Goo Lee ,  Jong Hae Hyun ,  Choon Heung Lee

发明人： Sang Ho Lee ,  Jun Young Yang ,  Seon Goo Lee ,  Jong Hae Hyun ,  Choon Heung Lee

IPC分类号： H01L29/00 ,  H01L23/02

CPC分类号： H01L24/32 ,  H01L23/52 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/351 ,  Y10S257/927 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath the semiconductor die on the substrate. The semiconductor die may be mounted above the passive elements by mechanically bonding the semiconductor die to the passive elements, mounting the passive elements within a recess in the substrate or mounting the semiconductor using an adhesive retaining wall on the substrate that protrudes above and extends around the passive elements. The recess may include an aperture through the substrate to vent the package to the outside environment or may comprise an aperture through the substrate and larger than the semiconductor die, permitting the encapsulation to entirely fill the aperture, covering the die and the passive elements to secure them mechanically within the package.

公开(公告)号：US11141403B2

公开(公告)日：2021-10-12

申请号：US16061481

申请日：2016-12-13

申请人： MERCK SHARP & DOHME CORP. ,  John P. Caldwell ,  Ginny Dai Ho ,  Sookhee N. Ha ,  Sandra J. Koseoglu ,  Marc A. Labroli ,  Sang Ho Lee ,  Christina Madsen-Duggan ,  Mihir Mandal ,  Jianping Pan ,  Weidong Pan ,  Terry Roemer ,  Jing Su ,  Christopher Michael Tan ,  Zheng Tan ,  Hao Wang ,  Christine Yang ,  Shu-Wei Yang

发明人： John P. Caldwell ,  Ginny Dai Ho ,  Sookhee N. Ha ,  Sandra J. Koseoglu ,  Marc A. Labroli ,  Sang Ho Lee ,  Christina Madsen-Duggan ,  Mihir Mandal ,  Jianping Pan ,  Weidong Pan ,  Terry Roemer ,  Jing Su ,  Christopher Michael Tan ,  Zheng Tan ,  Hao Wang ,  Christine Yang ,  Shu-Wei Yang

IPC分类号： A61K31/397 ,  A61P31/04 ,  A61K31/407 ,  C07D235/08 ,  C07D401/04 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D471/04

摘要： Novel compounds of the structural formula I, and the pharmaceutically acceptable salts thereof, are inhibitors of TarO and may be useful in the prevention, treatment and suppression of diseases mediated by TarO, such as bacterial infections, including gram negative bacterial infections and gram positive bacterial infections such as MRSA and MRSE, alone or in combination with a β-lactam antibiotic.

公开(公告)号：US08762721B2

公开(公告)日：2014-06-24

申请号：US12670519

申请日：2008-06-12

申请人： Sun-Hwa Lim ,  Sang Ho Lee

发明人： Sun-Hwa Lim ,  Sang Ho Lee

IPC分类号： H04W12/04

CPC分类号： H04L9/0844 ,  H04L63/062 ,  H04L63/0892 ,  H04L2209/80 ,  H04W12/04

摘要： A method for a terminal including a first media access control (MAC) layer and a second MAC layer to create an authorization key includes performing a first network entry process to a base station through the first MAC layer, and performing a second network entry process for a frequency overlay to the base station through the second MAC layer. In this instance, the first network entry process includes acquiring a key for generating an authorization key through an authentication process according to an authentication method negotiated with the base station, and generating a first authorization key through the key for generating the authorization key. The second network entry process includes generating a second authorization key by using the key generated in the first network entry process for generating the authorization key.

摘要翻译： 一种包括第一媒体接入控制（MAC）层和第二MAC层以创建授权密钥的终端的方法包括：通过第一MAC层对基站执行第一网络进入过程，并且执行第二网络进入处理， 通过第二MAC层对基站的频率覆盖。 在这种情况下，第一网络进入处理包括通过根据与基站协商的认证方法的认证处理来获取用于生成授权密钥的密钥，以及通过用于生成授权密钥的密钥生成第一授权密钥。 第二网络进入处理包括通过使用在第一网络进入处理中生成的密钥来生成授权密钥来产生第二授权密钥。

公开(公告)号：US08660053B2

公开(公告)日：2014-02-25

申请号：US13335834

申请日：2011-12-22

申请人： Jee Hyeon Na ,  Dae Ik Kim ,  Chul Park ,  Sang Ho Lee

发明人： Jee Hyeon Na ,  Dae Ik Kim ,  Chul Park ,  Sang Ho Lee

IPC分类号： H04H20/71 ,  H04W4/00

CPC分类号： H04W4/06 ,  H04L5/0007 ,  H04L5/0087 ,  H04L5/0094 ,  H04W48/16 ,  H04W88/08

摘要： Disclosed is a method for receiving MBMS services from a base station supporting multi-carriers, including: receiving first system information including information on all the carriers; receiving second system information including information on multi-carriers supported by the base station; receiving MBMS control information through an MBMS control channel; and receiving the MBMS services through an MBMS transmission channel based on the MBMS control information.

摘要翻译： 公开了一种从支持多载波的基站接收MBMS业务的方法，包括：接收包含所有载波信息的第一系统信息; 接收包括由所述基站支持的多载波信息的第二系统信息; 通过MBMS控制信道接收MBMS控制信息; 以及基于MBMS控制信息通过MBMS传输信道接收MBMS服务。

公开(公告)号：US08649312B2

公开(公告)日：2014-02-11

申请号：US13330629

申请日：2011-12-19

申请人： Dae Ik Kim ,  Jee Hyeon Na ,  Jung Mo Moon ,  Sang Ho Lee

发明人： Dae Ik Kim ,  Jee Hyeon Na ,  Jung Mo Moon ,  Sang Ho Lee

IPC分类号： H04H20/71 ,  G06F11/00

CPC分类号： H04W4/06

摘要： A method and apparatus for multimedia broadcast and multicast service (MBMS) counting is provided. A user equipment (UE) may transmit selected service information to a multi-cell and multicast coordination entity (MCE) through a target evolved node base station (eNB), every time that a service requiring counting is received or cancelled and thus, the MCE may accurately manage a number of UEs that receive a service for each eNB. Also, the use may transmit selected service information to the MCE through the target eNB every time that the UE enters a new cell and thus, the MCE may accurately manage a number of UEs that receive a service for each eNB.

摘要翻译： 提供了一种用于多媒体广播和多播服务（MBMS）计数的方法和装置。 每当接收或取消需要计数的服务时，用户设备（UE）可以通过目标演进节点基站（eNB）向多小区和多播协调实体（MCE）发送所选择的服务信息，因此，MCE 可以准确地管理为每个eNB接收服务的多个UE。 此外，每当UE进入新小区时，使用可以通过目标eNB将选定的服务信息发送到MCE，因此，MCE可以准确地管理为每个eNB接收服务的UE的数量。

公开(公告)号：US20130203726A1

公开(公告)日：2013-08-08

申请号：US13583480

申请日：2011-03-04

申请人： Terry Roemer ,  Sang Ho Lee ,  Lisa Wang Jarantow

发明人： Terry Roemer ,  Sang Ho Lee ,  Lisa Wang Jarantow

IPC分类号： A61K31/545 ,  A61K31/397 ,  A61K31/4025 ,  A61K31/437

CPC分类号： A61K31/545 ,  A61K31/198 ,  A61K31/397 ,  A61K31/4025 ,  A61K31/407 ,  A61K31/43 ,  A61K31/437 ,  A61K45/06 ,  A61K2300/00

摘要： The present invention relates to the use of inhibitors of FtsZ, an ancestral tubulin of prokaryotes, to restore susceptibility to β-lactam antibiotics, including carbapenems and cephalosporins, particularly in methicillin-resistant Staphylococcus aureus (MRSA), methicillin-resistant Staphyloccus epidermis (MRSE), and other coagulase negative staphylococci (MRCNS).

摘要翻译： 本发明涉及使用原核生物的祖先微管蛋白FtsZ的抑制剂来恢复对β-内酰胺类抗生素（包括碳青霉烯类和头孢菌素）的敏感性，特别是耐甲氧西林金黄色葡萄球菌（MRSA），甲氧西林耐药性葡萄球菌表皮（MRSE） ）和其他凝固酶阴性葡萄球菌（MRCNS）。

公开(公告)号：US08280401B2

公开(公告)日：2012-10-02

申请号：US12676455

申请日：2008-08-25

申请人： Jee Hyeon Na ,  Sang Ho Lee

发明人： Jee Hyeon Na ,  Sang Ho Lee

IPC分类号： H04W64/00 ,  H04W68/00

CPC分类号： H04W68/02

摘要： The present invention relates to a method of managing a paging group in a mobile terminal that is in an idle mode. A method of managing a paging group according to an exemplary embodiment of the invention includes: collecting paging group ID information including paging group levels and local IDs; determining, on the basis of the collected paging group ID information, whether or not a location update occurs; and if it is determined that the location update occurs, comparing a location update cycle according to a location update time with a threshold value, selecting a paging group level on the basis of the comparison result, and selecting a paging group corresponding to the selected paging group level.

摘要翻译： 本发明涉及管理处于空闲模式的移动终端中的寻呼组的方法。 根据本发明的示例性实施例的管理寻呼组的方法包括：收集包括寻呼组级别和本地ID的寻呼组ID信息; 基于所收集的寻呼组ID信息确定是否发生位置更新; 并且如果确定位置更新发生，则根据位置更新时间与阈值比较位置更新周期，基于比较结果选择寻呼组级别，并且选择与所选寻呼相对应的寻呼组 组级别。