Article comprising magnetoresistive material
    2.
    发明授权
    Article comprising magnetoresistive material 失效
    文章包括磁阻材料

    公开(公告)号:US5549977A

    公开(公告)日:1996-08-27

    申请号:US228168

    申请日:1994-04-15

    摘要: A magnetoresistance ratio of 200% (absolute value) or more at room temperature in a field of 6T can be achieved in a layer of material of nominal composition XMnO.sub.y (X is La and at least one of Ca, Sr and Ba, y in the range 2-3.5), if, after formation of the layer, the layer is heat treated in an oxygen-rich (O.sub.2 partial pressure greater than that of air) atmosphere, typically in flowing O.sub.2. The temperature and duration of the heat treatment are in the range 300.degree.-850.degree.C. and 10 minutes-12 hours, and are selected to result in the desired ratio of 200% or more.

    摘要翻译: 在标称组成XMnOy(X是La)和Ca,Sr和Ba,y中的至少一个的材料层中,可以在6T的场中在室温下达到200%(绝对值)或更高的磁阻比 范围2-3.5),如果在层的形成之后,该层在富氧(O 2分压大于空气的气氛)气氛中,通常在流动的O 2中进行热处理。 热处理的温度和持续时间在300℃-850℃和10分钟-12小时的范围内,并且选择达到所需比例为200%以上。

    Solder medium for circuit interconnection
    3.
    发明授权
    Solder medium for circuit interconnection 失效
    焊接介质用于电路互连

    公开(公告)号:US5509815A

    公开(公告)日:1996-04-23

    申请号:US255687

    申请日:1994-06-08

    摘要: Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

    摘要翻译: 具有至少两个部件的电子设备配线接触焊盘在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成,使得至少两个焊丝与配合焊盘接触,并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成,该焊丝具有与直径的长宽比的高纵横比。 或者,复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

    Magnetoresistive current sensor having high sensitivity
    4.
    发明授权
    Magnetoresistive current sensor having high sensitivity 失效
    具有高灵敏度的磁阻电流传感器

    公开(公告)号:US5461308A

    公开(公告)日:1995-10-24

    申请号:US176366

    申请日:1993-12-30

    IPC分类号: G01R15/20 H01L43/08 G01R33/00

    CPC分类号: G01R15/205

    摘要: The present inventors have discovered that a compact, highly sensitive current sensor can be made for any inductive component having an air gap in its magnetic path by disposing a layer of magnetoresistive material in the path of the fringing magnetic field. In the preferred embodiment, a thin magnetoresistive film of La.sub.w Ca.sub.x Mn.sub.y O.sub.z on a LaAlO.sub.3 /Al.sub.2 O.sub.3 substrate provides a high sensitivity in the range of 1-100 mV/ampere of DC current in the inductive component. The current sensor consumes a very small amount of power and provides the desirable electrical isolation between the sensor and the active device circuit.

    摘要翻译: 本发明人已经发现,通过在边缘磁场的路径中设置一层磁阻材料,可以为任何在其磁路中具有气隙的电感元件制造紧凑,高灵敏度的电流传感器。 在优选实施例中,LaAlO 3 / Al 2 O 3衬底上的LawCaxMnyOz的薄磁阻膜在电感元件中提供1-100mV /安培的DC电流的高灵敏度。 电流传感器消耗非常少量的功率并且在传感器和有源器件电路之间提供期望的电隔离。

    Magnetoresistive oxide material and articles comprising the material
    5.
    发明授权
    Magnetoresistive oxide material and articles comprising the material 失效
    磁阻氧化物材料和包含该材料的制品

    公开(公告)号:US5538800A

    公开(公告)日:1996-07-23

    申请号:US315160

    申请日:1994-09-29

    摘要: Materials of composition La.sub.v X.sub.w M.sub.y Mn.sub.z O.sub.x, with x selected from Mg, Sc, Al, Zn, Cd, In and the rare earths that have an ionic radius smaller than that of La, with M selected from Ca, Sr, Ba and Pb, and with v, w, y, z and x in the ranges 0.45-0.85, 0.01-0.20, 0.20-0.45, 0.7-1.3 and 2.5-3.5, respectively, can have substantially improved magnetoresistance (MR) ratios, as compared to the corresponding X-free comparison material. In particular, the novel materials in polycrystalline (or non-epitaxial thin film) form can have relatively large MR ratios. For instance, polycrystalline La.sub.0.60 Y.sub.0.07 Ca.sub.0.33 MnO.sub.x had a peak MR ratio in excess of 10,000% (in absolute value) in a field of 6 T.

    摘要翻译: 组成材料LavXwMyMnzOx,x选自Mg,Sc,Al,Zn,Cd,In以及离子半径小于La的稀土,M选自Ca,Sr,Ba和Pb,以及v 分别为0.45-0.85,0.01-0.20,0.20-0.45,0.7-1.3和2.5-3.5的范围内的w,y,z和x可以具有基本上改善的磁阻(MR)比, 免费比较材料。 特别地,多晶(或非外延薄膜)形式的新型材料可以具有相对大的MR比。 例如,多晶La0.60Y0.07Ca0.33MnOx在6T的场中具有超过10,000%(绝对值)的峰值MR比。

    Lead-free low melting solder with improved mechanical properties
    6.
    发明授权
    Lead-free low melting solder with improved mechanical properties 失效
    无铅低熔点焊料具有改善的机械性能

    公开(公告)号:US5569433A

    公开(公告)日:1996-10-29

    申请号:US335619

    申请日:1994-11-08

    CPC分类号: C22C13/02 B23K35/264

    摘要: We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

    摘要翻译: 我们惊奇地发现,低于1重量%的少量Ag对于使Bi-Sn合金的应变率敏感性降低是有效的,而不会有害地影响合金的熔融特性。 包含至少40重量%Bi,40%至60%Sn和0.05至1%Ag之间的无铅焊料组合物在相同加工条件下将焊料的总伸长率提高至少20%是有效的 。 此外,焊料没有不希望的含Ag相,熔点超过Pb-Sn二元共晶合金的183℃熔点。 在优选的实施方案中,组合物包含54.75%Bi,45%Sn和0.25%Ag。

    Voltage proportional replication device using magnetoresistive sensing
elements
    7.
    发明授权
    Voltage proportional replication device using magnetoresistive sensing elements 失效
    使用磁阻感测元件的电压比例复制器件

    公开(公告)号:US5512818A

    公开(公告)日:1996-04-30

    申请号:US220768

    申请日:1994-03-31

    CPC分类号: G01R15/205

    摘要: In accordance with the present invention, a voltage proportional replication device comprises an input electromagnet responsive to an input voltage for producing a magnetic field in proportion to the input voltage; and a first magnetoresistive sensing element disposed within the field of the input electromagnet. The device further includes an adjustable source of output voltage; an output electromagnet responsive to the output voltage for producing a magnetic field in proportion to the output voltage; and a second magnetoresistive sensing element disposed within the field of the output electromagnet. A control circuit for controlling the adjustable output voltage maintains a constant ratio between the resistances of the first and second magnetoresistive elements, thereby maintaining a constant ratio between the input voltage and the output voltage.

    摘要翻译: 根据本发明,电压比例复制装置包括响应于输入电压的输入电磁体,用于产生与输入电压成比例的磁场; 以及设置在输入电磁体的场内的第一磁阻感测元件。 该装置还包括可调节的输出电压源; 响应于输出电压的输出电磁体,用于产生与输出电压成比例的磁场; 以及设置在输出电磁体的场内的第二磁阻感测元件。 用于控制可调输出电压的控制电路在第一和第二磁阻元件的电阻之间保持恒定的比例,从而保持输入电压和输出电压之间的恒定比率。

    Article comprising magnetoresistive oxide of La, Ca, Mn additionally
containing either of both of Sr and Ba
    8.
    发明授权
    Article comprising magnetoresistive oxide of La, Ca, Mn additionally containing either of both of Sr and Ba 失效
    包含另外含有Sr和Ba两者之一的La,Ca,Mn的磁阻氧化物的文章

    公开(公告)号:US5411814A

    公开(公告)日:1995-05-02

    申请号:US187668

    申请日:1994-01-26

    摘要: We have discovered that the addition of a relatively small amount of Sr and/or Ba to La-Ca-Mn-O can yield material of improved magnetoresistive properties at room temperature and in a small applied field, as compared to the analogous Sr and/or Ba-free material. An exemplary composition is La.sub.0.55 Ca.sub.0.25 Sr.sub.0.08 MnO.sub.x. Material according to the invention has a substantially larger value of .vertline.d.rho./dH.vertline. than the analogous comparison material at 25.degree. C. and H.ltoreq.0.05 Tesla. Preferred compositions also can exhibit a substantially linear dependence of resistivity on applied magnetic field under these conditions, as well as have a relatively large value of zero field resistivity. The novel materials can advantageously be used in applications that involve sensing of a magnetic field, or of changes in such a field.

    摘要翻译: 我们已经发现,与类似的Sr和/或Ca相比,在La-Ca-Mn-O中添加相对少量的Sr和/或Ba可以产生在室温和小的施加场中改进的磁阻性质的材料, 或不含Ba的材料。 示例性组合物是La0.55Ca0.25Sr0.08MnOx。 根据本发明的材料具有显着更大的值| d rho / dH | 在25℃和H <0.05特斯拉的类似比较材料。 优选的组合物还可以在这些条件下表现出对所施加的磁场的电阻率的基本上线性的依赖性,并且具有相对较大的零场电阻率值。 该新型材料可以有利地用于涉及感测磁场或这种场的变化的应用中。

    Solder medium for circuit interconnection
    10.
    发明授权
    Solder medium for circuit interconnection 失效
    焊接介质用于电路互连

    公开(公告)号:US5618189A

    公开(公告)日:1997-04-08

    申请号:US588193

    申请日:1996-01-18

    摘要: Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

    摘要翻译: 具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成,使得至少两个焊丝与配合焊盘接触,并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成,该焊丝具有与其直径的长宽比的高纵横比。 或者,复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。