公开(公告)号：US20110317328A1

公开(公告)日：2011-12-29

申请号：US13166993

申请日：2011-06-23

申请人： Susumu TANIGUCHI ,  Satoshi Kurimoto ,  Shintaro Tokumitsu ,  Ryugen Yanagibashi ,  Miyuki Yanagida ,  Hisayuki Abe

发明人： Susumu TANIGUCHI ,  Satoshi Kurimoto ,  Shintaro Tokumitsu ,  Ryugen Yanagibashi ,  Miyuki Yanagida ,  Hisayuki Abe

IPC分类号： H01G4/12 ,  H01C7/10

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30

摘要： An array-type ceramic electronic component C1 includes a ceramic body 1 in which internal electrodes are buried and a plurality of terminal electrodes 11 to 16 formed on the ceramic body 1. The terminal electrodes 11 to 16 have electrode layers formed by baking a conductive green sheet.

摘要翻译： 阵列型陶瓷电子部件C1包括埋设有内部电极的陶瓷体1和形成在陶瓷体1上的多个端子电极11〜16。端子电极11〜16具有通过将导电性绿色 片。

公开(公告)号：US20100202098A1

公开(公告)日：2010-08-12

申请号：US12686651

申请日：2010-01-13

申请人： Miyuki YANAGIDA ,  Taketo Sasaki ,  Satoshi Kurimoto ,  Masahiko Konno ,  Yuki Morita ,  Hisayuki Abe

发明人： Miyuki YANAGIDA ,  Taketo Sasaki ,  Satoshi Kurimoto ,  Masahiko Konno ,  Yuki Morita ,  Hisayuki Abe

IPC分类号： H01G4/008 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/2325

摘要： A ceramic electronic part 100 having a chip element 1 having internal electrodes embedded therein, and terminal electrodes 3 that cover the end faces 11 of the chip element 1 having an exposed internal electrode and parts of the side faces 13,15 orthogonal to the end faces 11, and that are electrically connected to the internal electrodes, wherein the terminal electrodes 3 include a first electrode layer and a second electrode layer with a lower glass component content than the first electrode layer, in that order from the chip element 1 side, the second electrode layer being formed covering part of the first electrode layer on the side faces 13,15.

摘要翻译： 具有嵌入有内部电极的芯片元件1的陶瓷电子部件100和覆盖具有暴露的内部电极的芯片元件1的端面11和与端面正交的部分侧面13,15的端子电极3 11，并且与内部电极电连接，其中端子电极3包括第一电极层和具有比第一电极层低的玻璃成分含量的第二电极层，从芯片元件1侧起依次为 第二电极层被形成为覆盖在侧面13,15上的第一电极层的一部分。

公开(公告)号：US08254083B2

公开(公告)日：2012-08-28

申请号：US12851106

申请日：2010-08-05

申请人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

发明人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

IPC分类号： H01G4/06

CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

公开(公告)号：US08291585B2

公开(公告)日：2012-10-23

申请号：US12195772

申请日：2008-08-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

摘要翻译： 形成具有端面和侧面的大致长方体形状的芯片元件（形成芯片元件的步骤）。 形成导电性生片（形成导电性生片的工序）。 在芯片元件的端面施加导电性糊剂（涂敷导电糊剂的步骤）。 形成芯片元件，其中导电生片通过施加到芯片元件的端面上的导电膏（附着导电片的步骤）附着到端表面。 在安装的步骤中，导电性生片在侧面侧的端面位于侧面的外侧，并且施加到端面的导电糊被压出到 导电生片和脊部。

公开(公告)号：US20110051314A1

公开(公告)日：2011-03-03

申请号：US12851106

申请日：2010-08-05

申请人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

发明人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

IPC分类号： H01G4/06 ,  H01C7/10 ,  H01F27/28 ,  B23K1/20

CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

公开(公告)号：US20090053853A1

公开(公告)日：2009-02-26

申请号：US12195772

申请日：2008-08-21

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Hisayuki Abe ,  Taketo Sasaki ,  Yoji Tozawa ,  Osamu Hirose

IPC分类号： H01R43/00 ,  H01L21/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

摘要翻译： 形成具有端面和侧面的大致长方体形状的芯片元件（形成芯片元件的步骤）。 形成导电性生片（形成导电性生片的工序）。 在芯片元件的端面施加导电性糊剂（涂敷导电糊剂的步骤）。 形成芯片元件，其中导电生片通过施加到芯片元件的端面上的导电膏（附着导电片的步骤）附着到端表面。 在安装的步骤中，导电性生片在侧面侧的端面位于侧面的外侧，并且施加到端面的导电糊被压出到 导电生片和脊部。

公开(公告)号：US07673382B2

公开(公告)日：2010-03-09

申请号：US11641911

申请日：2006-12-20

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Shirou Ootsuki

IPC分类号： H01C17/28

CPC分类号： H01G13/006 ,  Y10T29/49098 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

公开(公告)号：US07487815B2

公开(公告)日：2009-02-10

申请号：US11183751

申请日：2005-07-19

申请人： Ko Onodera ,  Satoshi Kurimoto

发明人： Ko Onodera ,  Satoshi Kurimoto

IPC分类号： B32B37/22 ,  B32B38/10

CPC分类号： H01G13/006 ,  Y10S156/922 ,  Y10S156/941 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T156/11 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1707 ,  Y10T156/19 ,  Y10T156/1906

摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

摘要翻译： 本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低 从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低， 导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。

公开(公告)号：US20060112546A1

公开(公告)日：2006-06-01

申请号：US11288203

申请日：2005-11-29

申请人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

发明人： Ko Onodera ,  Satoshi Kurimoto ,  Yoji Tozawa ,  Seiichi Nakagawa

IPC分类号： B05D5/12

CPC分类号： H01L23/4828 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/0781 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  Y10T29/49224

摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of fonning an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

摘要翻译： 本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。 为了实现该目的，根据本发明的外部电极的制造方法包括：通过施加导电膏20在构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 从面向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和电极部分301b连接在分别与侧面30a和侧面30b相邻的芯片30的底面上的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

公开(公告)号：US07515028B1

公开(公告)日：2009-04-07

申请号：US12213753

申请日：2008-06-24

申请人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

发明人： Shinichi Sato ,  Satoshi Kurimoto ,  Makoto Morita ,  Akira Takashima ,  Sumio Takahashi ,  Yoshiaki Kitajima

IPC分类号： H01F5/00

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F41/10

摘要： A coil component having a low profile and being conducive to high-density mounting. The coil component includes a core 2 having a coil winding portion, and first and second flanges disposed on either end of the coil winding portion. The second flange is adapted to be mounted on a circuit board, and is configured of a substantially octagonal bottom surface having first and second peripheral surfaces and first through fourth omitted peripheral surfaces. The first terminal electrode is disposed across the first omitted peripheral surface and a part of the bottom surface, and the second terminal electrode is disposed across the second omitted peripheral surface and part of the bottom surface separated from the first terminal electrode. A winding is wound over the coil winding portion and has a first end electrically connected to the first terminal electrode at the first omitted peripheral surface, and a second end electrically connected to the second terminal electrode at the second omitted peripheral surface.

摘要翻译： 具有低轮廓并有利于高密度安装的线圈部件。 线圈部件包括具有线圈绕组部分的芯体2和设置在线圈绕组部分的任一端的第一和第二凸缘。 第二凸缘适于安装在电路板上，并且由具有第一和第二外围表面以及第一至第四省略的外围表面的基本上八边形的底表面构成。 第一端子电极跨越第一省略的外周表面和底表面的一部分，并且第二端子电极跨越第二省略的外围表面和与第一端子电极分离的底表面的一部分。 绕组缠绕在线圈绕组部分上，并且在第一省略的外围表面上具有与第一端子电连接的第一端，以及在第二省略的外围表面与第二端子电连接的第二端。