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公开(公告)号:US4426341A
公开(公告)日:1984-01-17
申请号:US411759
申请日:1982-08-26
申请人: Susumu Tsuzuku , Aizo Kaneda , Junichi Saeki , Masayoshi Aoki
发明人: Susumu Tsuzuku , Aizo Kaneda , Junichi Saeki , Masayoshi Aoki
IPC分类号: H01L21/56 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/26 , B29C45/76 , B29C45/77 , B29G3/00
摘要: A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.
摘要翻译: 一种用于通过包括用于感测模具中的树脂压力的树脂压力传感器的柱塞的树脂填充模具的至少一个模腔的传送成型机,以及用于控制施加到柱塞以驱动其的压力的控制装置 以这样的方式,将高于保持压力的任意选择的一次压力施加到柱塞以驱动,直到被模具中的树脂压力传感器检测到的压力中的树脂的压力达到预定压力水平 并且在由模具中的树脂压力传感器感测到的模具中充填的树脂的压力超过预定压力水平之后,将对应于保持压力的次级压力施加到柱塞以驱动其,并且警告装置 当施加到柱塞驱动的压力已经超过预定压力时发出警告。
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公开(公告)号:US4411609A
公开(公告)日:1983-10-25
申请号:US255102
申请日:1981-04-17
申请人: Masaki Yoshii , Hidemi Sato , Aizo Kaneda , Masayoshi Aoki , Hitoshi Yokono , Mitsunori Oka
发明人: Masaki Yoshii , Hidemi Sato , Aizo Kaneda , Masayoshi Aoki , Hitoshi Yokono , Mitsunori Oka
CPC分类号: B29C45/77
摘要: A method of and an apparatus for molding a plastic wherein the injection pressure (transfer pressure) is switched to a holding pressure when the internal pressure of the mold cavity sensed by a pressure sensor reaches a predetermined injection pressure (transfer pressure), to initiate holding of the pressure applied to the cavity. The holding pressure is removed when the internal pressure thereof becomes zero or in accordance with the detection of a predetermined inflection point in the internal pressure which is indicative of a gate sealing point in the mold cavity or is brought to a predetermined value close to zero. The molded articles are of high precision finishes, and conservation of energy and natural resources can be achieved.
摘要翻译: 一种用于模制塑料的方法和装置,其中当由压力传感器感测的模腔的内部压力达到预定的注射压力(转移压力)时,将注射压力(转移压力)切换到保持压力,以启动保持 施加到空腔的压力。 当其内部压力变为零时,或者根据在内部压力中的预定拐点的检测来取消保持压力,该内部压力指示模腔中的浇口密封点或达到接近零的预定值。 模塑制品具有高精度的表面处理,可以实现节约能源和自然资源。
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公开(公告)号:US06855626B2
公开(公告)日:2005-02-15
申请号:US10637552
申请日:2003-08-11
申请人: Yukio Sato , Akihiro Oku , Masayoshi Aoki
发明人: Yukio Sato , Akihiro Oku , Masayoshi Aoki
IPC分类号: H01L21/66 , H01L23/544 , H05K1/02 , H05K3/00 , H05K3/24 , H01L21/4763
CPC分类号: H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2223/54473 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15173 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/0266 , H05K3/0052 , H05K3/242 , H05K2201/09227 , H05K2201/09936 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2924/01004
摘要: A method for producing a wiring board for a semiconductor package having a base substrate with first and second surfaces; a wiring layer including wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information formed for the respective semiconductor element mounting areas, the individual patterns having a different shape for each of the respective semiconductor element mounting areas. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.
摘要翻译: 一种半导体封装用配线基板的制造方法,具有:具有第一表面和第二表面的基底基板; 布线层,其包括形成在所述第一表面和所述第二表面中的至少一个上的布线图案; 多个半导体元件安装区域,形成在其上形成有布线层的基底基板的表面上; 以及作为为各个半导体元件安装区域形成的位置信息的各个图案,各个图案对于各个半导体元件安装区域具有不同的形状。 作为位置信息的各个图案形成在各个半导体元件安装区域的周边区域上。
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公开(公告)号:US06780681B2
公开(公告)日:2004-08-24
申请号:US10310889
申请日:2002-12-06
申请人: Masayoshi Aoki
发明人: Masayoshi Aoki
IPC分类号: H01L2144
CPC分类号: H01L23/12 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: An insulating substrate has a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction extending from one to the other end of the substrate, and a resin transmitting port. The resin transmitting port is located at a position in the vicinity of the one end along the predetermined direction and other than the semiconductor chip mounting section arranged nearest to the one end. A semiconductor chip is mounted on a respective semiconductor chip mounting section. A mold defines a cavity, including first and second cavity sections on the respective surfaces of the substrate, in such a manner that the first and second cavities communicates with each other by means of the resin transmitting port. A sealing resin is rejected into the cavity, so that the resin flows through the resin transmitting port to fill both of the first and second cavity sections with the sealing resin.
摘要翻译: 绝缘基板具有沿着从基板的一端向另一端延伸的预定方向一个一个地布置的多个半导体芯片安装部和树脂传输端口。 树脂传输端口位于沿着预定方向在一端附近的位置,而不是最靠近一端设置的半导体芯片安装部分。 半导体芯片安装在相应的半导体芯片安装部分上。 模具限定了空腔,其包括在基板的相应表面上的第一和第二空腔部分,使得第一和第二空腔通过树脂传输端口彼此连通。 将密封树脂注入到空腔中,使得树脂流过树脂传输端口以用密封树脂填充第一和第二空腔部分。
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公开(公告)号:US07575454B1
公开(公告)日:2009-08-18
申请号:US12133752
申请日:2008-06-05
IPC分类号: H01R29/00
CPC分类号: H01R13/641 , H01R12/716 , H01R12/724 , H01R13/6582 , H01R13/7032 , H01R13/748
摘要: A receptacle that can detect the insertion and extraction of a plug includes: a receptacle shell having formed therein a plug insertion port into which the plug is inserted and from which the plug is extracted; a receptacle body provided inside the receptacle shell; a movable contact that is installed at a base portion of the receptacle body, the base portion faces a distal end of the plug inserted into the plug insertion port, and that is deformed elastically when pushed by the plug; and an immovable contact that is installed at the base portion, is normally spaced from the movable contact, and comes into contact with the movable contact when the movable contact is pushed by the plug and elastically deformed. The receptacle that can conform to the HDMI standard can be realized without adding any modification to main components relating to mating with a plug.
摘要翻译: 可以检测插塞的插入和插入的插座包括:插座壳体,其中形成有插头插入口,插头插入插座中,插头从中插入插头; 设置在所述容器壳体内的容器主体; 安装在所述插座主体的基部的可动触点,所述基部面向插入所述插头插入口的所述插头的前端,并且在被所述插头推压时弹性变形; 并且安装在基部的不可移动的触点通常与可动触头间隔开,并且当可动触头被插头推动并弹性变形时与触点接触。 可以实现符合HDMI标准的插座,而不需要对与插头配合有关的主要部件进行任何修改。
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公开(公告)号:US5726868A
公开(公告)日:1998-03-10
申请号:US575752
申请日:1995-12-20
申请人: Kazuya Koyama , Masayoshi Aoki , Jun Muramatsu , Tohru Masumoto , Masami Matsumoto , Kiyoshi Hosoi
发明人: Kazuya Koyama , Masayoshi Aoki , Jun Muramatsu , Tohru Masumoto , Masami Matsumoto , Kiyoshi Hosoi
摘要: A robbery-proof mechanism for a vehicle mounted electronic apparatus wherein a cover for covering the electronic apparatus is accommodated in the upper space of the electronic apparatus and can be driven by a small scale drive mechanism without moving the electronic apparatus. The robbery-proof mechanism includes: a frame mounted on the front of the vehicle mounted electronic apparatus, being rotative between a horizontal position and a vertical position; a cover capable of being inserted into a groove formed in the frame; a drive mechanism for driving the cover in the horizontal direction between a position in the groove of the frame and a position retracted from the frame; and a drive mechanism for driving an operation panel in the horizontal direction, wherein the frame is rotated to the horizontal position, the cover is then moved into the groove of the frame and the operation panel is moved backward, and the frame together with the cover is rotated to the vertical position to cover the operation panel with the cover.
摘要翻译: 一种用于车载电子设备的抢劫机构,其中用于覆盖电子设备的盖子容纳在电子设备的上部空间中,并且可以由小型驱动机构驱动而不移动电子设备。 防盗机构包括:安装在车载电子设备的前部的框架,在水平位置和垂直位置之间旋转; 能够插入到形成在框架中的凹槽中的盖子; 驱动机构,用于在所述框架的所述槽的位置和从所述框架缩回的位置之间沿水平方向驱动所述盖; 以及用于在水平方向上驱动操作面板的驱动机构,其中框架旋转到水平位置,然后将盖移动到框架的凹槽中,并且操作面板向后移动,并且框架与盖 旋转到垂直位置以覆盖操作面板。
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公开(公告)号:US5660924A
公开(公告)日:1997-08-26
申请号:US414764
申请日:1995-03-31
CPC分类号: F16L59/065 , E04B2001/7691 , Y10T428/249957 , Y10T428/249959 , Y10T428/249962 , Y10T428/249968 , Y10T428/252 , Y10T442/656
摘要: A vacuum heat insulator is provided which includes a vacuum heat-insulated space defined between a pair of spaced outer skin members, a portion of the space closer to one of the outer skin members being set as high-temperature side, with a portion closer to the other outer skin member being set as low-temperature side. A laminate is disposed at the high-temperature side of the vacuum heat-insulated space, and a board having an inorganic material is disposed at the low temperature side. The laminate includes inorganic sheet members and metallic foils with low heat emissivity, the sheet members and metallic foils being alternately laid in plural layers.
摘要翻译: 提供了一种真空绝热器,其包括限定在一对间隔开的外皮部件之间的真空绝热空间,更靠近一个外皮部件的空间的一部分被设定为高温侧,部分更靠近 另一个外皮部件被设定为低温侧。 在真空绝热空间的高温侧配置层叠体,在低温侧设置具有无机材料的基板。 层压体包括无机片材和具有低发射率的金属箔,片材和金属箔交替铺设成多层。
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公开(公告)号:US06949316B2
公开(公告)日:2005-09-27
申请号:US10846652
申请日:2004-05-17
申请人: Masayoshi Aoki
发明人: Masayoshi Aoki
CPC分类号: H01R12/88 , H01R4/5066 , H01R12/771 , H01R13/24
摘要: The present invention provides a connector able to be made thin so as to satisfy the needs of making an electronic device further light in weight, thin, short and compact. Therefore, the connector has a connector main body having a housing for storing a contactor and having an opening portion, and an actuator rotatably supported with respect to the connector main body. A flexible cable inserted into the opening portion and the contactor come in press contact with each other by the actuator and are electrically connected to each other in the rotation of the actuator. A metallic cover for covering a portion of the housing and having a receiving portion is arranged in the connector main body. When the actuator makes the flexible cable inserted into the opening portion come in press contact with the contactor, the receiving portion receives reaction force of the press contact. Thus, the thin type connector can be provided.
摘要翻译: 本发明提供一种可以制成薄型连接器,以满足使电子装置的重量轻,薄,短且紧凑化的需要。 因此,连接器具有连接器主体,其具有用于存储接触器并具有开口部的壳体和相对于连接器主体可旋转地支撑的致动器。 插入开口部的柔性电缆和接触器通过致动器彼此压接,并且在致动器的旋转中彼此电连接。 用于覆盖壳体的一部分并具有接收部分的金属盖布置在连接器主体中。 当致动器使插入开口部的柔性电缆与接触器压接时,接收部接收压接触的反作用力。 因此,可以提供薄型连接器。
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公开(公告)号:US06861764B2
公开(公告)日:2005-03-01
申请号:US10179981
申请日:2002-06-26
申请人: Yukio Sato , Akihiro Oku , Masayoshi Aoki
发明人: Yukio Sato , Akihiro Oku , Masayoshi Aoki
IPC分类号: H01L21/66 , H01L23/544 , H05K1/02 , H05K3/00 , H05K3/24
CPC分类号: H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2223/54473 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15173 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/0266 , H05K3/0052 , H05K3/242 , H05K2201/09227 , H05K2201/09936 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2924/01004
摘要: A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.
摘要翻译: 一种用于半导体封装的布线板包括具有第一和第二表面的基底基板; 由形成在所述第一表面和所述第二表面中的至少一个上的必要布线图形构成的布线层; 多个半导体元件安装区域,形成在其上形成有布线层的基底基板的表面上; 以及作为为各个半导体元件安装区域提供的位置信息的各个图案,各个图案具有用于各个半导体元件安装区域的特定形状。 作为位置信息的各个图案形成在各个半导体元件安装区域的周边区域上。
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公开(公告)号:US4916831A
公开(公告)日:1990-04-17
申请号:US265701
申请日:1988-11-01
申请人: Mitsuru Yasumura , Atsuo Ohike , Takao Ueda , Masayoshi Aoki , Tomio Suzuki , Makoto Horiai
发明人: Mitsuru Yasumura , Atsuo Ohike , Takao Ueda , Masayoshi Aoki , Tomio Suzuki , Makoto Horiai
CPC分类号: F26B11/049 , F26B5/04
摘要: A rotary dryer for drying and mixing particulate material, includes a shell having a pair of conical portions and provided with a jacket to which a hot fluid may be fed, the shell defining a chamber for the material to be dried and mixed. An air-tight closure for the chamber is provided with a jacket to which hot fluid may be fed and through which the material is charged and discharged. A rotary tube shaft extends horizontally from one end of the shell and along the horizontal axis of the shell, the rotary tube shaft being sheathed by a rotary joint pipe equipped with a bearing rotatably supporting the rotary tube shaft. The rotary tube shaft is provided with a plurality of communication paths which communicate with charge/discharge ports located on the rotary joint pipe during rotation of the rotary tube shaft in the rotary joint pipe, the communication paths connecting the jackets of the shell and the closure for feeding the hot fluid. An air nozzle is disposed along the internal wall of the shell and a stirrer including a rotational mixing blade are located within the shell to agitate the material, the stirrer being supported by the wall of the shell. A feeder pipe is air-tightly inserted in the rotary tube shaft, sheathing and evacuating pipe to communicate with a vacuum line and an air supply pipe connected to said air nozzle.
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