公开(公告)号：US4411609A

公开(公告)日：1983-10-25

申请号：US255102

申请日：1981-04-17

申请人： Masaki Yoshii ,  Hidemi Sato ,  Aizo Kaneda ,  Masayoshi Aoki ,  Hitoshi Yokono ,  Mitsunori Oka

发明人： Masaki Yoshii ,  Hidemi Sato ,  Aizo Kaneda ,  Masayoshi Aoki ,  Hitoshi Yokono ,  Mitsunori Oka

IPC分类号： B29C45/57 ,  B29C37/00 ,  B29C45/00 ,  B29C45/77 ,  B29C1/06

CPC分类号： B29C45/77

摘要： A method of and an apparatus for molding a plastic wherein the injection pressure (transfer pressure) is switched to a holding pressure when the internal pressure of the mold cavity sensed by a pressure sensor reaches a predetermined injection pressure (transfer pressure), to initiate holding of the pressure applied to the cavity. The holding pressure is removed when the internal pressure thereof becomes zero or in accordance with the detection of a predetermined inflection point in the internal pressure which is indicative of a gate sealing point in the mold cavity or is brought to a predetermined value close to zero. The molded articles are of high precision finishes, and conservation of energy and natural resources can be achieved.

摘要翻译： 一种用于模制塑料的方法和装置，其中当由压力传感器感测的模腔的内部压力达到预定的注射压力（转移压力）时，将注射压力（转移压力）切换到保持压力，以启动保持 施加到空腔的压力。 当其内部压力变为零时，或者根据在内部压力中的预定拐点的检测来取消保持压力，该内部压力指示模腔中的浇口密封点或达到接近零的预定值。 模塑制品具有高精度的表面处理，可以实现节约能源和自然资源。

公开(公告)号：US4753515A

公开(公告)日：1988-06-28

申请号：US870172

申请日：1986-06-02

申请人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Kiichi Suzuki

发明人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Kiichi Suzuki

IPC分类号： G02B6/40 ,  G02B6/38 ,  B29D11/00

CPC分类号： G02B6/3801 ,  G02B6/3885 ,  G02B6/3861 ,  G02B6/3865 ,  G02B6/3881 ,  G02B6/389 ,  G02B6/3893 ,  Y10S359/90

摘要： A connector means includes a connector housing provided with a plurality of bores which is defined by a pair of plastic bases each having a plurality of hemicycle grooves each of which has an inner diameter 1 to several .mu.m larger than an outer diameter of each of the optical cables to be connected. After the optical fibres are inserted into the respective bores and secured therein, one end surface of the connector housing is polished. A pair of connected housings are retained so that the polished end surfaces abut on each other thereby to attain a connection between a plurality of optical cables.

摘要翻译： 连接器装置包括连接器壳体，该连接器壳体设置有多个孔，其由一对塑料基座限定，每个塑料基座具有多个半圆形槽，每个半圆形槽具有比每个的每个的外径大1至数μm的内径 要连接的光缆。 在将光纤插入相应的孔并固定在其中之后，连接器壳体的一个端面被抛光。 保持一对连接的壳体，使得抛光的端面彼此抵接，从而获得多条光缆之间的连接。

公开(公告)号：US4484796A

公开(公告)日：1984-11-27

申请号：US319986

申请日：1981-11-10

申请人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Atsuyoshi Ohashi ,  Kiyohide Miyake ,  Toshiro Kodama ,  Kiichi Suzuki

发明人： Hidemi Sato ,  Aizo Kaneda ,  Hitoshi Yokono ,  Atsuyoshi Ohashi ,  Kiyohide Miyake ,  Toshiro Kodama ,  Kiichi Suzuki

IPC分类号： G02B6/38 ,  G02B7/26

CPC分类号： G02B6/3825 ,  G02B6/3865 ,  G02B6/3863

摘要： An optical fiber connector comprising a pair of plugs, a sleeve and a pair of cap nuts which is assembled at the site where optical fibers are installed, so as to connect the optical fibers with a high degree of positional accuracy. The plugs and the sleeve are molded of a composition including a synthetic resin added with a suitable content of a filler, such as glass beads.

摘要翻译： 一种光纤连接器，其包括一对插头，套筒和一对盖帽螺母，其组装在安装光纤的位置，以便以高度的位置精度连接光纤。 塞子和套筒由包含合成树脂的组合物模制而成，所述合成树脂添加有适当含量的填料，例如玻璃珠。

公开(公告)号：US4810089A

公开(公告)日：1989-03-07

申请号：US84076

申请日：1987-08-11

申请人： Takeo Murakoshi ,  Masaki Yoshii ,  Shigeo Tohyama ,  Sadao Minakawa ,  Aizo Kaneda

发明人： Takeo Murakoshi ,  Masaki Yoshii ,  Shigeo Tohyama ,  Sadao Minakawa ,  Aizo Kaneda

IPC分类号： G01L1/00 ,  G01L1/24 ,  G01N21/23

CPC分类号： G01L1/241

摘要： A photoelastic effect measuring device comprising a single white light source, a prism dispersing light emitted by said white light source and a variable slit device, which selects an arbitrary spectrum of light thus dispersed is disclosed, in which for a photoelastic effect measurement using white light, the slit width is opened totally so that all the light spectrum pass therethrough so as to pass through a sample to be measured and for a photoelastic effect measurement using a specified monochromatic light beam, the slit width is controlled so as to have a predetermined opening so that only a specified light spectrum can pass therethrough so as to pass through a sample to be measured.

摘要翻译： 公开了一种光弹效应测量装置，其包括单个白色光源，分散由所述白色光源发射的光的棱镜和可变狭缝装置，其可选择任意光散射的光，其中对于使用白光的光弹效应测量 ，全部开口狭缝宽度，使得所有的光谱通过其中以通过待测样品，并且使用指定的单色光束进行光弹效应测量，狭缝宽度被控制成具有预定的开口 使得只有指定的光谱可以通过其中才能通过要测量的样品。

公开(公告)号：US4786802A

公开(公告)日：1988-11-22

申请号：US711

申请日：1987-01-06

申请人： Masaki Yoshii ,  Shigeo Tohyama ,  Aizo Kaneda

发明人： Masaki Yoshii ,  Shigeo Tohyama ,  Aizo Kaneda

IPC分类号： G01L1/24 ,  G02F1/01

CPC分类号： G01L1/241

摘要： An apparatus for measuring photoelasticity permitting to control mechanical stress applied to an elastic body, by visualizing phase differences of polarized light transmitted by the elastic body is disclosed. In such a prior art apparatus a quarter wavelength plate was used in order to obtain circularly polarized light. However, the precision of the circularly polarized light is worsened, when it works in a wide wavelength region. To the contrary, in an apparatus according to this invention, circularly polarized light is obtained by means of Fresnel's rhombic body. As the result good circularly polarized light can be obtained for a wide wavelength region from the visible region to the near infrared region and control of products including thin films and semiconductor substrates can be effected by visualizing mechanical stress therein.

摘要翻译： 公开了一种用于测量光弹性的装置，其通过使由弹性体透射的偏振光的相位差可视化来控制施加到弹性体的机械应力。 在这种现有技术的装置中，为了获得圆偏振光，使用四分之一波长板。 然而，当在宽波长区域中工作时，圆偏振光的精度变差。 相反，在根据本发明的装置中，通过菲涅尔菱形体获得圆偏振光。 结果，从可视区域到近红外区域的宽波长区域可以获得良好的圆偏振光，并且可以通过可视化其中的机械应力来控制包括薄膜和半导体基板的产品。

公开(公告)号：US4426341A

公开(公告)日：1984-01-17

申请号：US411759

申请日：1982-08-26

申请人： Susumu Tsuzuku ,  Aizo Kaneda ,  Junichi Saeki ,  Masayoshi Aoki

发明人： Susumu Tsuzuku ,  Aizo Kaneda ,  Junichi Saeki ,  Masayoshi Aoki

IPC分类号： H01L21/56 ,  B29C43/00 ,  B29C45/00 ,  B29C45/02 ,  B29C45/26 ,  B29C45/76 ,  B29C45/77 ,  B29G3/00

CPC分类号： B29C45/77 ,  B29C45/02

摘要： A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.

摘要翻译： 一种用于通过包括用于感测模具中的树脂压力的树脂压力传感器的柱塞的树脂填充模具的至少一个模腔的传送成型机，以及用于控制施加到柱塞以驱动其的压力的控制装置 以这样的方式，将高于保持压力的任意选择的一次压力施加到柱塞以驱动，直到被模具中的树脂压力传感器检测到的压力中的树脂的压力达到预定压力水平 并且在由模具中的树脂压力传感器感测到的模具中充填的树脂的压力超过预定压力水平之后，将对应于保持压力的次级压力施加到柱塞以驱动其，并且警告装置 当施加到柱塞驱动的压力已经超过预定压力时发出警告。

公开(公告)号：US06531760B1

公开(公告)日：2003-03-11

申请号：US09558105

申请日：2000-04-25

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US06265782B1

公开(公告)日：2001-07-24

申请号：US09284131

申请日：1999-08-30

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US6072231A

公开(公告)日：2000-06-06

申请号：US066877

申请日：1998-04-28

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5914530A

公开(公告)日：1999-06-22

申请号：US52981

申请日：1998-04-01

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.