公开(公告)号：US20120262218A1

公开(公告)日：2012-10-18

申请号：US13512041

申请日：2010-12-01

申请人： Sven Klaka ,  Samuel Hartmann

发明人： Sven Klaka ,  Samuel Hartmann

IPC分类号： H03K17/06

CPC分类号： H03K17/127 ,  H02M1/088 ,  H02M2001/325 ,  H03K17/06

摘要： A system includes at least two power semiconductor chips being connected in parallel and including each a gate terminal for switching the power semiconductor chip in a blocking-state by a first gate voltage and for switching the power semiconductor chip in a conducting-state by a second gate voltage. The system includes further a control device adapted for applying the first or the second gate voltage to the gate terminals of the at least two power semiconductor chips. The control device is adapted for applying a third gate voltage to the gate terminal of the at least one remaining power semiconductor chip when a power semiconductor chip fails, and that the third gate voltage is higher than the second gate voltage.

摘要翻译： 一种系统包括并联连接的至少两个功率半导体芯片，每个功率半导体芯片包括：每个栅极端子，用于通过第一栅极电压将功率半导体芯片以阻塞状态切换，并将功率半导体芯片以导通状态切换第二栅极电压 栅极电压。 该系统还包括适于将第一或第二栅极电压施加到至少两个功率半导体芯片的栅极端子的控制装置。 所述控制装置适于在功率半导体芯片发生故障时向所述至少一个剩余功率半导体芯片的栅极端子施加第三栅极电压，并且所述第三栅极电压高于所述第二栅极电压。

公开(公告)号：US09000827B2

公开(公告)日：2015-04-07

申请号：US13512041

申请日：2010-12-01

申请人： Sven Klaka ,  Samuel Hartmann

发明人： Sven Klaka ,  Samuel Hartmann

IPC分类号： H03K17/06 ,  H03K17/12

CPC分类号： H03K17/127 ,  H02M1/088 ,  H02M2001/325 ,  H03K17/06

摘要： A system includes at least two power semiconductor chips being connected in parallel and including each a gate terminal for switching the power semiconductor chip in a blocking-state by a first gate voltage and for switching the power semiconductor chip in a conducting-state by a second gate voltage. The system includes further a control device adapted for applying the first or the second gate voltage to the gate terminals of the at least two power semiconductor chips. The control device is adapted for applying a third gate voltage to the gate terminal of the at least one remaining power semiconductor chip when a power semiconductor chip fails, and that the third gate voltage is higher than the second gate voltage.

摘要翻译： 一种系统包括并联连接的至少两个功率半导体芯片，每个功率半导体芯片包括：每个栅极端子，用于通过第一栅极电压将功率半导体芯片以阻塞状态切换，并将功率半导体芯片以导通状态切换第二栅极电压 栅极电压。 该系统还包括适于将第一或第二栅极电压施加到至少两个功率半导体芯片的栅极端子的控制装置。 所述控制装置适于在功率半导体芯片发生故障时向所述至少一个剩余功率半导体芯片的栅极端子施加第三栅极电压，并且所述第三栅极电压高于所述第二栅极电压。

公开(公告)号：US20100224674A1

公开(公告)日：2010-09-09

申请号：US12716412

申请日：2010-03-03

申请人： Chunlei LIU ,  Samuel Hartmann

发明人： Chunlei LIU ,  Samuel Hartmann

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： B22F3/003 ,  B22F7/062 ,  H01L21/67011 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29139 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014

摘要： The disclosure relates to bonding plural elements by sintering a bonding layer sandwiched between the elements. An exemplary embodiment includes a support frame; a clamping device; a reception region for receiving a stack including the plural elements, in-between which the bonding layer is arranged, wherein the stack is clamped when loaded into the reception region to permanently apply a sintering pressure. An exemplary method is also disclosed for bonding plural of elements using a sintering process. The method includes clamping the stack into a reception region of a fixture device, and applying heat to the stack and the bonding layer to perform a sintering process of the bonding layer.

摘要翻译： 本公开涉及通过烧结夹在元件之间的接合层来结合多个元件。 示例性实施例包括支撑框架; 夹紧装置; 用于接收包括所述多个元件的堆叠的接收区域，其间布置有所述接合层，其中当所述堆叠装载到所述接收区域中时，所述堆叠被夹持以永久地施加烧结压力。 还公开了一种用于使用烧结工艺粘合多个元件的示例性方法。 所述方法包括将所述堆叠夹持到固定装置的接收区域中，并且向所述堆叠和所述结合层施加热量以进行所述粘结层的烧结处理。

公开(公告)号：US08897015B2

公开(公告)日：2014-11-25

申请号：US13287428

申请日：2011-11-02

申请人： Lydia Feller ,  Samuel Hartmann

发明人： Lydia Feller ,  Samuel Hartmann

IPC分类号： H05K7/20 ,  H05K1/02 ,  H01L23/13 ,  H01L23/538 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/13 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminum, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other.

摘要翻译： 本公开涉及一种例如用于功率模块的基板，包括由金属形成的基体，例如铝，其中至少两个增强件彼此相邻地设置在基体中，并且其中加强件间隔开 除了彼此。

公开(公告)号：US08410368B2

公开(公告)日：2013-04-02

申请号：US12891402

申请日：2010-09-27

申请人： Samuel Hartmann ,  Dominik Truessel

发明人： Samuel Hartmann ,  Dominik Truessel

IPC分类号： H01R4/58

CPC分类号： H01L24/37 ,  H01L23/49811 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/00

摘要： An electrical conductor includes a primary electrical contact, at least one secondary electrical contact, and a connection element. The connection element electrically connects the first and the at least one secondary electrical contacts, and includes at least one plate-like region. Each plate-like region includes at least one deflection component with at least one first and at least one second pivot, wherein the first and second pivots of each deflection means are arranged such that each secondary electrical contact is movable relative to the primary electrical contact in a deflection direction, without creation of a shear force.

摘要翻译： 电导体包括主电接触，至少一个次电接触和连接元件。 连接元件电连接第一和至少一个次级电触点，并且包括至少一个板状区域。 每个板状区域包括具有至少一个第一和至少一个第二枢轴的至少一个偏转部件，其中每个偏转装置的第一和第二枢轴被布置成使得每个次级电接触件可相对于主电接触件移动 偏转方向，而不产生剪切力。

公开(公告)号：US20120199989A1

公开(公告)日：2012-08-09

申请号：US13431457

申请日：2012-03-27

申请人： Nicola Schulz ,  Samuel Hartmann

发明人： Nicola Schulz ,  Samuel Hartmann

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/01 ,  H01L23/4985 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48229 ,  H01L2224/4846 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/37099

摘要： Exemplary embodiments of the disclosure are directed to a circuit arrangement in which a power functional device and a conductor element are mounted and a method of manufacturing the same. The arrangement includes a substrate, a wiring layer provided on the substrate and electrically connected to the functional device and to the conductor element and an intermediate electric contact device. The intermediate electric contact device is mounted on the wiring layer to provide on the side opposite to the wiring layer a contact region for contacting the conductor element. The conductor element is contacting the intermediate electric contact device in the contact region which is opposite to an area, in which the electric contact device is fixed to the wiring layer.

摘要翻译： 本公开的示例性实施例涉及其中安装功率功能装置和导体元件的电路装置及其制造方法。 该布置包括基板，设置在基板上并电连接到功能元件和导体元件的布线层和中间电接触器件。 中间电接触装置安装在布线层上，以在与布线层相对的一侧提供用于接触导体元件的接触区域。 所述导体元件与所述接触区域接触，所述接触区域与所述电接触器件固定到所述布线层的区域相对。

公开(公告)号：US20120106087A1

公开(公告)日：2012-05-03

申请号：US13287428

申请日：2011-11-02

申请人： Lydia Feller ,  Samuel Hartmann

发明人： Lydia Feller ,  Samuel Hartmann

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H01L23/13 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminium, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other.

摘要翻译： 本公开涉及一种例如用于功率模块的基板，包括由金属形成的基体，例如铝，其中至少两个增强件彼此相邻地设置在基体中，并且其中加强件间隔开 除了彼此。