公开(公告)号：US20240176239A1

公开(公告)日：2024-05-30

申请号：US18282909

申请日：2022-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kenta AOSHIMA ,  Yutaro KOYAMA ,  Kazuyuki MATSUMURA ,  Hitoshi ARAKI

IPC: G03F7/037 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22

CPC classification number: G03F7/037 ,  C08G69/26 ,  C08G73/1053 ,  C08G73/22

Abstract: It is intended to provide a negative type photosensitive resin composition that ensures high aspect ratio pattern processability, high storage stability, and high curability and also provides a cured product with good mechanical characteristics and high heat resistance. A negative type photosensitive resin composition comprising a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D) wherein the component (A) contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof and wherein both the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C) are satisfied where A (moles), B (moles), and C (moles) represent the quantities of all carboxylic acid residues, all diamine residues, and all monoamine residues, respectively, contained in the component (A).

公开(公告)号：US20180051136A1

公开(公告)日：2018-02-22

申请号：US15555173

申请日：2016-02-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Ryoji OKUDA ,  Yuki MASUDA ,  Tomohiro KITAMURA ,  Yu SHOJI

IPC: C08G73/10 ,  G03F7/039 ,  G03F7/004 ,  G03F7/031 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/022 ,  H01L23/00

CPC classification number: C08G73/1039 ,  C08G73/10 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/022 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/031 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L23/293 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/12105 ,  H01L2924/07025 ,  H01L2924/3511

Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2). (In general formulae (1) and (2), R1 represents a tetravalent organic group having a monocyclic or condensed polycyclic alicyclic structure and 4-40 carbon atoms; R2 represents a divalent organic group having a polyether structure with 20-100 carbon atoms; R3 represents a hydrogen atom or an organic group having 1-20 carbon atoms; each of n1 and n2 represents a number within the range of 10-100,000; and p and q represents integers satisfying 0≦p+q≦6.)

公开(公告)号：US20240126171A1

公开(公告)日：2024-04-18

申请号：US18270346

申请日：2021-12-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Hitoshi ARAKI

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/022

CPC classification number: G03F7/0382 ,  G03F7/0045 ,  G03F7/022 ,  G03F7/0384

Abstract: The present invention provides a hollow structure having a low acid ion content and low wiring corrosion when stored in high-temperature, high-humidity conditions. The present invention relates to a hollow structure in which an organic film (I) having a film thickness of 5-30 μm as a hollow structure support material and an organic film (II) having a film thickness of 5-30 μm as a hollow structure roof material are layered in said order from the upper surface of a substrate having a metal wiring, wherein, when the organic film (I) and the organic film (II) are independently evaluated by the following method for evaluating ion elution amounts, the total of the ion elution amount of the organic film (I) and the ion elution amount of the organic film (II) is no more than 4,000 ppm. (Ion elution amount evaluation method) An organic film is placed in pure water having a mass 10 times that of the organic film and is extracted in hot water for 10-20 hours at 100-121° C., after which the supernatant of the liquid extract is used as a sample solution. The sample solution and a target ion standard solution are introduced into an ion chromatography device, the concentrations of formate ions, acetate ions, propionate ions, and sulfate ions in the sample solution are determined by a calibration curve method, and a value obtained by converting the total of said concentrations into the mass of eluted ions relative to the mass of the organic film is used as the ion elution amount.

公开(公告)号：US20210047470A1

公开(公告)日：2021-02-18

申请号：US16969315

申请日：2019-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Yuki MASUDA ,  Masao TOMIKAWA

IPC: C08G73/10 ,  G03F7/038 ,  H01L23/31 ,  H01L23/498

Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

公开(公告)号：US20180066107A1

公开(公告)日：2018-03-08

申请号：US15557623

申请日：2016-03-18

Applicant: TORAY Industries, Inc.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Yutaro KOYAMA ,  Ryoji OKUDA

IPC: C08G69/26 ,  C08L79/02 ,  G03F7/023 ,  G03F7/20 ,  C08K5/38 ,  C08K5/39 ,  H01L21/02

Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.