公开(公告)号：US20180066107A1

公开(公告)日：2018-03-08

申请号：US15557623

申请日：2016-03-18

Applicant: TORAY Industries, Inc.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Yutaro KOYAMA ,  Ryoji OKUDA

IPC: C08G69/26 ,  C08L79/02 ,  G03F7/023 ,  G03F7/20 ,  C08K5/38 ,  C08K5/39 ,  H01L21/02

Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

公开(公告)号：US20240297157A1

公开(公告)日：2024-09-05

申请号：US18569050

申请日：2022-04-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takayuki KANEKI ,  Yu SHOJI ,  Keika HASHIMOTO

IPC: H10K59/124 ,  H10K59/131

CPC classification number: H10K59/124 ,  H10K59/131

Abstract: The purpose of the present invention is to obtain an insulation film with high reliability, the insulation film and a wiring line being not susceptible to the occurrence of a crack due to thermal stress difference between the insulation film for wiring insulation or a protective film and inorganic materials, namely a metal wiring line, an inorganic light emitting diode chip and a substrate. In order to achieve the purpose, the present invention provides a display device which comprises at least a metal wiring line, a cured film, an inorganic insulation film and a plurality of light emitting elements, wherein: the cured film is obtained by curing a resin composition that contains a resin (A); each of the light emitting elements is an inorganic light emitting diode that is provided with a pair of electrode terminals on either surface; the pair of electrode terminals are connected to a plurality of the metal wiring lines that extend in the inorganic insulation film and the cured film; the display device is configured such that electrical insulation is maintained among the plurality of metal wiring lines by means of the cured film and the inorganic insulation film; the display device comprises a plurality of the cured films; and the inorganic insulation film is arranged so as to be in contact with at least a part of the interlayer between the plurality of cured films.

公开(公告)号：US20230369271A1

公开(公告)日：2023-11-16

申请号：US18246739

申请日：2021-10-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Yuki MASUDA ,  Yu SHOJI

IPC: H01L23/00 ,  H01L25/16 ,  H01L21/48 ,  H01L23/538 ,  H01L27/12

CPC classification number: H01L24/20 ,  H01L25/167 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L25/162 ,  H01L27/1259 ,  H01L24/19 ,  H01L27/1248 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2924/01029 ,  H01L2224/19

Abstract: The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.
The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.

公开(公告)号：US20190081258A1

公开(公告)日：2019-03-14

申请号：US15765596

申请日：2016-09-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Yu SHOJI ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: H01L51/05 ,  C08L79/08 ,  C08K5/13 ,  G03F7/075 ,  G03F7/20

Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

公开(公告)号：US20190025697A1

公开(公告)日：2019-01-24

申请号：US16084496

申请日：2017-03-24

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yohei KIUCHI ,  Yu SHOJI ,  Kimio ISOBE

IPC: G03F7/037 ,  G03F7/075

Abstract: A photosensitive resin composition which is excellent in chemical resistance and electrical insulation property and which can form a cured relief pattern having a cross-sectional shape of a forward taper after curing is provided. The present invention is a photosensitive resin composition, comprising an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B), wherein the (meth)acryl group-containing compound (B) comprises a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by the general Formula (1), which is a condensate of compounds having a structure represented by the general Formula (1) and at least one structure selected from the general Formula (2-1), the general Formula (2-2), and the general Formula (2-3), and the compound (B1) has a weight average molecular weight of 1,000 to 20,000. (wherein in the general Formula (1), R1 is a hydrogen atom or a methyl group. m is an integer in a range of 1≤m≤4. The symbol * indicates a binding site. In the general Formulas (2-1), (2-2) and (2-3), R2 is a methyl group or an ethyl group. n is an integer in a range of 1≤n≤4. The symbol * indicates a binding site.)

公开(公告)号：US20190004423A1

公开(公告)日：2019-01-03

申请号：US16063893

申请日：2017-01-10

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/023 ,  G03F7/022 ,  G03F7/40 ,  C08G73/22

Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC classification number: G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

公开(公告)号：US20180051136A1

公开(公告)日：2018-02-22

申请号：US15555173

申请日：2016-02-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Ryoji OKUDA ,  Yuki MASUDA ,  Tomohiro KITAMURA ,  Yu SHOJI

IPC: C08G73/10 ,  G03F7/039 ,  G03F7/004 ,  G03F7/031 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/022 ,  H01L23/00

CPC classification number: C08G73/1039 ,  C08G73/10 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/022 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/031 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L23/293 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/12105 ,  H01L2924/07025 ,  H01L2924/3511

Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2). (In general formulae (1) and (2), R1 represents a tetravalent organic group having a monocyclic or condensed polycyclic alicyclic structure and 4-40 carbon atoms; R2 represents a divalent organic group having a polyether structure with 20-100 carbon atoms; R3 represents a hydrogen atom or an organic group having 1-20 carbon atoms; each of n1 and n2 represents a number within the range of 10-100,000; and p and q represents integers satisfying 0≦p+q≦6.)