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公开(公告)号：US20180066107A1
公开(公告)日：2018-03-08
申请号：US15557623
申请日：2016-03-18
发明人： Yu SHOJI , Yuki MASUDA , Yutaro KOYAMA , Ryoji OKUDA
摘要： A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
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公开(公告)号：US20190081258A1
公开(公告)日：2019-03-14
申请号：US15765596
申请日：2016-09-21
发明人： Yuki MASUDA , Yu SHOJI , Kimio ISOBE , Ryoji OKUDA
摘要： A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
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公开(公告)号：US20190025697A1
公开(公告)日：2019-01-24
申请号：US16084496
申请日：2017-03-24
发明人： Yohei KIUCHI , Yu SHOJI , Kimio ISOBE
摘要： A photosensitive resin composition which is excellent in chemical resistance and electrical insulation property and which can form a cured relief pattern having a cross-sectional shape of a forward taper after curing is provided. The present invention is a photosensitive resin composition, comprising an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B), wherein the (meth)acryl group-containing compound (B) comprises a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by the general Formula (1), which is a condensate of compounds having a structure represented by the general Formula (1) and at least one structure selected from the general Formula (2-1), the general Formula (2-2), and the general Formula (2-3), and the compound (B1) has a weight average molecular weight of 1,000 to 20,000. (wherein in the general Formula (1), R1 is a hydrogen atom or a methyl group. m is an integer in a range of 1≤m≤4. The symbol * indicates a binding site. In the general Formulas (2-1), (2-2) and (2-3), R2 is a methyl group or an ethyl group. n is an integer in a range of 1≤n≤4. The symbol * indicates a binding site.)
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公开(公告)号：US20190004423A1
公开(公告)日：2019-01-03
申请号：US16063893
申请日：2017-01-10
发明人： Yu SHOJI , Yuki MASUDA , Kimio ISOBE , Ryoji OKUDA
摘要： Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.
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公开(公告)号：US20180203353A1
公开(公告)日：2018-07-19
申请号：US15744676
申请日：2016-09-20
发明人： Yu SHOJI , Yuki MASUDA , Kimio ISOBE , Ryoji OKUDA
CPC分类号： G03F7/0387 , C08G69/02 , C08G69/40 , G03F7/0226 , G03F7/023 , G03F7/0233 , G03F7/16 , G03F7/161 , G03F7/168 , G03F7/20 , G03F7/26 , G03F7/40 , H01L23/293 , H01L23/3192 , H01L23/562 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/02331 , H01L2224/024 , H01L2224/03462 , H01L2224/03515 , H01L2224/0362 , H01L2224/0401 , H01L2224/05008 , H01L2224/13022 , H01L2224/13024 , H01L2224/13026 , H01L2224/131 , H01L2924/0695 , H01L2924/3511 , H01L2924/014
摘要： Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
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公开(公告)号：US20180051136A1
公开(公告)日：2018-02-22
申请号：US15555173
申请日：2016-02-29
发明人： Yutaro KOYAMA , Ryoji OKUDA , Yuki MASUDA , Tomohiro KITAMURA , Yu SHOJI
IPC分类号： C08G73/10 , G03F7/039 , G03F7/004 , G03F7/031 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/022 , H01L23/00
CPC分类号： C08G73/1039 , C08G73/10 , G03F7/0045 , G03F7/0046 , G03F7/022 , G03F7/0226 , G03F7/0233 , G03F7/0236 , G03F7/031 , G03F7/039 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H01L23/293 , H01L24/03 , H01L24/05 , H01L2224/02331 , H01L2224/02379 , H01L2224/024 , H01L2224/0362 , H01L2224/0401 , H01L2224/04105 , H01L2224/05008 , H01L2224/12105 , H01L2924/07025 , H01L2924/3511
摘要： Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2). (In general formulae (1) and (2), R1 represents a tetravalent organic group having a monocyclic or condensed polycyclic alicyclic structure and 4-40 carbon atoms; R2 represents a divalent organic group having a polyether structure with 20-100 carbon atoms; R3 represents a hydrogen atom or an organic group having 1-20 carbon atoms; each of n1 and n2 represents a number within the range of 10-100,000; and p and q represents integers satisfying 0≦p+q≦6.)
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