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    SEMICONDUCTOR PACKAGE AND METHOD
    5.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD 有权

    公开(公告)号：US20250079327A1

    公开(公告)日：2025-03-06

    申请号：US18240065

    申请日：2023-08-30

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yu-Huan Chen ,  Kai-Yi Tang ,  Kuo-Ching Hsu

    IPC: H01L23/538 ,  H01L21/56 ,  H01L25/065

    Abstract: Semiconductor package and method of manufacturing are presented herein. In an embodiment, a device is provided that includes a first semiconductor component embedded in a first core substrate, a first redistribution layer on a first side of the first core substrate, a second redistribution layer on a second side of the first core substrate opposite the first side, a first resin film over the second redistribution layer, a second semiconductor component embedded in a second core substrate, a third redistribution layer on a third side of the second core substrate, wherein the third redistribution layer is bonded to the second redistribution layer by the first resin film, a fourth redistribution layer on a fourth side of the second core substrate opposite the third side, and a through hole via extending through the first redistribution layer, the first core substrate, the second redistribution layer, the third redistribution layer, the second core substrate, and the fourth redistribution layer.

    Chip package structure and method for forming the same
    7.
    发明授权
    Chip package structure and method for forming the same 有权

    公开(公告)号：US11335634B2

    公开(公告)日：2022-05-17

    申请号：US16893467

    申请日：2020-06-05

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Yu-Huan Chen ,  Kuo-Ching Hsu ,  Chen-Shien Chen

    IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

    Abstract: A method for forming a chip package structure is provided. The method includes providing a wiring substrate. The method includes sequentially forming a nickel-containing layer and a gold-containing layer over the first pad. The method includes forming a conductive protection layer covering the gold-containing layer over the nickel-containing layer. The method includes bonding a chip to the wiring substrate through a conductive bump and a flux layer surrounding the conductive bump. The conductive bump is between the second pad and the chip. The method includes removing the flux layer while the conductive protection layer covers the nickel-containing layer.

    Chip package structure with conductive adhesive layer and method for forming the same
    8.
    发明授权
    Chip package structure with conductive adhesive layer and method for forming the same 有权

    公开(公告)号：US11302537B2

    公开(公告)日：2022-04-12

    申请号：US16837381

    申请日：2020-04-01

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Kuo-Ching Hsu ,  Yu-Huan Chen ,  Chen-Shien Chen

    IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

    Abstract: A method for forming a chip package structure is provided. The method includes providing a wiring substrate including a substrate, a pad, and a polymer layer. The polymer layer is over the substrate and the pad, and the polymer layer has a first opening exposing the pad. The method includes forming a conductive adhesive layer over the polymer layer and the pad. The conductive adhesive layer is in direct contact with and conformally covers the polymer layer and the pad. The method includes forming a nickel layer over the conductive adhesive layer. The nickel layer is thicker than the conductive adhesive layer, and the nickel layer and the conductive adhesive layer are made of different materials. The method includes bonding a chip to the wiring substrate through a conductive bump. The conductive bump is between the nickel layer and the chip.

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