摘要:
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要:
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要:
A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
摘要:
A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
摘要:
A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译:用于电子电路的部件具有安装在散热器上的导热层。 导热层包括绝缘基板,将绝缘基板连接到散热器并且包含有源元件的第一接合构件,设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。 绝缘衬底包括AlN层或Si 3 N 4 N 4层。 第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。 散热片由SiC / Cu复合材料或C / Cu复合材料制成。
摘要:
There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×10−6/K to 8×10−6/K, an intermediate layer formed from Cu, a Cu alloy, Al, or an Al alloy, an electrically insulating layer, and an electrode layer formed from said metals, being joined in layers by a first brazing material; and a heat-radiating cooling section 7 having two or more seat surfaces being at least formed from said metals and the two or more heat conduction sections are joined by a second brazing material to seat surfaces with the heat sink layers of heat conduction sections disposed on seat surfaces.
摘要:
A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.
摘要:
A method of producing a ceramic matrix composite is provided, which production method reduces metal residual percentage within matrix with little energy consumption, without requiring special external heating means and special equipment while it is industrially simple and at a low price. It is a method of producing a ceramic matrix composite having the steps of filling mixed powder obtained by mixing metal powder and boron nitride powder into a predetermined container to form a green compact having a porous structure, and infiltrating the above described green compact with molten Al to form a composite material containing metal boride and having aluminum nitride as a matrix. The green compact is formed by compressing the mixed powder whose mixing ratio of metal powder to boron nitride powder is 1:1.8 to 1:2.2 (molar ratio) so that porosity of the green compact is 34 to 42%.
摘要:
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要:
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.