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公开(公告)号：US07069645B2
公开(公告)日：2006-07-04
申请号：US10107893
申请日：2002-03-27
IPC分类号： H05K3/36
CPC分类号： H05K3/04 , H01L2224/32225 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译： 提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分 金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。
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公开(公告)号：US20060191707A1
公开(公告)日：2006-08-31
申请号：US11409880
申请日：2006-04-24
CPC分类号： H05K3/04 , H01L2224/32225 , H01L2924/13055 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174 , H01L2924/00
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译： 提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分 金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。
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3.发明授权Member for electronic circuit, method for manufacturing the member, and electronic part 失效电子电路成员，制造该部件的方法和电子部件公开(公告)号：US06911728B2
公开(公告)日：2005-06-28
申请号：US10258231
申请日：2001-12-19
申请人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
发明人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
CPC分类号： H01L23/3735 , H01L2224/325 , H01L2924/01019 , H01L2924/13055 , H01L2924/3511 , H05K1/0306 , H05K3/0058 , H05K3/38 , H01L2924/00
摘要： A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译： 用于电子电路的部件具有安装在散热器上的导热层。 导热层包括绝缘基板，将绝缘基板连接到散热器并且包含有源元件的第一接合构件，设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。 绝缘衬底包括AlN层或Si 3 N 4 N 4层。 第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。 散热片由SiC / Cu复合材料或C / Cu复合材料制成。
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公开(公告)号：US07758970B2
公开(公告)日：2010-07-20
申请号：US12104547
申请日：2008-04-17
IPC分类号： B32B15/04
CPC分类号： C04B37/026 , B32B2311/22 , C04B37/023 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/08 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12535 , Y10T428/12542 , Y10T428/12576 , Y10T428/12583
摘要： A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要翻译： 不同的材料接合构件包括通过Au焊料材料结合在一起的陶瓷基底材料和金属构件。 焊料通过给定的活性金属层或给定的金属化层设置在陶瓷基体的接合表面上，并且焊料材料被加热熔融以形成附着在接合表面上的预涂层，金属构件被布置 通过具有给定功能的阻挡层在预涂层的表面上。 通过在预定涂层被加热并在给定的温度条件下熔化之后将预涂层固化来形成接合部分，以将陶瓷基体和金属部件彼此粘结。
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公开(公告)号：US20080230585A1
公开(公告)日：2008-09-25
申请号：US12104547
申请日：2008-04-17
CPC分类号： C04B37/026 , B32B2311/22 , C04B37/023 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/08 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12535 , Y10T428/12542 , Y10T428/12576 , Y10T428/12583
摘要： A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要翻译： 不同的材料接合构件包括通过Au焊料材料结合在一起的陶瓷基底材料和金属构件。 焊料通过给定的活性金属层或给定的金属化层设置在陶瓷基体的接合表面上，并且焊料材料被加热熔融以形成附着在接合表面上的预涂层，金属构件被布置 通过具有给定功能的阻挡层在预涂层的表面上。 通过在预定涂层被加热并在给定的温度条件下熔化之后将预涂层固化来形成接合部分，以将陶瓷基体和金属部件彼此粘结。
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6.发明授权Laminated radiation member, power semiconductor apparatus, and method for producing the same 有权层叠辐射构件，功率半导体装置及其制造方法公开(公告)号：US06485816B2
公开(公告)日：2002-11-26
申请号：US09774206
申请日：2001-01-30
申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
发明人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
IPC分类号： B32B300
CPC分类号： H01L24/32 , C04B37/026 , C04B2235/3206 , C04B2235/3225 , C04B2235/3873 , C04B2235/616 , C04B2235/6565 , C04B2235/9607 , C04B2237/064 , C04B2237/083 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/56 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C23C4/02 , C23C4/08 , C23C6/00 , C23C24/10 , C23C24/106 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , H01L2924/00014 , H01L2924/01004 , H01L2924/01022 , H01L2924/3512 , H01L2924/00 , H01L2924/00015
摘要： A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要翻译： 叠层辐射构件包括辐射板，结合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极。 叠层辐射构件通过以下方法制造：包括以下步骤：对辐射板和/或绝缘基板的接合表面进行表面处理，将处理的陶瓷颗粒插入表面，以确保在辐射板和辐射板之间的硬焊料或金属的润湿性 绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料，将硬焊料加热到高于焊料熔点的温度，将熔融的硬焊料穿入陶瓷颗粒之间的空间，使陶瓷颗粒与 焊料以制造金属基复合材料，并且用金属基复合材料将辐射板和绝缘基板接合。
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公开(公告)号：US07398912B2
公开(公告)日：2008-07-15
申请号：US10732964
申请日：2003-12-11
IPC分类号： B23K31/00
CPC分类号： C04B37/026 , B32B2311/22 , C04B37/023 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/08 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12535 , Y10T428/12542 , Y10T428/12576 , Y10T428/12583
摘要： A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要翻译： 不同的材料接合构件包括通过Au焊料材料结合在一起的陶瓷基材和金属构件。 焊料通过给定的活性金属层或给定的金属化层设置在陶瓷基体的接合表面上，并且焊料材料被加热熔融以形成附着在接合表面上的预涂层，金属构件被设置 通过具有给定功能的阻挡层在预涂层的表面上。 通过在预定涂层被加热并在给定的温度条件下熔化之后将预涂层固化来形成接合部分，以将陶瓷基体和金属部件彼此粘结。
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8.发明申请Laminated radiation member, power semiconductor apparatus, and method for producing the same 有权层叠辐射构件，功率半导体装置及其制造方法公开(公告)号：US20050263877A1
公开(公告)日：2005-12-01
申请号：US11179216
申请日：2005-07-12
申请人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
发明人： Kiyoshi Araki , Masahiro Kida , Takahiro Ishikawa , Yuki Bessyo , Takuma Makino
IPC分类号： H01L23/06 , H01L23/10 , H01L23/15 , H01L23/373 , H01L23/473
CPC分类号： H01L24/32 , C04B37/026 , C04B2235/3206 , C04B2235/3225 , C04B2235/3873 , C04B2235/616 , C04B2235/6565 , C04B2235/9607 , C04B2237/064 , C04B2237/083 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/56 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C23C4/02 , C23C4/08 , C23C6/00 , C23C24/10 , C23C24/106 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/351 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , H01L2924/00014 , H01L2924/01004 , H01L2924/01022 , H01L2924/3512 , H01L2924/00 , H01L2924/00015
摘要： A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
摘要翻译： 叠层辐射构件包括辐射板，结合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极。 叠层辐射构件通过以下方法制造：包括以下步骤：对辐射板和/或绝缘基板的接合表面进行表面处理，将处理的陶瓷颗粒插入表面，以确保在辐射板和辐射板之间的硬焊料或金属的润湿性 绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料，将硬焊料加热到高于焊料熔点的温度，将熔融的硬焊料穿入陶瓷颗粒之间的空间，使陶瓷颗粒与 焊料以制造金属基复合材料，并且用金属基复合材料将辐射板和绝缘基板接合。
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9.发明授权公开(公告)号：US06918530B2
公开(公告)日：2005-07-19
申请号：US10348471
申请日：2003-01-21
IPC分类号： B23K1/00 , B23K1/19 , B23K1/20 , B23K35/00 , B23K35/30 , B23K103/18 , C04B37/02 , C22C5/02 , H01R4/02 , B23K31/02
CPC分类号： C04B37/026 , B23K1/0008 , B23K1/19 , B23K1/20 , B23K35/004 , B23K35/3013 , B32B18/00 , B32B2309/022 , B32B2311/04 , B32B2311/18 , B32B2311/22 , B32B2311/24 , C04B35/645 , C04B2235/6567 , C04B2235/6581 , C04B2235/96 , C04B2235/9607 , C04B2237/121 , C04B2237/122 , C04B2237/125 , C04B2237/126 , C04B2237/366 , C04B2237/405 , C04B2237/406 , C04B2237/55 , C04B2237/64 , C04B2237/68 , C04B2237/704 , C04B2237/708 , C04B2237/72 , C04B2237/765 , C04B2237/84 , C04B2237/86 , H01R4/02
摘要： A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.
摘要翻译： 包含陶瓷基材1和金属构件7的接合构件，其结合在一起，其中包含Au的焊料材料5经由活性金属层设置在陶瓷基材1的表面上，活性金属层和焊料 材料5通过加热熔化以形成预涂层6，金属构件7经由包含纯金属的插入金属层设置在预涂层6的表面上，该纯金属可形成具有比Au低的合金， Au或纯金属和Au的合金，并且插入金属层和插入金属层和预涂层6之间的界面附近的至少一部分通过加热熔化以将金属构件7和预涂层 第6层。
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10.发明授权公开(公告)号：US06881499B2
公开(公告)日：2005-04-19
申请号：US10348255
申请日：2003-01-21
IPC分类号： B23K1/19 , B23K1/20 , B23K20/02 , B23K35/00 , B23K35/30 , B32B15/04 , C04B35/581 , C04B37/02 , C22C5/02 , B32B15/08 , B32B18/00
CPC分类号： B23K20/023 , B23K1/0006 , B23K35/004 , B23K2103/02 , B23K2103/172 , B23K2103/18 , B23K2103/26 , B23K2103/52 , B32B15/04 , B32B2309/022 , B32B2311/22 , B32B2311/30 , C04B35/581 , C04B35/645 , C04B37/026 , C04B2235/404 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/122 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C22C5/02 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/12806 , Y10T428/12847 , Y10T428/12889 , Y10T428/12951 , Y10T428/265
摘要： A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.
摘要翻译： 粘合部件包括陶瓷基材和通过焊接材料固相粘接的金属部件。 将活性金属放置在陶瓷基材的表面上，并且将包含Au的焊接材料放置在活性金属上，并且加热活性金属和焊料以形成预涂层。 通过能够抑制构成金属构件的金属的扩散的阻挡层将金属构件放置在预涂层的表面上，将预涂层和金属构件加压加热，使其固相 。 还公开了接合构件的制造方法。
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