-
公开(公告)号：US20060191707A1
公开(公告)日：2006-08-31
申请号：US11409880
申请日：2006-04-24
CPC分类号： H05K3/04 , H01L2224/32225 , H01L2924/13055 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174 , H01L2924/00
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译： 提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分 金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。
-
公开(公告)号：US07069645B2
公开(公告)日：2006-07-04
申请号：US10107893
申请日：2002-03-27
IPC分类号： H05K3/36
CPC分类号： H05K3/04 , H01L2224/32225 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译： 提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分 金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。
-
公开(公告)号：US07161807B2
公开(公告)日：2007-01-09
申请号：US10783892
申请日：2004-02-20
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
CPC分类号： H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
摘要翻译： 散热器模块包括基座，布置在基座上的散热构件，布置在散热构件上的导热层，插入在基座和散热构件之间的第一接合构件，以及插在其间的第二接合构件 散热构件和导热层。 该基体包括铜合金，其在600℃和900℃之间进行10分钟的热处理后，具有不低于45MPa的预定应力和不小于270W / mK的导热系数。
-
公开(公告)号：US07433187B2
公开(公告)日：2008-10-07
申请号：US10807674
申请日：2004-03-24
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
IPC分类号： H05K7/20
CPC分类号： C04B37/026 , B23K35/3006 , B32B2311/12 , C04B35/08 , C04B35/52 , C04B35/522 , C04B35/565 , C04B2235/407 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/368 , C04B2237/407 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , Y10T428/12493 , H01L2924/00
摘要： A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
摘要翻译： 散热器模块具有基座，通过第一主动硬钎焊材料接合到基座的散热构件，通过第二主动硬钎焊材料连接到散热构件的中间层，通过第二主动硬钎焊材料接合到中间层的绝缘板 第三活性硬钎料，以及通过第四活性硬钎焊材料与绝缘板接合的电路板。 供给第一至第四活性硬钎焊材料，使得当散热器组件的组件在压力下接合在一起时，活性硬钎焊材料的厚度范围为3-20μm，并且含有活性元素的量为 400至1000杯/厘米2。
-
5.发明授权Member for electronic circuit, method for manufacturing the member, and electronic part 失效电子电路成员，制造该部件的方法和电子部件公开(公告)号：US06911728B2
公开(公告)日：2005-06-28
申请号：US10258231
申请日：2001-12-19
申请人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
发明人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
CPC分类号： H01L23/3735 , H01L2224/325 , H01L2924/01019 , H01L2924/13055 , H01L2924/3511 , H05K1/0306 , H05K3/0058 , H05K3/38 , H01L2924/00
摘要： A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译： 用于电子电路的部件具有安装在散热器上的导热层。 导热层包括绝缘基板，将绝缘基板连接到散热器并且包含有源元件的第一接合构件，设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。 绝缘衬底包括AlN层或Si 3 N 4 N 4层。 第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。 散热片由SiC / Cu复合材料或C / Cu复合材料制成。
-
公开(公告)号：US06933531B1
公开(公告)日：2005-08-23
申请号：US09913353
申请日：2000-12-22
申请人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
发明人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
IPC分类号： B22F3/14 , C04B35/52 , C04B35/565 , C04B35/65 , C04B35/653 , C04B38/06 , C04B41/45 , C04B41/88 , C22C1/10 , C22C29/00 , H01L21/48 , H01L23/373 , H01L23/12
CPC分类号： C04B41/009 , B22F3/14 , C04B35/522 , C04B35/565 , C04B35/65 , C04B35/653 , C04B38/0615 , C04B41/4523 , C04B41/88 , C04B2111/00844 , C04B2235/3817 , C04B2235/40 , C04B2235/402 , C04B2235/404 , C04B2235/407 , C04B2235/425 , C04B2235/5427 , C04B2235/5436 , C04B2235/77 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C22C1/1036 , C22C29/00 , C22C2001/1073 , H01L21/4871 , H01L23/373 , H01L23/3733 , H01L2924/0002 , Y10T428/249957 , Y10T428/249967 , Y10T428/30 , C04B35/52 , C04B38/0051 , C04B38/0058 , C04B38/0074 , C04B41/5127 , C04B41/5155 , C04B41/5116 , C04B38/00 , H01L2924/00
摘要： Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.
摘要翻译： 将石墨放置在壳体中，并将壳体放置在炉中。 对炉内进行烧结，制成石墨的多孔烧结体。 之后，将其中的多孔烧结构件的壳体从炉中取出，并设置在冲压机的凹部中。 随后，将金属熔融金属倒入壳体中，然后将冲头插入凹槽中以将壳体中的熔融金属强制地向下压。 多孔烧结体的开孔通过用冲头的压制处理与金属的熔融金属渗透。
-
公开(公告)号：US06953539B2
公开(公告)日：2005-10-11
申请号：US10245999
申请日：2002-09-18
申请人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
发明人： Shuhei Ishikawa , Tsutomu Mitsui , Ken Suzuki , Nobuaki Nakayama , Hiroyuki Takeuchi , Seiji Yasui
IPC分类号： C04B41/88 , B32B15/04 , C04B41/51 , C04B41/52 , C04B41/90 , C22C1/10 , C22C9/00 , C22C9/01 , C22C9/05 , C22C9/06 , C22C9/10 , H01L21/48 , H01L23/15 , H01L23/373
CPC分类号： C22C9/00 , C04B41/009 , C04B41/5127 , C04B41/52 , C04B41/88 , C04B41/90 , C04B2111/00844 , C22C1/1036 , C22C9/01 , C22C9/05 , C22C9/06 , C22C9/10 , H01L21/4871 , H01L23/3733 , H01L2924/0002 , Y10T428/12576 , Y10T428/12611 , Y10T428/249957 , Y10T428/24997 , Y10T428/249974 , C04B41/4521 , C04B41/4523 , C04B41/0072 , C04B41/4556 , C04B41/5027 , C04B41/5035 , C04B41/522 , C04B41/457 , C04B35/08 , C04B35/565 , C04B35/584 , C04B35/581 , C04B35/563 , C04B38/00 , H01L2924/00
摘要： A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.
摘要翻译： 复合材料包括通过预先烧结多孔体形成的SiC多孔陶瓷烧结体，其热膨胀系数低于铜的热膨胀系数以构成网络。 浸渍多孔陶瓷烧结体的铜合金包括铜和一种或多种添加元素，其被赋予赋予复合材料160W / mK以上的导热系数。 添加元素含有至少一种选自Be，Al，Si，Mg，Ti，Ni，Bi，Te，Zn，Pb，Sn和金属的元素的5％，并且还含有不可避免的杂质和气体成分。
-
公开(公告)号：US06927421B2
公开(公告)日：2005-08-09
申请号：US10279959
申请日：2002-10-24
申请人： Shuhei Ishikawa , Tsutomu Mitsui , Hiroyuki Takeuchi , Seiji Yasui , Ken Suzuki , Nobuaki Nakayama
发明人： Shuhei Ishikawa , Tsutomu Mitsui , Hiroyuki Takeuchi , Seiji Yasui , Ken Suzuki , Nobuaki Nakayama
IPC分类号： B22F1/00 , B22F3/26 , C22C1/02 , C22C1/10 , C22C9/10 , C22C12/00 , C22C37/00 , H01L21/48 , H01L23/36 , H01L23/373 , H05K7/20 , H01L32/12
CPC分类号： C22C12/00 , C22C1/1036 , C22C9/10 , C22C2001/1021 , C22C2001/1052 , C22C2001/1057 , H01L21/4871 , H01L23/373 , H01L23/3736 , H01L2924/0002 , Y10T428/30 , H01L2924/00
摘要： A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).
摘要翻译： 将一块石墨放置在壳体中，并将壳体放入炉中（步骤S1001）。 加热炉中的空间以产生多孔石墨烧结体（步骤302）。 此后，将其中包含的多孔烧结体的情况从炉中取出并放入压机中的空腔（步骤303）。 然后，将金属熔融物倒入壳体（步骤304），并且在该情况下将冲头插入空腔中以将熔融金属压入多孔烧结体（步骤S305）。
-
公开(公告)号：US20090086435A1
公开(公告)日：2009-04-02
申请号：US12055659
申请日：2008-03-26
申请人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
发明人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×10−6/K to 8×10−6/K, an intermediate layer formed from Cu, a Cu alloy, Al, or an Al alloy, an electrically insulating layer, and an electrode layer formed from said metals, being joined in layers by a first brazing material; and a heat-radiating cooling section 7 having two or more seat surfaces being at least formed from said metals and the two or more heat conduction sections are joined by a second brazing material to seat surfaces with the heat sink layers of heat conduction sections disposed on seat surfaces.
摘要翻译： 提供了具有良好的导热性，优异的可靠性而不分离的散热器模块，以及具有足够高的散热的机构的节省空间的特性。 散热器模块包括：两个或更多个导热部分，每个热传导部分具有由热膨胀系数为1×10 -6 / K至8×10 -6 / K的散热材料形成的散热层，由Cu形成的中间层， Cu合金，Al或Al合金，电绝缘层和由所述金属形成的电极层，通过第一钎焊材料层合; 并且具有至少由所述金属形成的两个或更多个座面的散热冷却部7和两个以上的导热部通过第二钎焊材料接合到座面，其中热传导部的散热层设置在 座面。
-
10.发明授权
公开(公告)号：US5824167A
公开(公告)日：1998-10-20
申请号：US513887
申请日：1995-10-30
摘要： In the present invention, in order to minimize the amount of deformation due to heat treatment, the content of Be is lowered than the conventional ones, and the decrease in strength accompanied by decreasing Be, is compensated by dissolving strengthening of Si and Al, and precipitation strengthening of intermetallic compounds NiBe and CoBe. Further, by precipitating such intermetallic compounds, workability and heat resistance are also improved simultaneously and aging treatment conditions are also made flexible. Thus, according to the present invention, a beryllium-copper alloy having excellent strength, workability and heat resistance, can be provided economically, and particularly as for aging materials, users' burden can be markedly decreased.
摘要翻译： PCT No.PCT / JP94 / 02253 Sec。 371 1995年10月30日第 102（e）日期1995年10月30日PCT 1994年12月27日PCT公布。 WO95 / 18873 PCT出版物 日期1995年7月13日在本发明中，为了使热处理引起的变形量最小化，Be的含量比常规的低，并且随着Be的降低而降低，通过溶解强化 Si和Al，以及金属间化合物NiBe和CoBe的析出强化。 此外，通过沉淀这种金属间化合物，可以同时提高加工性和耐热性，并且还可以使老化处理条件变得柔软。 因此，根据本发明，可以经济地提供强度，加工性，耐热性优异的铍铜合金，特别是对于老化材料，使用者的负担显着降低。
-
-
-
-
-
-
-
-
-
搜索结果
22 条记录 (耗时 0.023 秒)
