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    Composite Sensor and Method for Manufacturing The Same
    1.
    发明申请
    Composite Sensor and Method for Manufacturing The Same 审中-公开
    复合传感器及其制造方法

    公开(公告)号：US20140260612A1

    公开(公告)日：2014-09-18

    申请号：US14353635

    申请日：2011-11-28

    申请人： Takanori Aono ,  Kengo Suzuki ,  Masahide Hayashi ,  Heewon Jeong

    发明人： Takanori Aono ,  Kengo Suzuki ,  Masahide Hayashi ,  Heewon Jeong

    IPC分类号： G01C19/5705

    CPC分类号： G01C19/5705 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00285 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/088

    摘要： The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.

    摘要翻译： 本公开提供了具有高可靠性的复合传感器及其制造方法。 加速度传感器的移动体和角速度传感器的振荡器设置在相同的传感器晶片上，同时由壁分隔，并且盖晶片形成为具有与每个传感器对应的间隙。 在传感器密封部中形成有贯通孔和凸块，在第一密封工序中将加速度传感器密封在空气气氛中，在第二密封工序中，通过将传感器和盖体 彼此接触并在真空环境中连接传感器和盖子。 此后，将复合传感器晶片切割，电路板和布线板安装在其上，并且形成复合传感器。

    Physical Quantity Detector
    2.
    发明申请
    Physical Quantity Detector 有权
    物理量检测器

    公开(公告)号：US20130241013A1

    公开(公告)日：2013-09-19

    申请号：US13878776

    申请日：2011-10-07

    申请人： Kiyoko Yamanaka ,  Kengo Suzuki ,  Kazunori Ohta ,  Heewon Jeong ,  Masahide Hayashi

    发明人： Kiyoko Yamanaka ,  Kengo Suzuki ,  Kazunori Ohta ,  Heewon Jeong ,  Masahide Hayashi

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0058 ,  G01C19/5783 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0845 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure (103) is provided in the inertial sensor device, between a semiconductor chip (102) mounted on a package substrate and a semiconductor chip (104) comprising a sensor detection part. The anti-vibration structure (103) has a structure in which the periphery of an anti-vibration part (103a) is surrounded by an anti-vibration part (103b) comprising a material having a larger Young's modulus.

    摘要翻译： 提供了一种惯性传感器装置，其包括具有MEMS结构的检测部件，其中，在控制由施加外部振动引起的错误操作的同时确保传感器安装期间的便利性。 为了实现该目的，在惯性传感器装置中，在安装在封装基板上的半导体芯片（102）和包括传感器检测部件的半导体芯片（104）之间设置防振结构（103）。 防振结构（103）具有防振部（103a）的周围由包含杨氏模量较大的材料的防振部（103b）包围的结构。

    Combined Sensor and Method for Manufacturing the Same
    7.
    发明申请
    Combined Sensor and Method for Manufacturing the Same 有权
    组合传感器及其制造方法

    公开(公告)号：US20130068020A1

    公开(公告)日：2013-03-21

    申请号：US13699235

    申请日：2011-05-20

    申请人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

    发明人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

    IPC分类号： G01P3/44 ,  H05K3/30 ,  H05K3/28 ,  B23P11/00

    CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2207/095 ,  B81C1/00293 ,  B81C2203/031 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/125 ,  H01L21/561 ,  H01L23/315 ,  H01L24/94 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/16235 ,  Y10T29/49146 ,  Y10T29/49826 ,  H01L2924/00

    摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

    摘要翻译： 加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。 加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。 形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。 凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。 然后，对角速度传感器12进行高温高负荷的真空密封。 此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

    MEMS DEVICE AND PROCESS FOR PRODUCING SAME
    8.
    发明申请
    MEMS DEVICE AND PROCESS FOR PRODUCING SAME 有权
    MEMS器件及其制造方法

    公开(公告)号：US20150028438A1

    公开(公告)日：2015-01-29

    申请号：US14378102

    申请日：2012-03-30

    申请人： Masatoshi Kanamaru ,  Takanori Aono ,  Kengo Suzuki

    发明人： Masatoshi Kanamaru ,  Takanori Aono ,  Kengo Suzuki

    IPC分类号： B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0353 ,  B81B2203/0384 ,  B81B2207/095 ,  B81C1/00103 ,  B81C1/00595

    摘要： There are provided a process for fabricating MEMS device that includes a plurality of through-holes capable being arranged at a high density, the through-holes having a tapered end portion. Through-holes having vertical side surfaces and tapered bottoms are provided by a processing method including the steps of: disposing quadrilateral patterning having desired dimensions on a silicon substrate having a flat surface of a crystal plane, etching the substrate to a desired depth by dry etching that can realize a high aspect ratio etching, and anisotropic wet etching the dry etched substrate with a KOH aqueous solution containing isopropyl alcohol mixed thereinto.

    摘要翻译： 提供了一种用于制造MEMS器件的方法，该器件包括能够以高密度布置的多个通孔，该通孔具有锥形端部。 通过一种处理方法提供具有垂直侧面和锥形底部的通孔，该方法包括以下步骤：将具有期望尺寸的四边形图案设置在具有平坦表面平面的硅衬底上，通过干蚀刻将衬底蚀刻到所需深度 可以实现高纵横比蚀刻，并且用含有异丙醇的KOH水溶液进行各向异性湿蚀刻干蚀刻基板。

    Process for fabricating MEMS device
    9.
    发明授权
    Process for fabricating MEMS device 有权
    MEMS器件制造工艺

    公开(公告)号：US09249011B2

    公开(公告)日：2016-02-02

    申请号：US14378102

    申请日：2012-03-30

    申请人： Masatoshi Kanamaru ,  Takanori Aono ,  Kengo Suzuki

    发明人： Masatoshi Kanamaru ,  Takanori Aono ,  Kengo Suzuki

    IPC分类号： H01L23/02 ,  H01L23/053 ,  B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0353 ,  B81B2203/0384 ,  B81B2207/095 ,  B81C1/00103 ,  B81C1/00595

    摘要： There are provided a process for fabricating MEMS device that includes a plurality of through-holes capable being arranged at a high density, the through-holes having a tapered end portion. Through-holes having vertical side surfaces and tapered bottoms are provided by a processing method including the steps of: disposing quadrilateral patterning having desired dimensions on a silicon substrate having a flat surface of a crystal plane, etching the substrate to a desired depth by dry etching that can realize a high aspect ratio etching, and anisotropic wet etching the dry etched substrate with a KOH aqueous solution containing isopropyl alcohol mixed thereinto.

    摘要翻译： 提供了一种用于制造MEMS器件的方法，该器件包括能够以高密度布置的多个通孔，该通孔具有锥形端部。 通过一种处理方法提供具有垂直侧面和锥形底部的通孔，该方法包括以下步骤：将具有期望尺寸的四边形图案设置在具有平坦表面平面的硅衬底上，通过干蚀刻将衬底蚀刻到所需深度 可以实现高纵横比蚀刻，并且用含有异丙醇的KOH水溶液进行各向异性湿蚀刻干蚀刻基板。

    Physical sensor and method of process
    10.
    发明授权
    Physical sensor and method of process 有权
    物理传感器和过程方法

    公开(公告)号：US07905149B2

    公开(公告)日：2011-03-15

    申请号：US12175347

    申请日：2008-07-17

    申请人： Kengo Suzuki ,  Takeshi Harada ,  Yasuo Osone ,  Masahide Hayashi ,  Teruhisa Akashi

    发明人： Kengo Suzuki ,  Takeshi Harada ,  Yasuo Osone ,  Masahide Hayashi ,  Teruhisa Akashi

    IPC分类号： G01B7/16

    CPC分类号： G01P15/0802 ,  B81B2207/096 ,  B81C1/00301 ,  G01C19/5719

    摘要： There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.

    摘要翻译： 提供了一种物理传感器，其确保了长期可靠性并且可以小型化和增加密度，以及其制造方法。 物理传感器包括支撑基板，包括传感器元件并通过绝缘层与支撑基板接合的元件基板，覆盖传感器元件的区域并与元件基板接合的玻璃盖，以及内置 电连接到传感器元件。 内置电极形成在穿过元件基板，绝缘层和支撑基板的通孔中。 覆盖内置电极的区域的玻璃帽的一部分阳极接合到元件基板。