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公开(公告)号:US06340797B1
公开(公告)日:2002-01-22
申请号:US09468295
申请日:1999-12-21
IPC分类号: H05K116
CPC分类号: H05K1/112 , H05K2201/09227 , H05K2201/09727 , H05K2201/10734
摘要: A printed circuit board is provided with a plurality of insulator layers and a plurality of conductor layers, and an outermost conductor layer has a plurality of foot patterns in outer and inner rows for mounting a BGA component and signal patterns. The width of at least a part of the signal pattern extending from the foot pattern in the outer row is greater than the width of the signal pattern extending from the foot pattern in the inner row. The printed circuit board further includes a protection layer for covering the signal patterns on the outermost conductor layer, and the protection layer has openings each for permitting the foot pattern to be exposed. At least a portion of the signal pattern appearing in the opening is widened.
摘要翻译: 印刷电路板设置有多个绝缘体层和多个导体层,并且最外面的导体层具有用于安装BGA部件和信号图案的外排和内排中的多个脚图案。 从外排中的脚图形延伸的信号图案的至少一部分的宽度大于从内排中的脚图案延伸的信号图案的宽度。 印刷电路板还包括用于覆盖最外面的导体层上的信号图案的保护层,并且保护层具有各自的开口以允许脚图案露出。 出现在开口中的信号图案的至少一部分变宽。
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公开(公告)号:US08269114B2
公开(公告)日:2012-09-18
申请号:US12698635
申请日:2010-02-02
申请人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号: H05K1/00
CPC分类号: H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要: A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译: 柔性印刷电路板包括基材,第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸,沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度,第一布线图案设置在第二导电焊盘之间,并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ,以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层,并且在第一导电焊盘的后端的前侧具有前边缘,在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号:US08456854B2
公开(公告)日:2013-06-04
申请号:US12285632
申请日:2008-10-09
申请人: Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
发明人: Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
CPC分类号: H05K3/3494 , H05K1/0212 , H05K3/225 , H05K2203/101 , H05K2203/176 , Y10T29/49137
摘要: A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.
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公开(公告)号:US20120312586A1
公开(公告)日:2012-12-13
申请号:US13590908
申请日:2012-08-21
申请人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号: H05K1/00
CPC分类号: H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要: A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译: 柔性印刷电路板包括基材,第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸,沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度,第一布线图案设置在第二导电焊盘之间,并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ,以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层,并且在第一导电焊盘的后端的前侧具有前边缘,在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号:US20060073711A1
公开(公告)日:2006-04-06
申请号:US11033256
申请日:2005-01-12
IPC分类号: H05K1/00
CPC分类号: H05K1/028 , H01R12/59 , H01R35/02 , H04M1/0227
摘要: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.
摘要翻译: 将主体和旋转体彼此电连接的柔性印刷电路板预先通过旋转体旋转的旋转角的一半的角度扭转。 柔性印刷电路板的一端固定在主体上,另一端固定在旋转体上。 旋转体沿着使柔性印刷电路板的扭曲减小的方向旋转。
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公开(公告)号:US09295155B2
公开(公告)日:2016-03-22
申请号:US13590908
申请日:2012-08-21
申请人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
CPC分类号: H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要: A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译: 柔性印刷电路板包括基材,第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸,沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度,第一布线图案设置在第二导电焊盘之间,并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ,以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层,并且在第一导电焊盘的后端的前侧具有前边缘,在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号:US20090175010A1
公开(公告)日:2009-07-09
申请号:US12285632
申请日:2008-10-09
申请人: Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
发明人: Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
CPC分类号: H05K3/3494 , H05K1/0212 , H05K3/225 , H05K2203/101 , H05K2203/176 , Y10T29/49137
摘要: A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.
摘要翻译: 一种在预热电路板的第一表面时防止弱耐热装置加热并导致质量劣化的修复系统,其中电磁感应材料预先埋在电路板内面靠近需要修理的特定电子装置附近 当在生产过程中成为有缺陷的电子装置时,并且提供了向维修装置附近的电磁感应构件发射电磁波的电磁线圈,并且由于电磁波而由电磁感应构件产生的热能够使修理装置 从电路板加热和分离。
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公开(公告)号:US07101205B2
公开(公告)日:2006-09-05
申请号:US11033256
申请日:2005-01-12
IPC分类号: H01R3/00
CPC分类号: H05K1/028 , H01R12/59 , H01R35/02 , H04M1/0227
摘要: A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.
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公开(公告)号:US20100212938A1
公开(公告)日:2010-08-26
申请号:US12698635
申请日:2010-02-02
申请人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人: Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号: H05K1/02
CPC分类号: H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要: A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译: 柔性印刷电路板包括基材,第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸,沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度,第一布线图案设置在第二导电焊盘之间,并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ,以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层,并且在第一导电焊盘的后端的前侧具有前边缘,在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号:US20100200643A1
公开(公告)日:2010-08-12
申请号:US12697195
申请日:2010-01-29
CPC分类号: H05K3/4617 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/186 , H05K3/323 , H05K3/341 , H05K3/368 , H05K3/4069 , H05K3/4602 , H05K3/4658 , H05K2201/09481 , H05K2203/061 , H01L2224/0401
摘要: A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.
摘要翻译: 一种电子部件单元的制造方法,所述方法包括:通过回流焊将第一电子部件安装在第一基板的第一面上; 通过回流焊将第二电子部件安装在第二基板的第二表面上; 将第一基板的第二表面粘附到第三基板的第一表面; 以及将所述第二基板的第二表面附着到所述第三基板的第二表面。
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