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公开(公告)号：US20050179498A1
公开(公告)日：2005-08-18
申请号：US11033874
申请日：2005-01-13
CPC分类号： H03G3/3047
摘要： There is provided a high frequency power amplifier circuit capable of enhancing detection accuracy of an output level, necessary for feedback control of the high frequency power amplifier circuit, and capable of executing output power control with higher precision, With the high frequency power amplifier circuit, the detection of the output level, necessary for feedback control of the high frequency power amplifier circuit is executed by use of a current detection method, and in an electronic device comprising a differential amplifier for comparing an output power detection signal with an output level designation signal and for generating a signal for controlling a gain of the high frequency power amplifier circuit according to a potential difference between the two signals, a power source voltage with variation less than that for the power source voltage of the high frequency power amplifier circuit is used as the operational power source voltage of the output power detection circuit. Further, there is provided a capacitor across which an AC component is taken out from the output side of a power amplification transistor in the final amplification stage of the high frequency power amplifier circuit to be thereby impressed to the interior of the output power detection circuit.
摘要翻译： 提供了一种能够提高高频功率放大器电路的反馈控制所需的输出电平的检测精度并能够以更高精度执行输出功率控制的高频功率放大器电路。通过高频功率放大器电路， 通过使用电流检测方法来执行对高频功率放大器电路的反馈控制所必需的输出电平的检测，并且在包括用于将输出功率检测信号与输出电平指定信号进行比较的差分放大器的电子装置中进行检测 并且为了根据两个信号之间的电位差产生用于控制高频功率放大器电路的增益的信号，使用具有小于高频功率放大器电路的电源电压的电源电压的电源电压作为 输出功率检测电路的工作电源电压。 此外，提供了一种电容器，在高频功率放大器电路的最终放大级中，功率放大晶体管的输出侧从其输出侧取出AC分量，从而印在输出功率检测电路的内部。
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公开(公告)号：US07193471B2
公开(公告)日：2007-03-20
申请号：US11520717
申请日：2006-09-14
IPC分类号： H03G3/10
CPC分类号： H03G3/3047
摘要： There is provided a high frequency power amplifier circuit capable of enhancing detection accuracy of an output level, necessary for feedback control of the high frequency power amplifier circuit, and capable of executing output power control with higher precision, With the high frequency power amplifier circuit, the detection of the output level, necessary for feedback control of the high frequency power amplifier circuit is executed by use of a current detection method, and in an electronic device comprising a differential amplifier for comparing an output power detection signal with an output level designation signal and for generating a signal for controlling a gain of the high frequency power amplifier circuit according to a potential difference between the two signals, a power source voltage with variation less than that for the power source voltage of the high frequency power amplifier circuit is used as the operational power source voltage of the output power detection circuit. Further, there is provided a capacitor across which an AC component is taken out from the output side of a power amplification transistor in the final amplification stage of the high frequency power amplifier circuit to be thereby impressed to the interior of the output power detection circuit.
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公开(公告)号：US20070008037A1
公开(公告)日：2007-01-11
申请号：US11520717
申请日：2006-09-14
IPC分类号： H03G3/10
CPC分类号： H03G3/3047
摘要： There is provided a high frequency power amplifier circuit capable of enhancing detection accuracy of an output level, necessary for feedback control of the high frequency power amplifier circuit, and capable of executing output power control with higher precision, With the high frequency power amplifier circuit, the detection of the output level, necessary for feedback control of the high frequency power amplifier circuit is executed by use of a current detection method, and in an electronic device comprising a differential amplifier for comparing an output power detection signal with an output level designation signal and for generating a signal for controlling a gain of the high frequency power amplifier circuit according to a potential difference between the two signals, a power source voltage with variation less than that for the power source voltage of the high frequency power amplifier circuit is used as the operational power source voltage of the output power detection circuit. Further, there is provided a capacitor across which an AC component is taken out from the output side of a power amplification transistor in the final amplification stage of the high frequency power amplifier circuit to be thereby impressed to the interior of the output power detection circuit.
摘要翻译： 提供了一种能够提高高频功率放大器电路的反馈控制所需的输出电平的检测精度并能够以更高精度执行输出功率控制的高频功率放大器电路。通过高频功率放大器电路， 通过使用电流检测方法来执行对高频功率放大器电路的反馈控制所必需的输出电平的检测，并且在包括用于将输出功率检测信号与输出电平指定信号进行比较的差分放大器的电子装置中进行检测 并且为了根据两个信号之间的电位差产生用于控制高频功率放大器电路的增益的信号，使用具有小于高频功率放大器电路的电源电压的电源电压的电源电压作为 输出功率检测电路的工作电源电压。 此外，提供了一种电容器，在高频功率放大器电路的最终放大级中，功率放大晶体管的输出侧从其输出侧取出AC分量，从而印在输出功率检测电路的内部。
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公开(公告)号：US07123095B2
公开(公告)日：2006-10-17
申请号：US11033874
申请日：2005-01-13
IPC分类号： H03G3/10
CPC分类号： H03G3/3047
摘要： There is provided a high frequency power amplifier circuit capable of enhancing detection accuracy of an output level, necessary for feedback control of the high frequency power amplifier circuit, and capable of executing output power control with higher precision, With the high frequency power amplifier circuit, the detection of the output level, necessary for feedback control of the high frequency power amplifier circuit is executed by use of a current detection method, and in an electronic device comprising a differential amplifier for comparing an output power detection signal with an output level designation signal and for generating a signal for controlling a gain of the high frequency power amplifier circuit according to a potential difference between the two signals, a power source voltage with variation less than that for the power source voltage of the high frequency power amplifier circuit is used as the operational power source voltage of the output power detection circuit. Further, there is provided a capacitor across which an AC component is taken out from the output side of a power amplification transistor in the final amplification stage of the high frequency power amplifier circuit to be thereby impressed to the interior of the output power detection circuit.
摘要翻译： 提供了一种能够提高高频功率放大器电路的反馈控制所需的输出电平的检测精度并能够以更高精度执行输出功率控制的高频功率放大器电路。通过高频功率放大器电路， 通过使用电流检测方法来执行对高频功率放大器电路的反馈控制所必需的输出电平的检测，并且在包括用于将输出功率检测信号与输出电平指定信号进行比较的差分放大器的电子装置中进行检测 并且为了根据两个信号之间的电位差产生用于控制高频功率放大器电路的增益的信号，使用具有小于高频功率放大器电路的电源电压的电源电压的电源电压作为 输出功率检测电路的工作电源电压。 此外，提供了一种电容器，在高频功率放大器电路的最终放大级中，功率放大晶体管的输出侧从其输出侧取出AC分量，从而印在输出功率检测电路的内部。
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5.发明授权Electronic component for high frequency power amplifier and radio communication system 有权电子元件用于高频功率放大器和无线电通信系统公开(公告)号：US07053708B2
公开(公告)日：2006-05-30
申请号：US10820026
申请日：2004-04-08
IPC分类号： H03G5/16
CPC分类号： H03F3/195 , H03F1/301 , H03F3/193 , H03F3/602 , H03G3/3042
摘要： There are provided an electronic component for high frequency power amplification provided with a high-sensitivity output power detection circuit which is immune to the influence of changes in the use environment thereof, free of an output mismatch, small in size, and low in insertion loss and a wireless communication system using the electronic component. There are provided an output detection transistor which receives, at a control terminal, a voltage extracted from the intermediate node of an impedance matching circuit provided between the final-stage power amplification transistor of a high-frequency power amplification circuit and an output terminal thereof via a capacitor element and allows a current proportional to an output power to flow, a bias generation circuit for giving an operating point to the control terminal of the transistor, a current mirror circuit for transferring the current flowing in the output detection transistor, and a current-to-voltage conversion transistor for converting the transferred current to a voltage.
摘要翻译： 提供了一种高频功率放大的电子元件，其具有高灵敏度的输出功率检测电路，其免受其使用环境变化的影响，没有输出失配，尺寸小，插入损耗低 以及使用该电子部件的无线通信系统。 提供了一种输出检测晶体管，其在控制端子处接收从设置在高频功率放大电路的最后级功率放大晶体管和其输出端之间的阻抗匹配电路的中间节点提取的电压 电容器元件并且允许与输出功率成比例的电流流动;用于给晶体管的控制端施加工作点的偏置产生电路，用于传送在输出检测晶体管中流动的电流的电流镜电路，以及电流 电压转换晶体管，用于将传输的电流转换成电压。
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公开(公告)号：US07995984B2
公开(公告)日：2011-08-09
申请号：US12244908
申请日：2008-10-03
申请人： Tomoaki Kudaishi , Satoshi Sakurai , Takayuki Tsutsui , Masashi Yamaura , Reiichi Arai , Takayuki Maehara
发明人： Tomoaki Kudaishi , Satoshi Sakurai , Takayuki Tsutsui , Masashi Yamaura , Reiichi Arai , Takayuki Maehara
IPC分类号： H04B1/28
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/10336 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13064 , H01L2924/13091 , H01L2924/15192 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： The present invention aims to reduce an exclusively-possessed area of each of bonding wires mounted over a wiring board, for coupling a power amplifying unit of a semiconductor chip and an antenna switch of a second semiconductor chip in a semiconductor device that configures an RF module. In the RF module, the first semiconductor chip and the second semiconductor chip are mounted side by side in a central area of the wiring board. The first semiconductor chip is formed with amplifier circuits and a control circuit and comprises a silicon substrate or a compound semiconductor substrate. On the other hand, the second semiconductor chip is formed with an antenna switch and comprises the silicon substrate or compound semiconductor substrate. Pads of the first semiconductor chip and pads of the second semiconductor chip are respectively electrically coupled to one another. This coupling is carried out by the bonding wires formed in the surface of the wiring board and the bonding wires formed inside the wiring board.
摘要翻译： 本发明的目的在于减少安装在布线板上的各引线的独占区域，用于将半导体芯片的功率放大单元和第二半导体芯片的天线开关耦合到半导体器件中，该半导体器件配置RF模块 。 在RF模块中，第一半导体芯片和第二半导体芯片并排安装在布线板的中心区域中。 第一半导体芯片由放大器电路和控制电路形成，并且包括硅衬底或化合物半导体衬底。 另一方面，第二半导体芯片由天线开关形成，并且包括硅衬底或化合物半导体衬底。 第一半导体芯片的焊盘和第二半导体芯片的焊盘彼此分别电耦合。 通过形成在布线板的表面的接合线和形成在布线基板内的接合线进行该耦合。
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公开(公告)号：US20090130996A1
公开(公告)日：2009-05-21
申请号：US12244908
申请日：2008-10-03
申请人： Tomoaki Kudaishi , Satoshi Sakurai , Takayuki Tsutsui , Masashi Yamaura , Reiichi Arai , Takayuki Maehara
发明人： Tomoaki Kudaishi , Satoshi Sakurai , Takayuki Tsutsui , Masashi Yamaura , Reiichi Arai , Takayuki Maehara
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/10336 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13064 , H01L2924/13091 , H01L2924/15192 , H01L2924/181 , H01L2924/19042 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： The present invention aims to reduce an exclusively-possessed area of each of bonding wires mounted over a wiring board, for coupling a power amplifying unit of a semiconductor chip and an antenna switch of a second semiconductor chip in a semiconductor device that configures an RF module. In the RF module, the first semiconductor chip and the second semiconductor chip are mounted side by side in a central area of the wiring board. The first semiconductor chip is formed with amplifier circuits and a control circuit and comprises a silicon substrate or a compound semiconductor substrate. On the other hand, the second semiconductor chip is formed with an antenna switch and comprises the silicon substrate or compound semiconductor substrate. Pads of the first semiconductor chip and pads of the second semiconductor chip are respectively electrically coupled to one another. This coupling is carried out by the bonding wires formed in the surface of the wiring board and the bonding wires formed inside the wiring board.
摘要翻译： 本发明的目的在于减少安装在布线板上的各引线的独占区域，用于将半导体芯片的功率放大单元和第二半导体芯片的天线开关耦合到半导体器件中，该半导体器件配置RF模块 。 在RF模块中，第一半导体芯片和第二半导体芯片并排安装在布线板的中心区域中。 第一半导体芯片由放大器电路和控制电路形成，并且包括硅衬底或化合物半导体衬底。 另一方面，第二半导体芯片由天线开关形成，并且包括硅衬底或化合物半导体衬底。 第一半导体芯片的焊盘和第二半导体芯片的焊盘彼此分别电耦合。 通过形成在布线板的表面的接合线和形成在布线基板内的接合线进行该耦合。
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公开(公告)号：US07352244B2
公开(公告)日：2008-04-01
申请号：US11360437
申请日：2006-02-24
申请人： Kyoichi Takahashi , Takayuki Tsutsui , Hitoshi Akamine , Fuminori Morisawa , Nobuhiro Matsudaira
发明人： Kyoichi Takahashi , Takayuki Tsutsui , Hitoshi Akamine , Fuminori Morisawa , Nobuhiro Matsudaira
IPC分类号： H03G3/30
CPC分类号： H03F1/0261 , H03F1/0205 , H03F3/24 , H03F3/60 , H03F2200/105 , H03G3/3047
摘要： This invention provides an electronic part for high frequency power amplification (RF power module) which will automatically perform the precharge level setting for proper output power at start of transmission without requiring the software process for precharging to run on the baseband IC, which can reduce the burden on users, namely, mobile phone manufacturers. Such electronic part configured to amplify RF transmit signals includes an output power control circuit which supplies an output power control voltage to a bias control circuit in a high frequency power amplifier circuit, based on an output power level directive signal. This electronic part is equipped with a precharge circuit which raises the output power control voltage to produce a predetermined level of output power, while detecting a current flowing through a final-stage power amplifying element, triggered by rise of a supply voltage at start of transmission.
摘要翻译： 本发明提供了一种用于高频功率放大的电子部件（RF功率模块），其将在开始传输时自动执行预充电电平设置以用于正确的输出功率，而不需要预充电的软件处理在基带IC上运行，这可以减少 用户负担，即手机厂商。 配置为放大RF发射信号的这种电子部件包括：输出功率控制电路，其基于输出功率电平指令信号将输出功率控制电压提供给高频功率放大器电路中的偏置控制电路。 该电子部件配备有预充电电路，其提高输出功率控制电压以产生预定水平的输出功率，同时检测流过最后级功率放大元件的电流，由传输开始时的电源电压上升触发 。
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9.发明申请公开(公告)号：US20050218989A1
公开(公告)日：2005-10-06
申请号：US10498489
申请日：2002-02-28
CPC分类号： H03G3/3042 , H03F1/0205 , H03F1/0272 , H03F3/193 , H03F2200/372 , H03F2200/393 , H03G3/3047 , H04B1/0475 , H04B1/406 , H04B2001/0416
摘要： A wireless communication system has a first operation mode (GSM mode) for amplifying a phase-modulated high frequency signal with a high frequency power amplifier circuit and a second operation mode (EDGE mode) for amplifying a phase and amplitude-modulated high frequency signal with the amplifier circuit. The amplifier circuit has an input of a high frequency signal, with the amplitude and frequency being fixed in both the first and second operation modes, and operates by being controlled for the bias state of each amplifying stage in accordance with the output control signal produced by a control circuit based on the demanded output level (Vapc) and the detected output level (VSNS) so that the amplifier circuit performs signal amplification to meet the demanded output level.
摘要翻译： 无线通信系统具有用于利用高频功率放大器电路放大相位调制的高频信号的第一操作模式（GSM模式）和用于放大相位和幅度调制的高频信号的第二操作模式（EDGE模式） 放大电路。 放大器电路具有高频信号的输入，振幅和频率在第一和第二操作模式中都是固定的，并且通过根据由放大级产生的输出控制信号被控制为每个放大级的偏置状态来操作 基于所需输出电平（Vapc）和检测输出电平（VSNS）的控制电路，使得放大器电路执行信号放大以满足所要求的输出电平。
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公开(公告)号：US4095240A
公开(公告)日：1978-06-13
申请号：US722945
申请日：1976-09-13
申请人： Takayuki Tsutsui
发明人： Takayuki Tsutsui
摘要： A pyrographic printer comprises an exhaust system having an elongated inlet and a bifurcated throat. The inlet is adjacent to and substantially coextensive with the path of travel for the stylus, and the throat is configured to define a main passage which leads away from the inlet and a branch passage which loops back toward the inlet. To increase the vacuum drawn in the immediate proximity of the stylus, the input impedance of the exhaust system is selectively reduced in that region. For that purpose, the stylus carriage carries a baffle which extends into the throat to more or less seal a stylus aligned segment of the branch passage.
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