公开(公告)号：US20080145973A1

公开(公告)日：2008-06-19

申请号：US12007406

申请日：2008-01-10

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: H01L21/60

CPC classification number: H01L23/3114 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0332 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/1132 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2224/05552 ,  H01L2924/00

Abstract: To widely improve an entire manufacturing efficiency by efficiently forming a thermal stress relaxing post, an insulating layer and a solder bump, a rewiring circuit (3) is formed on a wafer (1) by plating, a thermal stress relaxing post (4) made of a conductive material such as a solder or the like is formed on the rewiring circuit (3), an insulating layer (6) made of a polyimide or the like is formed in the periphery of the rewiring circuit (3) and the thermal stress relaxing post (4) except a top surface of the thermal stress relaxing post (4), a solder bump (7) is formed on the thermal stress relaxing post (4), and the thermal stress relaxing post (4), the insulating layer (6) and the solder bump (7) are formed by screen printing.

Abstract translation: 为了通过有效地形成热应力放松柱，绝缘层和焊料凸块来广泛提高整体制造效率，通过电镀在晶片（1）上形成再布线电路（3），制成热应力放松柱（4） 在重新配线电路（3）上形成诸如焊料等的导电材料，在重新布线电路（3）的周围形成由聚酰亚胺等构成的绝缘层（6），并且热应力 除了热应力松弛柱（4）的上表面之外，在热应力松弛柱（4）和热应力松弛柱（4）之间形成焊料凸点（7），绝缘层 （6）和焊料凸块（7）通过丝网印刷形成。

公开(公告)号：US20060243144A1

公开(公告)日：2006-11-02

申请号：US11412898

申请日：2006-04-28

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B41F15/42

CPC classification number: H05K3/1233 ,  B41F15/42 ,  H05K1/0393 ,  H05K1/181 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/1545

Abstract: To perform printing on the whole surface of a flexible printed board where electronic parts have been mounted, one pair of paste coating devices 1, 12 is used, portions of an elastic squeegee 7, a scraper 8, and the like, which correspond to projection portions of a screen plate 11, are recessed in order to avoid contacting with the projection portions 11A for covering electronic parts on the flexible printed board, the devices 1, 12 are provided at a suitable position of the flexible printed board so as to cross each other, so that the flexible printed board is printed successively in the running direction or the direction rectangularly crossing with the running direction of the flexible printed board, and pattern holes 11B, 11C are formed in portions other than projection portion 11A.

Abstract translation: 为了在安装电子部件的柔性印刷电路板的整个表面上进行印刷，使用一对糊状涂布装置1,12，弹性刮板7，刮板8等的与投影对应的部分 屏幕板11的部分凹入以避免与用于覆盖柔性印刷电路板上的电子部件的突出部分11A接触，器件1,12设置在柔性印刷电路板的合适位置以便交叉 使得柔性印刷电路板沿着与柔性印刷电路板的行进方向正交的行进方向或矩形方向连续印刷，并且图案孔11B，11C形成在除了突出部分11A之外的部分中。

公开(公告)号：US06749332B2

公开(公告)日：2004-06-15

申请号：US10229807

申请日：2002-08-28

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B01F902

CPC classification number: B01F9/0021 ,  B01F9/0001 ,  B01F9/003 ,  B01F2003/0028 ,  B01F2009/0059

Abstract: To solve a problem of a height at a time of stirring a laminated tube solder by a conventional apparatus, makes it easy to keep balance at a time of rotating, and improve a stirring efficiency, a pair of circular supporting plates (7, 7) are fixed to portions near both end portions of a rotation driving shaft (2) which is horizontally supported to a stand (1), the rotation driving shaft (2) is rotated by a drive motor (3), four rotary tubes (8, 8) with opening and closing lids are supported between a pair of circular supporting plates (7, 7), and the rotary tubes (8, 8) are revolved around the rotation driving shaft (2) in a vertical direction while being made rotate around their own axes respectively.

Abstract translation: 为了解决通过常规装置搅拌层叠管焊料时的高度问题，使得容易在旋转时保持平衡，并且提高搅拌效率，一对圆形支撑板（7,7） 固定在水平支撑在支架（1）上的旋转驱动轴（2）的两端部附近的部分，旋转驱动轴（2）由驱动马达（3）旋转，四个旋转管 8），其中开闭盖支撑在一对圆形支撑板（7,7）之间，并且旋转管（8,8）围绕旋转驱动轴（2）在垂直方向上旋转，同时围绕 自己的轴分别。

公开(公告)号：US06499994B1

公开(公告)日：2002-12-31

申请号：US09994217

申请日：2001-11-26

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: F27B902

CPC classification number: F27B9/023 ,  F27B9/2407 ,  F27B9/243 ,  H05K3/3494

Abstract: To save a space for heating remarkably than that of a conventional case, to apply main heating at a high temperature only to portions of chips to be soldered and to perform heating operation in a short period of time, a heating apparatus is composed of a preheating zone and a main heating zone. In the preheating zone, support pallets are rotated in the vertical direction within a vertical heat insulating chamber like a Ferris wheel. Also, heat at a temperature such that cream solder is not molten by heaters is applied to a printed circuit board by fans. In the main heating zone, a pattern mask is fixed within a heat insulating chamber, sleeve bodies are fitted in necessary through-holes, blind plugs are fitted in unnecessary through-holes and heat at a temperature such that the cream solder is molten by a heater is applied to portions of chips to be soldered by fans through sleeve bodies, coil springs and other sleeve bodies.

Abstract translation: 为了节省与常规情况相比显着加热的空间，仅将高温主加热仅供给待焊接的芯片的部分并且在短时间内进行加热操作，加热装置由预热 区和主加热区。 在预热区域中，支撑托盘在垂直隔热室（如摩天轮）内沿垂直方向旋转。 此外，在通过风扇将印刷电路板施加到使加热器不熔化膏状焊料的温度下进行加热。 在主加热区中，将图案掩模固定在绝热室内，将套筒体嵌入必要的通孔中，将盲插头安装在不需要的通孔中，并在使膏状焊料熔化的温度下加热 加热器通过套筒主体，螺旋弹簧和其他套筒体被应用于由风扇焊接的芯片的部分。

公开(公告)号：US06240840B1

公开(公告)日：2001-06-05

申请号：US09453069

申请日：1999-12-02

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B41F1508

CPC classification number: B41F15/40 ,  B41P2215/132 ,  H05K3/1216

Abstract: A screen printing apparatus which is structured such that a printing agent is not left within a screen hole of a mask after printing, having a main body of the screen printing apparatus whose upper side within it is formed as a chamber which can be sealed by setting a mask supporting table as a boundary, and a pressure within the chamber can be ascended and descended at a desired timing by suitable pressure ascending and descending means such as air bags and the like.

Abstract translation: 一种丝网印刷设备，其被构造成使得打印剂在打印之后不会留在掩模的筛孔内，其丝网印刷设备的主体被形成为可以通过设置密封的腔室 作为边界的面罩支撑台，并且室内的压力可以通过适当的上升和下降装置（例如气囊等）在期望的时间上升和下降。

公开(公告)号：US07141453B2

公开(公告)日：2006-11-28

申请号：US10939493

申请日：2004-09-14

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: H01L21/44

CPC classification number: H01L24/10 ,  H01L23/481 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: To make it possible to utilize both surfaces of a wafer, a wafer (1) is provided with a through hole (2) between upper and lower surfaces, an insulating layer (14) is formed in an inner surface of the through hole (2), rewiring circuits (3, 4) are formed on both the upper and lower surfaces, the rewiring circuits (3, 4) are connected by a plating (9) applied on the insulating layer (14) within the through hole (2), thermal stress relaxing posts (5, 6) are formed on the rewiring circuits (3, 4) by a conductive material such as a solder bumps (7, 8) are formed on the thermal stress relaxing posts (5, 6), and the solder bump (7) or (8) is connected to a wiring circuit (12) of a printed wiring substrate (11).

Abstract translation: 为了可以利用晶片的两个表面，晶片（1）在上表面和下表面之间设置有通孔（2），绝缘层（14）形成在通孔（2）的内表面 ），重新布线电路（3,4）形成在上表面和下表面上，再布线电路（3,4）通过施加在通孔（2）内的绝缘层（14）上的电镀（9）连接， 在热应力松弛柱（5,6）上形成热应力松弛柱（5,6），在再配线电路（3,4）上通过诸如焊料凸点（7,8）的导电材料形成， 焊料凸块（7）或（8）连接到印刷布线基板（11）的布线电路（12）。

公开(公告)号：US20050070050A1

公开(公告)日：2005-03-31

申请号：US10939493

申请日：2004-09-14

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: H01L23/52 ,  H01L21/3205 ,  H01L23/12 ,  H01L23/48 ,  H01L23/485 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/10 ,  H01L23/481 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: To make it possible to utilize both surfaces of a wafer, a wafer (1) is provided with a through hole (2) between upper and lower surfaces, an insulating layer (14) is formed in an inner surface of the through hole (2), rewiring circuits (3, 4) are formed on both the upper and lower surfaces, the rewiring circuits (3, 4) are connected by a plating (9) applied on the insulating layer (14) within the through hole (2), thermal stress relaxing posts (5, 6) are formed on the rewiring circuits (3, 4) by a conductive material such as a solder bumps (7, 8) are formed on the thermal stress relaxing posts (5, 6), and the solder bump (7) or (8) is connected to a wiring circuit (12) of a printed wiring substrate (11).

Abstract translation: 为了可以利用晶片的两个表面，晶片（1）在上表面和下表面之间设置有通孔（2），绝缘层（14）形成在通孔（2）的内表面 ），重新布线电路（3,4）形成在上表面和下表面上，再布线电路（3,4）通过施加在通孔（2）内的绝缘层（14）上的电镀（9）连接， 在热应力松弛柱（5,6）上形成热应力松弛柱（5,6），在再配线电路（3,4）上通过诸如焊料凸点（7,8）的导电材料形成， 焊料凸块（7）或（8）连接到印刷布线基板（11）的布线电路（12）。

公开(公告)号：US06604662B2

公开(公告)日：2003-08-12

申请号：US10229769

申请日：2002-08-28

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B65H2000

CPC classification number: H05K13/021 ,  B65H20/18 ,  B65H23/18 ,  B65H2701/1752

Abstract: A suitable tension is applied to a film-like printing body to be processed in a printing step or a parts mounting step. Further, the processed film-like printing body is automatically fed out by a predetermined stroke. In a state of a film-like printing body (9) being clamped by all the fixing clamps (19, 19, 29, 29), a tension clamp (12) in a rear side of a parts mounting apparatus (33) in a moving direction of the film-like printing body (9) is moved forward by a cylinder (17) while being kept open. Then, tension clamp (12) is pulled back by an operation of a tension coil spring (18) while the film-like printing body (9) being kept clamped. After mounting of the parts, the tension clamp (12) is opened. Next, the film-like printing body (9) is clamped by feeding clamps (20, 20), and at the same time, all of the fixing clamps (19, 19, 29, 29) are opened. Then, the feeding clamps (20, 20) are moved by a predetermined stroke in a feeding direction, and then, the film-like printing body (9) is clamped by all of the fixing clamps (19, 19, 29, 29). Thereafter, the feeding clamps (20, 20) are opened and returned.

Abstract translation: 在印刷步骤或零件安装步骤中，对要加工的膜状印刷体施加合适的张力。 此外，处理后的薄膜状印刷体自动地以预定行程输出。 在由所有固定夹（19,19,29,29）夹紧的胶片状印刷体（9）的状态下，在位于所述固定夹（19,19,29,29）的零件安装装置（33）的后侧的张紧夹（12） 胶片状印刷体（9）的移动方向由气缸（17）向前移动同时保持打开状态。 然后，通过拉紧螺旋弹簧（18）的操作将拉紧夹（12）拉回，同时保持夹持薄膜状印刷体（9）。 在安装零件之后，打开张紧夹（12）。 接下来，通过馈送夹具（20,20）夹持胶片状印刷体（9），同时打开所有固定夹具（19,19,29,29）。 然后，馈送夹具（20,20）沿进给方向移动预定行程，然后，薄膜状印刷体（9）被所有固定夹（19,19,29,29）夹紧， 。 此后，打开和返回进给夹（20,20）。

公开(公告)号：US06354199B2

公开(公告)日：2002-03-12

申请号：US09852759

申请日：2001-05-11

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B05C1706

CPC classification number: B41M1/12 ,  B41F15/0804 ,  B41P2215/14 ,  H05K3/1233 ,  H05K2203/0264

Abstract: A holding table for a plate to be printed, has a table plate with a supporting body on an end; a holding plate pivotally attached to an upper end of the supporting body; a moving table slidably mounted on guide rails secured to the table plate; a link pivotally connected to a free end of the holding plate and pivotally connected to the moving table. A driving plate fixed to the moving table has an opening with an internal thread. A driving motor on the table plate has an output shaft with a screw shaft engaged with the internal thread. Upon applying a printing agent to the plate to be printed by a movement of a squeegee, the plate to be printed is gradually separated from a screen from one side to another such that the printing agent within a through hole in the screen is smoothly and completely released.

Abstract translation: 用于待印刷的板的保持台，具有在端部具有支撑体的台板; 固定板，其可旋转地安装在所述支撑体的上端; 可滑动地安装在固定到台板的导轨上的移动台; 枢转地连接到保持板的自由端并枢转地连接到移动台的连杆。 固定在移动台上的驱动板具有带内螺纹的开口。 台板上的驱动电机具有输出轴，螺钉轴与内螺纹接合。 当通过刮板的移动将印刷剂施加到待印刷的印版上时，要印刷的印版逐渐从一面到另一侧分离，使得屏幕中的通孔内的印刷剂平滑且完全 释放

公开(公告)号：US06253676B1

公开(公告)日：2001-07-03

申请号：US09251347

申请日：1999-02-17

Applicant: Takehiko Murakami

Inventor： Takehiko Murakami

IPC: B41M112

CPC classification number: B41M1/12 ,  B41F15/0804 ,  B41P2215/14 ,  H05K3/1233 ,  H05K2203/0264

Abstract: A printing agent within a through hole of a screen is smoothly and completely released out when separating the screen from a plate to be printed. 1. In a screen printing method, at a time of applying a printing agent to a plate to be printed by a movement of a squeegee, the plate to be printed is gradually separated from said screen from one side of the screen to the other side thereof step by step during a movement of the squeegee to a movement finishing end.

Abstract translation: 当将屏幕与待印刷的板分离时，屏幕的通孔内的印刷剂平滑且完全地释放出来。 在丝网印刷方法中，在通过刮板的移动将印刷剂施加到待印刷的板上的时刻，待印刷的板从屏幕的一侧逐渐地从屏幕分离到另一侧 在刮板移动到移动终点的过程中，它逐步地进行。