Resist polymer, resist composition and patterning process
    1.
    发明申请
    Resist polymer, resist composition and patterning process 审中-公开
    抗蚀聚合物,抗蚀剂组成和图案化工艺

    公开(公告)号:US20050031988A1

    公开(公告)日:2005-02-10

    申请号:US10910308

    申请日:2004-08-04

    CPC分类号: G03F7/0397

    摘要: A polymer comprising recurring units of formulae (1), (2) and (3) increases a dissolution rate in an alkali developer under the action of an acid. R1, R2 and R5 are H or CH3, R3 and R4 are H or OH, and X is a tertiary exo-alkyl group having a bicyclo[2.2.1]heptane structure, represented by any of formulae (X-1) to (X-4): wherein R6 is a C1-C10 alkyl group. A resist composition comprising the inventive polymer has a sensitivity to high-energy radiation, improved resolution and minimized line edge roughness and lends itself to micropatterning with electron beams or deep UV for VLSI fabrication.

    摘要翻译: 包含式(1),(2)和(3)的重复单元的聚合物在酸的作用下增加碱显影剂中的溶解速率。 R 1,R 2和R 5是H或CH 3,R 3和R 4是H或OH,X是具有双环[2.2.1] 庚烷结构,由式(X-1)至(X-4)中的任一个表示:其中R 6是C 1 -C 10烷基。 包含本发明聚合物的抗蚀剂组合物对高能量辐射具有敏感性,改进的分辨率和最小化的线边缘粗糙度,并且借助于电子束或深紫外线用于VLSI制造的微图案化。

    Polymer, resist composition and patterning process
    2.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US07666571B2

    公开(公告)日:2010-02-23

    申请号:US11589109

    申请日:2006-10-30

    IPC分类号: C08F18/20 G03F7/00 G03F7/004

    摘要: A polymer of which dissolution rate in an alkaline developer increases under the action of acid comprises recurring units having formulae (1) and (2) wherein R1, R2, and R4 are H or methyl, R3 is difluoromethyl or trifluoromethyl, and X is tertiary alkyl. A resist composition comprising the polymer has a high sensitivity and resolution, decreased pattern collapse during development, and minimized MEF and is best suited as micropatterning material for the VLSI manufacture.

    摘要翻译: 在酸性作用下,碱性显影剂溶解速率增加的聚合物包含具有式(1)和(2)的重复单元,其中R 1,R 2和R 4为H或甲基,R 3为二氟甲基或三氟甲基,X为叔 烷基。 包含聚合物的抗蚀剂组合物具有高灵敏度和分辨率,在显影期间减少的图案塌陷,并使MEF最小化,并且最适合作为用于VLSI制造的微图案化材料。

    Polymer, resist composition and patterning process
    3.
    发明申请
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US20070099114A1

    公开(公告)日:2007-05-03

    申请号:US11589109

    申请日:2006-10-30

    IPC分类号: G03C1/00

    摘要: A polymer of which dissolution rate in an alkaline developer increases under the action of acid comprises recurring units having formulae (1) and (2) wherein R1, R2, and R4 are H or methyl, R3 is difluoromethyl or trifluoromethyl, and X is tertiary alkyl. A resist composition comprising the polymer has a high sensitivity and resolution, decreased pattern collapse during development, and minimized MEF and is best suited as micropatterning material for the VLSI manufacture.

    摘要翻译: 在酸性作用下,碱性显影剂中溶解速率增加的聚合物包括具有式(1)和(2)的重复单元,其中R 1,R 2,和 R 4是H或甲基,R 3是二氟甲基或三氟甲基,X是叔烷基。 包含聚合物的抗蚀剂组合物具有高灵敏度和分辨率,在显影期间减少的图案塌陷,并使MEF最小化,并且最适合作为用于VLSI制造的微图案化材料。

    Patterning process
    4.
    发明授权
    Patterning process 有权
    图案化过程

    公开(公告)号:US08192921B2

    公开(公告)日:2012-06-05

    申请号:US12686836

    申请日:2010-01-13

    摘要: A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.

    摘要翻译: 通过将包含含有酸不稳定基团的重复单元和光致酸产生剂的树脂的化学放大正性抗蚀剂组合物涂布在基材上,干燥以形成抗蚀剂膜,将抗蚀剂膜暴露于通过相的高能量辐射而形成图案 具有晶格状移位器阵列PEB,显影以形成阳性图案,照亮或加热阳性图案以消除酸不稳定基团以增加碱溶性并引发交联以赋予耐溶剂性,涂覆反转膜,和 将阳性图案溶解在碱性湿蚀刻剂中,以通过正/负反转形成图案。

    Chemical amplification type photoresist composition, method for producing a semiconductor device using the composition, and semiconductor substrate
    6.
    发明授权
    Chemical amplification type photoresist composition, method for producing a semiconductor device using the composition, and semiconductor substrate 有权
    化学放大型光致抗蚀剂组合物,使用该组合物的半导体器件的制造方法以及半导体衬底

    公开(公告)号:US06800551B2

    公开(公告)日:2004-10-05

    申请号:US10308115

    申请日:2002-12-03

    IPC分类号: H01L214763

    摘要: To provide a chemical amplification type positive photoresist composition suited to resist patterning of a substrate presenting surface step differences, a method for manufacturing the semiconductor device employing this composition, and a semiconductor substrate. In a method for manufacturing a semiconductor device, a resist film is formed using a chemical amplification type positive photoresist composition, comprised of a base resin and a basic compound added to the base resin at a rate of 1 to 100 mmol to 100 g of the base resin, on a substrate halving surface step differences and into which the organic removing solution is deposited or oozed, and a predetermined area of the resist film is exposed to light to form a resist pattern.

    摘要翻译: 为了提供一种适用于抗蚀剂图案化的化学放大型正性光致抗蚀剂组合物,呈现表面的阶梯差,使用该组合物制造半导体器件的方法以及半导体衬底。 在制造半导体器件的方法中,使用化学放大型正性光致抗蚀剂组合物形成抗蚀剂膜,该组合物由基础树脂和添加到基础树脂中的碱性化合物以1至100mmol至100g的 在基板半部分表面上的步骤差异,并且将有机去除溶液沉积或渗出到其中,并且将抗蚀剂膜的预定区域曝光以形成抗蚀剂图案。

    PATTERNING PROCESS
    7.
    发明申请
    PATTERNING PROCESS 有权
    绘图过程

    公开(公告)号:US20100178618A1

    公开(公告)日:2010-07-15

    申请号:US12686836

    申请日:2010-01-13

    IPC分类号: G03F7/20

    摘要: A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.

    摘要翻译: 通过将包含含有酸不稳定基团的重复单元和光致酸产生剂的树脂的化学放大正性抗蚀剂组合物涂布在基材上,干燥以形成抗蚀剂膜,将抗蚀剂膜暴露于通过相的高能量辐射而形成图案 具有晶格状移位器阵列PEB,显影以形成阳性图案,照亮或加热阳性图案以消除酸不稳定基团以增加碱溶性并引发交联以赋予耐溶剂性,涂覆反转膜,和 将阳性图案溶解在碱性湿蚀刻剂中,以通过正/负反转形成图案。

    Resist material and method for pattern formation
    8.
    发明申请
    Resist material and method for pattern formation 审中-公开
    抗蚀材料和图案形成方法

    公开(公告)号:US20050019692A1

    公开(公告)日:2005-01-27

    申请号:US10909225

    申请日:2004-07-30

    摘要: Provided are a resist material and a pattern formation method which have a good coating property, suppresses the occurrences of microbubbles in the solution and hardly generate a various kinds of defects causing a yield reduction in device step. Specifically, a resist material comprising a non-ionic surfactant containing neither a fluorine substituent nor a silicon-containing substituent in addition to a surfactant having a fluorine substituent and a pattern formation method therewith are provided.

    摘要翻译: 提供具有良好涂布性能的抗蚀剂材料和图案形成方法,抑制溶液中微泡的发生,并且难以产生导致器件步骤的成品率降低的各种缺陷。 具体而言,提供除了具有氟取代基的表面活性剂以外还含有不含氟取代基的非离子表面活性剂和含硅取代基的抗蚀剂材料及其图案形成方法。

    Patterning process
    10.
    发明授权
    Patterning process 有权
    图案化过程

    公开(公告)号:US08105764B2

    公开(公告)日:2012-01-31

    申请号:US12236129

    申请日:2008-09-23

    IPC分类号: G03F7/00 G03F7/004 G03F7/40

    摘要: A pattern is formed through positive/negative reversal by coating a chemically amplified positive resist composition comprising an acid labile group-bearing resin, a photoacid generator, and an organic solvent onto a substrate, prebaking the resist composition, exposing the resist film to high-energy radiation, post-exposure heating, and developing the exposed resist film with an alkaline developer to form a positive pattern; irradiating or heating the positive pattern to facilitate elimination of acid labile groups and crosslinking for improving alkali solubility and imparting solvent resistance; coating a reversal film-forming composition thereon to form a reversal film; and applying an alkaline wet etchant thereto for dissolving away the positive pattern.

    摘要翻译: 通过将包含含酸不稳定基团的树脂,光酸产生剂和有机溶剂的化学放大的正性抗蚀剂组合物涂布在基材上,预烘烤抗蚀剂组合物,将抗蚀剂膜暴露于高分子量聚合物,通过正/负反转形成图案, 能量辐射,曝光后加热,并用碱性显影剂显影曝光的抗蚀剂膜以形成正图案; 照射或加热阳性图案以便于消除酸不稳定基团和交联以改善碱溶解性并赋予耐溶剂性; 在其上涂覆反转成膜组合物以形成反转膜; 并向其施加碱性湿蚀刻剂以溶解正型图案。