摘要:
A polymer comprising recurring units of formulae (1), (2) and (3) increases a dissolution rate in an alkali developer under the action of an acid. R1, R2 and R5 are H or CH3, R3 and R4 are H or OH, and X is a tertiary exo-alkyl group having a bicyclo[2.2.1]heptane structure, represented by any of formulae (X-1) to (X-4): wherein R6 is a C1-C10 alkyl group. A resist composition comprising the inventive polymer has a sensitivity to high-energy radiation, improved resolution and minimized line edge roughness and lends itself to micropatterning with electron beams or deep UV for VLSI fabrication.
摘要:
A polymer of which dissolution rate in an alkaline developer increases under the action of acid comprises recurring units having formulae (1) and (2) wherein R1, R2, and R4 are H or methyl, R3 is difluoromethyl or trifluoromethyl, and X is tertiary alkyl. A resist composition comprising the polymer has a high sensitivity and resolution, decreased pattern collapse during development, and minimized MEF and is best suited as micropatterning material for the VLSI manufacture.
摘要:
A polymer of which dissolution rate in an alkaline developer increases under the action of acid comprises recurring units having formulae (1) and (2) wherein R1, R2, and R4 are H or methyl, R3 is difluoromethyl or trifluoromethyl, and X is tertiary alkyl. A resist composition comprising the polymer has a high sensitivity and resolution, decreased pattern collapse during development, and minimized MEF and is best suited as micropatterning material for the VLSI manufacture.
摘要翻译:在酸性作用下,碱性显影剂中溶解速率增加的聚合物包括具有式(1)和(2)的重复单元,其中R 1,R 2,和 R 4是H或甲基,R 3是二氟甲基或三氟甲基,X是叔烷基。 包含聚合物的抗蚀剂组合物具有高灵敏度和分辨率,在显影期间减少的图案塌陷,并使MEF最小化,并且最适合作为用于VLSI制造的微图案化材料。
摘要:
A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.
摘要:
To a resist composition, an alkali-soluble polymer having fluorinated ester-containing lactone units incorporated therein is included as an additive. The resist composition forms a resist film having a reduced contact angle after development. The resist film prevents water penetration during immersion lithography.
摘要:
To provide a chemical amplification type positive photoresist composition suited to resist patterning of a substrate presenting surface step differences, a method for manufacturing the semiconductor device employing this composition, and a semiconductor substrate. In a method for manufacturing a semiconductor device, a resist film is formed using a chemical amplification type positive photoresist composition, comprised of a base resin and a basic compound added to the base resin at a rate of 1 to 100 mmol to 100 g of the base resin, on a substrate halving surface step differences and into which the organic removing solution is deposited or oozed, and a predetermined area of the resist film is exposed to light to form a resist pattern.
摘要:
A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.
摘要:
Provided are a resist material and a pattern formation method which have a good coating property, suppresses the occurrences of microbubbles in the solution and hardly generate a various kinds of defects causing a yield reduction in device step. Specifically, a resist material comprising a non-ionic surfactant containing neither a fluorine substituent nor a silicon-containing substituent in addition to a surfactant having a fluorine substituent and a pattern formation method therewith are provided.
摘要:
A fluorinated monomer has formula (1) wherein R1 is H, F, methyl or trifluoromethyl, R2 is a monovalent hydrocarbon group which may have halogen or oxygen, A is a divalent hydrocarbon group, and k1 is 0, 1 or 2. A polymer derived from the fluorinated monomer may be endowed with appropriate water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer in formulating a resist composition.
摘要:
A pattern is formed through positive/negative reversal by coating a chemically amplified positive resist composition comprising an acid labile group-bearing resin, a photoacid generator, and an organic solvent onto a substrate, prebaking the resist composition, exposing the resist film to high-energy radiation, post-exposure heating, and developing the exposed resist film with an alkaline developer to form a positive pattern; irradiating or heating the positive pattern to facilitate elimination of acid labile groups and crosslinking for improving alkali solubility and imparting solvent resistance; coating a reversal film-forming composition thereon to form a reversal film; and applying an alkaline wet etchant thereto for dissolving away the positive pattern.