公开(公告)号：US06774316B1

公开(公告)日：2004-08-10

申请号：US09890145

申请日：2001-07-26

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

IPC分类号： H01R1204

CPC分类号： H05K3/462 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10T29/49165

摘要： The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and a via formed in the insulation layers and extended between neighboring wiring layers. The via including functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists.

摘要翻译： 本发明的目的在于提供一种绝缘和连接高度可靠的布线基板和布线基板的制造方法。 具有两层以上布线层的布线基板，位于相邻配线层之间并含有有机树脂的绝缘层，以及形成在绝缘层中并在相邻布线层之间延伸的通孔。 通孔包括功能性物质，以及至少存在绝缘层的有机树脂和存在气体的剩余空隙（第二空隙）的一些空隙（第一空隙）。

公开(公告)号：US06885788B2

公开(公告)日：2005-04-26

申请号：US10609494

申请日：2003-06-20

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Tousaku Nishiyama ,  Yoshinobu Idogawa

IPC分类号： H05K3/46 ,  G02B6/43 ,  H05K1/02 ,  H05K1/18 ,  G02B6/10 ,  G02B6/12 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K1/185

摘要： A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.

摘要翻译： 其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。 利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。

公开(公告)号：US07056571B2

公开(公告)日：2006-06-06

申请号：US10739156

申请日：2003-12-19

申请人： Satoru Tomekawa ,  Tetsuyoshi Ogura ,  Hiroyoshi Tagi

发明人： Satoru Tomekawa ,  Tetsuyoshi Ogura ,  Hiroyoshi Tagi

IPC分类号： B32B3/00

CPC分类号： B32B17/04 ,  B32B15/04 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09281 ,  Y10S428/901 ,  Y10T428/24917

摘要： There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.

摘要翻译： 提供一种布线板，其包括绝缘基板和位于绝缘基板的至少一个主表面上的布线层，其中绝缘基板包括由纱线制成的机织织物和机织织物 并且形成布线层的布线的至少一个布线在除了纱线的顶部之外的机织织物上延伸。

公开(公告)号：US20070137890A1

公开(公告)日：2007-06-21

申请号：US11698876

申请日：2007-01-29

申请人： Hiroyoshi Tagi ,  Tetsuyoshi Ogura ,  Yutaka Taguchi ,  Toshiyuki Asahi ,  Tatsuo Ogawa

发明人： Hiroyoshi Tagi ,  Tetsuyoshi Ogura ,  Yutaka Taguchi ,  Toshiyuki Asahi ,  Tatsuo Ogawa

IPC分类号： H05K1/16

CPC分类号： H05K1/0233 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614

摘要： A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.

摘要翻译： 信号传输引线105设置在电绝缘层103上。 提供辅助引线104A和104B，而辅助引线104A和104B不与信号传输引线105电接触。 辅助引线104A和104B的至少一部分被电磁屏蔽层106覆盖。 因此，可以抑制来自印刷电路板的内部或外部的辐射噪声，而不会降低通过信号传输引线105传输的信号的特性。

公开(公告)号：US07647034B2

公开(公告)日：2010-01-12

申请号：US11513267

申请日：2006-08-31

申请人： Tomoya Maekawa ,  Toru Yamada ,  Tetsuyoshi Ogura

发明人： Tomoya Maekawa ,  Toru Yamada ,  Tetsuyoshi Ogura

IPC分类号： H04B1/10

CPC分类号： G06F17/5036 ,  G06F2217/82

摘要： A design support system for circuit board includes: a noise source extracting unit for extracting a source of unwanted radiation noise which is generated from a circuit board mounted on an electronic equipment; a noise characteristics input unit for inputting noise characteristics of the unwanted radiation noise which is emitted by the extracted noise source; a noise attenuation ratio input unit for inputting an attenuation ratio of the unwanted radiation noise which is emitted by the noise source and propagated to a feed point of an antenna; a correlation value calculation unit for calculating a correlation value between the noise characteristics and the attenuation ratio of the unwanted radiation noise; and a comparator unit for comparing the calculated correlation value with a predetermined allowable value, whereby avoiding malfunction of an electronic equipment due to interference of unwanted radiation noises generated from the particular electronic equipment into the circuit board via the antenna.

摘要翻译： 一种用于电路板的设计支持系统包括：噪声源提取单元，用于提取从安装在电子设备上的电路板产生的不需要的辐射噪声源; 噪声特性输入单元，用于输入由所提取的噪声源发射的不需要的辐射噪声的噪声特性; 噪声衰减率输入单元，用于输入由噪声源发射并传播到天线的馈电点的不需要的辐射噪声的衰减比; 相关值计算单元，用于计算噪声特性与不需要的辐射噪声的衰减比之间的相关值; 以及比较器单元，用于将所计算的相关值与预定的允许值进行比较，由此由于由特定电子设备产生的不需要的放射线噪声经由天线到电路板中的避免电子设备的故障。

公开(公告)号：US07548792B2

公开(公告)日：2009-06-16

申请号：US12077879

申请日：2008-03-21

申请人： Yutaka Kumano ,  Tetsuyoshi Ogura ,  Toru Yamada

发明人： Yutaka Kumano ,  Tetsuyoshi Ogura ,  Toru Yamada

IPC分类号： G06F17/00 ,  G06F1/02

CPC分类号： G01N25/18

摘要： An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

摘要翻译： 计算由多种材料构成的结构的等效材料常数的等效材料常数计算系统包括输入形状数据的形状数据输入部分，输入材料常数数据的材料数据输入部分，分割结构的分割部分 以及小区域内部计算部分，其基于所述形状数据和材料常数数据，计算小区域内部计算部分中具有包括值的功能的小区域中的等效材料常数 在表示小区域中的至少一个方向的位置的变量中，表示对于小区域的一部分的区域的等效材料常数，并且使用该函数，计算小区域的等效材料常数 至少一个方向。

公开(公告)号：US07379780B2

公开(公告)日：2008-05-27

申请号：US11259835

申请日：2005-10-27

申请人： Yutaka Kumano ,  Tetsuyoshi Ogura ,  Toru Yamada

发明人： Yutaka Kumano ,  Tetsuyoshi Ogura ,  Toru Yamada

IPC分类号： G06F19/00

CPC分类号： G01N25/18

摘要： An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

公开(公告)号：US20080004819A1

公开(公告)日：2008-01-03

申请号：US11579866

申请日：2005-05-13

申请人： Akihiko Namba ,  Tetsuyoshi Ogura ,  Toru Yamada

发明人： Akihiko Namba ,  Tetsuyoshi Ogura ,  Toru Yamada

IPC分类号： G01R27/06

CPC分类号： G01R27/28

摘要： A method for measuring electric circuit parameters of a 2-terminal circuit having first and second terminals, includes steps of: terminating one of the first and second terminals with a terminal impedance Z1, to measure reflection characteristics al for the other terminal; terminating one of the first and second terminals with a terminal impedance Z2 different from the terminal impedance Z1, to measure reflection characteristics (2 for the other terminal; terminating one of the first and second terminals with a terminal impedance Z3 different from the terminal impedances Z1 and Z2, to measure reflection characteristics α3 for the other terminal; and calculating electric circuit parameters of the 2-terminal circuit based on the resultant reflection characteristics α1, α2 and α3, whereby measuring electric circuit parameters, such as S-parameters, Z-parameters or the like, even of a DUT having a weak ground, in a simple way with high accuracy and low cost.

摘要翻译： 一种用于测量具有第一和第二端子的2端电路的电路参数的方法，包括以下步骤：用端子阻抗Z1端接第一端子和第二端子之一，以测量另一端子的反射特性a1; 用不同于端子阻抗Z1的端子阻抗Z2端接第一端子和第二端子中的一个，以测量反射特性（2为另一端子;端接阻抗Z3与端子阻抗Z1不同的终端中的一个端子 和Z2，以测量另一终端的反射特性α3;以及基于所得到的反射特性α1，α2和α3计算2端电路的电路参数，由此测量诸如S参数，Z- 参数等，即使具有弱地的DUT也能以简单的方式具有高精度和低成本。

公开(公告)号：US06392164B1

公开(公告)日：2002-05-21

申请号：US09417662

申请日：1999-10-14

申请人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura

发明人： Hideki Iwaki ,  Yutaka Taguchi ,  Tetsuyoshi Ogura

IPC分类号： H05K111

CPC分类号： H05K1/0251 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/116 ,  H05K2201/0715 ,  H05K2201/09454 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09881 ,  H01L2924/00

摘要： An insulator is provided between interconnect layers oppositely placed. The interconnect layers are connected between by connection members provided through the insulator. The connection members at one and the other ends are connected between in their center positions. A shield layer is provided spaced from the intermediate connection layer generally on a same plane as the intermediate connection layer. The interconnect layers where considered generally as a circular cylinder have a diameter m, and the intermediate connection layer where considered generally as circular has a diameter r, r

摘要翻译： 在相互布置的互连层之间设置绝缘体。 互连层通过通过绝缘体提供的连接构件连接在一起。 连接构件在一端和另一端连接在它们的中心位置之间。 屏蔽层设置成与中间连接层间隔开，通常在与中间连接层相同的平面上。 通常被认为是圆柱体的互连层具有直径m，并且被认为通常为圆形的中间连接层具有直径r，r

公开(公告)号：US5910699A

公开(公告)日：1999-06-08

申请号：US876287

申请日：1997-06-16

申请人： Akihiko Namba ,  Tetsuyoshi Ogura ,  Yoshihiro Tomita ,  Kazuo Eda

发明人： Akihiko Namba ,  Tetsuyoshi Ogura ,  Yoshihiro Tomita ,  Kazuo Eda

IPC分类号： H01L41/312 ,  H01L41/39 ,  H03H3/02 ,  H03H9/05 ,  H03H9/19 ,  H01L41/08

CPC分类号： H03H9/0519 ,  H01L41/312 ,  H03H3/04 ,  H03H9/19 ,  Y10S148/012 ,  Y10T156/1052 ,  Y10T156/1082

摘要： A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.

摘要翻译： 一种制造复合基板的方法和由此制造的复合基板，其中具有不同热膨胀系数的第一和第二基板的表面被镜面化并且彼此层叠。 施加第一热处理之后，将第二基板的一部分去除足以露出第一基板的深度。 最终的第二次热处理直接粘合基材。