摘要:
An image sensor, comprising a semiconductor layer formed on at least a first region of a substrate; first electrodes arranged in line and electrically connected to the semiconductor layer of said first region; and second electrodes arranged in line and electrically connected to said semiconductor layer of said first region. The second electrodes are respectively formed as a common electrode, and each of the first electrodes, a portion of said second electrode facing the first electrode and the semiconductor layer positioned therebetween form a photo-sensing element. First wires respectively extend from said first electrodes to a second region of said substrate. An insulating layer is continuously formed on the first and second regions, covering said photo-sensing elements and the first wires as well as second wires formed in parallel on the insulating layer of said second region. The second wires are electrically connected to the first wires at through holes formed in the insulating layer.
摘要:
A thin film static induction transistor comprises a first n type semiconductor layer provided on an insulative substrate and a second n type semiconductor layer mounted on the first layer. The second layer includes a first region having a first level top wall and a second region having a second level top wall lower that the first level top wall. The first and second regions are alternately arranged. A third semiconductor layer is provided on the first level top wall. A recess is formed which includes side walls of the third layers, side wall of the first regions and the second level top wall. A fourth semiconductor layer is deposited on the inner wall of the recess, and a gate electrode is provided on the fourth layer. The fourth layer consists of an intrinsic semiconductor layer or a semiconductor layer having a lower impurity concentration than the second layer.
摘要:
A switching resistance RAM that is highly integrated as well as reduced in a read-out time is realized. There is formed an NPN type bipolar transistor BT composed of a collector layer made of an N-well 11, a base layer made of a P+ type Si layer 12A formed in a surface of the N-well 11, and an emitter layer made of an N+ type Si layer 15 formed in a surface of the P+ type Si layer 12A. Also, there are formed a word line WL0 electrically connected to the N+ type Si layer 15 and bit lines BL1-BL4 intersecting with the word line WL0. Also, there are formed a plurality of switching layers 14 formed on a surface of the P+ type Si layer 12A, each being electrically connected to corresponding each of the bit lines and switching between an ON state and an OFF state and an electric potential fixing line 19A to fix the P+ type Si layer 12A at a predetermined electric potential.
摘要:
A piezoelectric displacing device includes a plurality of longitudinal effect-type piezoelectric displacing members arranged juxtaposed to each other such that displacement axes thereof are substantially parallel to each other, each of said piezoelectric displacing member converting a voltage applied thereto to a mechanical displacement. Connectors are provided which mechanically connect the piezoelectric displacing members in series with each other and derive a sum of amounts of displacement of the piezoelectric displacing members along the displacement axes thereof to give an amount of displacement of the device.
摘要:
An insulation system for winding of electric rotating machines having thermal resistance of class H or more and excellent adhesiveness between a conductor and an insulating layer and resistance to thermal stress can be produced by wrapping a plurality of layers of an insulating tape or sheet having thermal resistance of class H or more around a winding conductor, impregnating the thus treated winding conductor with a solventless varnish consisting essentially of 1 equivalent of an epoxy compound containing at least two vicinal epoxy groups, more than one equivalent of an organic polyisocyanate, and then heating the inpregnated winding conductor at a temperature above 60.degree. C. for a time sufficient to form and cure a resin containing as recurring units at least two isocyanurate rings directly bonded to one another through the residue of the polyisocyanate and two oxazolidone rings directly bonded to each other through the residue of the polyepoxide in the presence of 0.01-10% by weight of a catalyst which forms the isocyanurate rings and oxazolidone rings based on the total amount of the polyepoxide and polyisocyanate.
摘要:
A switching resistance RAM that is highly integrated as well as reduced in a read-out time is realized. There is formed an NPN type bipolar transistor BT composed of a collector layer made of an N-well 11, a base layer made of a P+ type Si layer 12A formed in a surface of the N-well 11, and an emitter layer made of an N+ type Si layer 15 formed in a surface of the P+ type Si layer 12A. Also, there are formed a word line WL0 electrically connected to the N+ type Si layer 15 and bit lines BL1-BL4 intersecting with the word line WL0. Also, there are formed a plurality of switching layers 14 formed on a surface of the P+ type Si layer 12A, each being electrically connected to corresponding each of the bit lines and switching between an ON state and an OFF state and an electric potential fixing line 19A to fix the P+ type Si layer 12A at a predetermined electric potential.
摘要:
There is offered a switching resistance RAM that is very much reduced in an occupied area and is highly integrated. Memory cells CEL11-CEL14 are formed corresponding to four intersections of word lines WL0 and WL1 and bit lines BL0 and BL1. Each of the memory cells CEL11-CEL14 are composed of a switching layer 13 formed on a surface of an N+ type Si layer 11. The switching layer 13 is electrically connected to the bit line BL0 or BL1 thereabove through an electrode 14. The switching layer 13 is composed of a SiC layer 13A stacked on the surface of the N+ type Si layer 11 and a Si oxide layer 13B stacked on the SiC layer 13A. A top surface of the Si oxide layer 13B, that is the uppermost layer of the switching layer 13, is electrically connected to the corresponding bit line BL0 or BL1.
摘要:
An electromagnet assembly for an electromagnetic apparatus has a ring member, a coil bobbin having an electrical wire wound a spool of the ring member, and a ring case. The ring member is disposed in an annular groove of the ring case. An opening is formed through the ring case adjacent to its closed end surface. A connector, which is disposed on the ring case and covers the opening, includes a case having a closed shape and a bottom, and a cap closing an open end of the case. Ends of the electrical wire and ends of a lead wire are joined in the connector. A projection portion is formed around a fringe portion of a first end surface of the cap and abuts an open end surface of the case. The cap is secured fixedly to the case after the projection portion is melted.
摘要:
A photosensor for realizing an image sensor which can meet the requirements of high resolution, high operation speed and high signal-to-noise ratio is disclosed. The photosensor comprises a circuit substrate, a thin film transistor formed on the circuit substrate and an amorphous silicon photodiode formed on the substrate integral with the thin transistor between the drain and gate electrodes thereof. Also formed on the circuit substrate adjacent to the thin film transistor and photodiode are a charging switch element for coupling the photodiode to a DC power source to charge an inter-electrode capacitance of the photodiode, a charge storage capacitor charged by a channel current of the thin film transistor controlled by an inter-electrode capacitance voltage of the photodiode which varies in response to incident light after the inter-electrode capacitance has been charged, and a detecting switch element for coupling the capacitor to an output amplifier. The charging and detecting switch elements are each formed of a thin film transistor.
摘要:
A semiconductor memory device that is configured with a Si substrate layer, a SiC layer and a Si oxide layer, including a structure in which the SiC layer is layered onto the Si substrate layer and the Si oxide layer is layered onto the SiC. Wherein, the Si oxide layer includes two or more layers whose compositional ratios of SiO2 are different in a direction of layers, and a compositional ratio of SiO2 in the. Si oxide layer that is distanced most from the SiC layer is more than other layers.