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公开(公告)号：US07923788B2
公开(公告)日：2011-04-12
申请号：US12207121
申请日：2008-09-09
CPC分类号： H01L29/785 , H01L29/66795
摘要： A semiconductor device has a plurality of fins formed on a semiconductor substrate to be separated from each other, a first contact region which connects commonly one end side of the plurality of fins, a second contact region which connects commonly the other end side of the plurality of fins, a gate electrode arranged to be opposed to at least both side surfaces of the plurality of fins by sandwiching a gate insulating film therebetween, a source electrode including the first contact region and the plurality of fins on a side closer to the first contact region than the gate electrode, and a drain electrode including the second contact region and the plurality of fins on a side closer to the second contact than the gate electrode. The ratio Rd/Rs of a resistance Rd of each fin in the drain region to a resistance Rs of each fin in the source region is larger than 1.
摘要翻译： 半导体器件具有形成在半导体衬底上的多个翅片以彼此分离，第一接触区域与多个翅片的共同的一端侧连接;第二接触区域，其共同连接多个翅片的另一端侧; 翅片，栅电极，通过在其间夹有栅极绝缘膜而布置成与所述多个翅片的至少两个侧表面相对，在所述第一触点更靠近所述第一触点的一侧包括所述第一接触区域和所述多个翅片的源电极 区域，以及包括第二接触区域的漏电极和在比栅电极更靠近第二接触的一侧的多个翅片。 漏极区域中的每个鳍片的电阻Rd与源极区域中的每个鳍片的电阻Rs的比Rd / Rs大于1。
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公开(公告)号：US07989856B2
公开(公告)日：2011-08-02
申请号：US12335701
申请日：2008-12-16
申请人： Masakazu Goto , Nobutoshi Aoki , Takashi Izumida , Kimitoshi Okano , Satoshi Inaba , Ichiro Mizushima
发明人： Masakazu Goto , Nobutoshi Aoki , Takashi Izumida , Kimitoshi Okano , Satoshi Inaba , Ichiro Mizushima
IPC分类号： H01L21/336
CPC分类号： H01L29/785 , H01L29/7845
摘要： A fin transistor includes: a substrate; a plurality of semiconductor fins formed on the substrate; a gate electrode covering a channel region of the semiconductor fins; and a member as a stress source for the semiconductor fins included in a region of the gate electrode and the region provided between the semiconductor fins, and the member being made of a different material from the gate electrode.
摘要翻译： 翅片晶体管包括：衬底; 形成在所述基板上的多个半导体翅片; 覆盖半导体鳍片的沟道区域的栅电极; 以及作为用于包括在栅极电极的区域中的半导体鳍片的应力源的构件和设置在半导体鳍片之间的区域，并且该构件由与栅电极不同的材料制成。
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公开(公告)号：US20110068401A1
公开(公告)日：2011-03-24
申请号：US12881415
申请日：2010-09-14
申请人： Takashi Izumida , Nobutoshi Aoki , Masaki Kondo , Yoshiaki Asao , Satoshi Inaba
发明人： Takashi Izumida , Nobutoshi Aoki , Masaki Kondo , Yoshiaki Asao , Satoshi Inaba
CPC分类号： H01L29/785 , H01L21/823431 , H01L29/66795
摘要： A semiconductor device of an embodiment includes a substrate and a plurality of fins formed on the substrate. The plurality of fins is arranged so that a first distance and a second distance narrower than the first distance are repeated. In addition, the plurality of fins include a semiconductor region in which an impurity concentration of lower portions of side surfaces facing each other in sides forming the first distance is higher than an impurity concentration of lower portions of side surfaces facing each other in sides forming the second distance.
摘要翻译： 实施例的半导体器件包括基板和形成在基板上的多个翅片。 多个翅片被布置成使得比第一距离窄的第一距离和第二距离被重复。 另外，多个散热片包括半导体区域，其中在形成第一距离的侧面中彼此面对的侧面的下部的杂质浓度高于形成第一距离的侧面彼此相对的侧表面的下部的杂质浓度 第二距离。
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公开(公告)号：US08829623B2
公开(公告)日：2014-09-09
申请号：US12248483
申请日：2008-10-09
申请人： Nobutoshi Aoki , Takashi Izumida , Masaki Kondo , Fumitaka Arai
发明人： Nobutoshi Aoki , Takashi Izumida , Masaki Kondo , Fumitaka Arai
IPC分类号： H01L27/088 , H01L27/115
CPC分类号： H01L27/11529 , H01L27/11524 , H01L27/11526
摘要： According to an aspect of the present invention, there is provided a semiconductor memory device including: a semiconductor substrate having: a contact region; a select gate region; and a memory cell region; a first element isolation region formed in the contact region and having a first depth; a second element isolation region formed in the select gate region and having a second depth; and a third element isolation region formed in the memory cell region and having a third depth which is smaller than the first depth.
摘要翻译： 根据本发明的一个方面，提供了一种半导体存储器件，包括：半导体衬底，具有：接触区域; 选择栅极区; 和存储单元区域; 形成在所述接触区域中并且具有第一深度的第一元件隔离区; 形成在所述选择栅极区中并具有第二深度的第二元件隔离区; 以及形成在所述存储单元区域中并且具有小于所述第一深度的第三深度的第三元件隔离区域。
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公开(公告)号：US08610282B2
公开(公告)日：2013-12-17
申请号：US13109086
申请日：2011-05-17
IPC分类号： H01L23/13
CPC分类号： H01L23/5222 , H01L21/7682 , H01L21/76838 , H01L23/528 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a substrate, and a plurality of interconnects provided in the same interconnect layer above the substrate. The device further includes a plurality of insulators provided so as to be buried between the plurality of interconnects. Moreover, the plurality of interconnects include an interconnect group in which 2N or more interconnects are successively arrayed so that correlation coefficients of line edge roughness (LER) between both side surfaces of the respective interconnects are positive, where N is an integer of 4 or more.
摘要翻译： 在一个实施例中，半导体器件包括衬底和设置在衬底上方的相同互连层中的多个互连。 该装置还包括多个绝缘体，其设置成埋在多个互连件之间。 此外，多个互连包括互连组，其中连续排列2N个或更多个互连，使得各互连的两个侧表面之间的线边缘粗糙度（LER）的相关系数为正，其中N为4或更大的整数 。
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公开(公告)号：US08354706B2
公开(公告)日：2013-01-15
申请号：US12719193
申请日：2010-03-08
IPC分类号： H01L29/788
CPC分类号： H01L29/7883 , G11C16/0441 , H01L21/28273 , H01L27/11521 , H01L27/11524 , H01L29/42324
摘要： A semiconductor memory device according to an embodiment of the present invention includes a substrate, a first gate insulator formed on the substrate and serving as an F-N (Fowler-Nordheim) tunneling film, a first floating gate formed on the first gate insulator, a second gate insulator formed on the first floating gate and serving as an F-N tunneling film, a second floating gate formed on the second gate insulator, an intergate insulator formed on the second floating gate and serving as a charge blocking film, and a control gate formed on the intergate insulator, at least one of the first and second floating gates including a metal layer.
摘要翻译： 根据本发明实施例的半导体存储器件包括衬底，形成在衬底上并用作FN（Fowler-Nordheim）隧穿膜的第一栅极绝缘体，形成在第一栅绝缘体上的第一浮栅，第二栅绝缘体 形成在第一浮栅上并用作FN隧穿膜的栅极绝缘体，形成在第二栅极绝缘体上的第二浮栅，形成在第二浮栅上并用作电荷阻挡膜的栅极绝缘体，以及形成在栅极绝缘体上的控制栅极 所述隔间绝缘体，所述第一和第二浮动栅极中的至少一个包括金属层。
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公开(公告)号：US08289782B2
公开(公告)日：2012-10-16
申请号：US12719420
申请日：2010-03-08
申请人： Takashi Izumida , Tomomi Kusaka , Masaki Kondo , Nobutoshi Aoki
发明人： Takashi Izumida , Tomomi Kusaka , Masaki Kondo , Nobutoshi Aoki
IPC分类号： G11C16/04
CPC分类号： H01L29/7881 , G11C16/0408 , H01L27/11519 , H01L27/11521 , H01L27/11524 , H01L27/11531 , H01L29/42332 , H01L29/7887
摘要： A semiconductor memory device according to an embodiment of the present invention includes a substrate, a gate insulator formed on the substrate and serving as an F-N (Fowler-Nordheim) tunneling film, a first floating gate formed on the gate insulator, a first intergate insulator formed on the first floating gate and serving as an F-N tunneling film, a second floating gate formed on the first intergate insulator, a second intergate insulator formed on the second floating gate and serving as a charge blocking film, and a control gate formed on the second intergate insulator.
摘要翻译： 根据本发明的实施例的半导体存储器件包括：衬底，形成在衬底上并用作FN（Fowler-Nordheim）隧穿膜的栅极绝缘体，形成在栅极绝缘体上的第一浮栅，第一栅极绝缘体 形成在第一浮栅上并用作FN隧道膜，形成在第一栅极绝缘体上的第二浮栅，形成在第二浮栅上并用作电荷阻挡膜的第二栅极绝缘体，以及形成在第一浮栅上的控制栅 第二隔间绝缘子。
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公开(公告)号：US08134203B2
公开(公告)日：2012-03-13
申请号：US12618119
申请日：2009-11-13
申请人： Takashi Izumida , Nobutoshi Aoki
发明人： Takashi Izumida , Nobutoshi Aoki
IPC分类号： H01L29/788 , H01L29/423
CPC分类号： H01L27/11568 , H01L21/28282 , H01L27/0688 , H01L27/11578 , H01L27/11582
摘要： In a nonvolatile semiconductor memory device provided with memory cell transistors arranged in a direction and a select transistor to select the memory cell transistors, each of the memory cell transistors of a charge trap type are at least composed of a first insulating layer and a first gate electrode respectively, and the select transistor is at least composed of a second insulating layer and a second gate electrode. The first gate electrode is provided with a first silicide layer of a first width formed on the first insulating layer. The second gate electrode is provided with an impurity-doped silicon layer formed on the second insulating layer and with a second silicide layer of a second width formed on the impurity-doped silicon layer. The second silicide has the same composition as the first silicide. The second width is larger than the first width.
摘要翻译： 在设置有沿方向排列的存储单元晶体管和选择晶体管以选择存储单元晶体管的非易失性半导体存储器件中，电荷陷阱型的每个存储单元晶体管至少由第一绝缘层和第一栅极 电极，并且选择晶体管至少由第二绝缘层和第二栅电极组成。 第一栅电极设置有形成在第一绝缘层上的第一宽度的第一硅化物层。 第二栅电极设置有形成在第二绝缘层上的杂质掺杂硅层，以及形成在杂质掺杂硅层上的第二宽度的第二硅化物层。 第二硅化物具有与第一硅化物相同的组成。 第二宽度大于第一宽度。
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9.发明授权公开(公告)号：US08686488B2
公开(公告)日：2014-04-01
申请号：US13602634
申请日：2012-09-04
申请人： Masaki Kondo , Nobutoshi Aoki , Takashi Izumida , Tomomi Yoda
发明人： Masaki Kondo , Nobutoshi Aoki , Takashi Izumida , Tomomi Yoda
IPC分类号： H01L29/788 , H01L21/4763
CPC分类号： H01L29/788 , H01L21/28273 , H01L27/11521 , H01L29/4916 , H01L29/66825 , H01L29/7883
摘要： According to one embodiment, a nonvolatile semiconductor memory device includes a semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a floating gate electrode formed on the gate insulating film, made of polysilicon containing a p-type impurity as a group XIII element, and having a lower film and an upper film stacked on the lower film, an inter-electrode insulating film formed on the floating gate electrode, and a control gate electrode formed on the inter-electrode insulating film. One of a concentration and an activation concentration of the p-type impurity in the upper film is higher than one of a concentration and an activation concentration of the p-type impurity in the lower film.
摘要翻译： 根据一个实施例，非易失性半导体存储器件包括半导体衬底，形成在半导体衬底上的栅绝缘膜，形成在栅极绝缘膜上的浮栅，由含有p型杂质的多晶硅组成， 并且具有层叠在下膜上的下膜和上膜，形成在浮栅上的电极间绝缘膜和形成在电极间绝缘膜上的控制栅电极。 上膜中的p型杂质的浓度和活化浓度之一高于下膜中的p型杂质的浓度和活化浓度之一。
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公开(公告)号：US08420467B2
公开(公告)日：2013-04-16
申请号：US13224449
申请日：2011-09-02
申请人： Takashi Izumida , Nobutoshi Aoki
发明人： Takashi Izumida , Nobutoshi Aoki
IPC分类号： H01L21/8224
CPC分类号： H01L29/7851 , H01L29/1054 , H01L29/66795
摘要： A semiconductor device has a semiconductor substrate, a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film formed on the carbon-containing silicon film, a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction, source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode, and an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate.
摘要翻译： 半导体器件具有半导体衬底，形成在半导体衬底上的具有长边方向和短边方向的半导体鳍片，并且具有包含杂质的含碳硅膜和形成在其上的硅膜 含碳硅膜，形成为在短边方向上面对半导体翅片的两侧面的栅电极，分别形成在长边方向两侧的半导体翅片中的源区和漏区 半导体鳍片的方向以夹着栅极电极;以及元件隔离绝缘膜，其形成在半导体鳍片的侧表面上以及栅电极和半导体衬底之间。
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