-
公开(公告)号：US20070241943A1
公开(公告)日：2007-10-18
申请号：US11404110
申请日：2006-04-14
申请人： Teong Tan , Premkumar Ramachandr , Yee Chin , Cheng Tan , Weng Wong
发明人： Teong Tan , Premkumar Ramachandr , Yee Chin , Cheng Tan , Weng Wong
IPC分类号： H03M7/00
CPC分类号： G01D5/34715
摘要： A reflection-based optical encoding apparatus for the detection of position and/or motion of a mechanical device includes an encoding medium having at least a first reflective portion, and an encoder housing having a light-emitting source and a light-detecting sensor embedded within, the encoder housing being placed in proximity to the encoding medium such that a functional light path can be established from the light-emitting source to the light-detecting sensor via the first reflective portion of the encoding medium. The encoder housing includes a first flat facet positioned between the light-emitting source and the encoding medium, the first flat facet having a first angle relative to a common geometric plane such that light passing from the light-emitting source to the encoding medium is refracted along a first angled path in a manner that the refracted light strikes a desired location of the encoding medium.
摘要翻译： 用于检测机械装置的位置和/或运动的基于反射的光编码装置包括具有至少第一反射部分的编码介质和具有嵌入在其中的发光源和光检测传感器的编码器壳体 编码器壳体被放置在编码介质附近，使得可以通过编码介质的第一反射部分从发光源到光检测传感器建立功能光路。 编码器壳体包括位于发光源和编码介质之间的第一平面，第一平面相对于共同的几何平面具有第一角度，使得从发光源通向编码介质的光被折射 沿着第一有角度的路径以折射光照射到编码介质的期望位置的方式。
-
公开(公告)号：US20070090282A1
公开(公告)日：2007-04-26
申请号：US11259419
申请日：2005-10-26
IPC分类号： G01D5/34
CPC分类号： G01D5/34715
摘要： Optical encoders having one or more of a number of disclosed features are disclosed. The features of the optical encoder in accordance with the present invention include a symmetrical (for example, circular) emitter; baffle between the emitter and a detector; double-dome or single-dome encapsulant; multiple detector; and multiple (at least three) data channels.
摘要翻译： 公开了具有多个公开特征中的一个或多个的光学编码器。 根据本发明的光学编码器的特征包括对称（例如圆形）发射器; 发射器和检测器之间的挡板; 双圆顶或单圆顶密封剂; 多检测器 和多个（至少三个）数据信道。
-
3.发明申请公开(公告)号：US20070205285A1
公开(公告)日：2007-09-06
申请号：US11370133
申请日：2006-03-06
IPC分类号： G06K7/10
CPC分类号： G06K7/10831
摘要： An encoder having a code strip and an emitter-detector module is disclosed. The code strip includes alternating reflective and opaque stripes. The emitter-detector module includes a housing, a lens insert, a light source and a photodetector. Light from the light source illuminates the code strip, and light reflected from the code strip is incident on the photodetector. The lens insert includes a lens that processes light generated by the light source either before the light reaches the code strip or after the light is reflected from the code strip. The lens insert mates with the housing to position the lens at a predetermined point relative to the light source or the photodetector. The housing will accept a plurality of lens inserts, each lens insert having a different lens from the others of the lens inserts.
摘要翻译： 公开了具有码带和发射极检测器模块的编码器。 代码条包括交替的反射和不透明条纹。 发射极检测器模块包括壳体，透镜插入件，光源和光电检测器。 来自光源的光照亮编码条，并且从代码条反射的光入射到光电检测器上。 透镜插入件包括在光到达代码条之前或在光从代码条反射之后处理由光源产生的光的透镜。 透镜插入件与壳体配合，以将透镜定位在相对于光源或光电检测器的预定点。 该壳体将接收多个透镜插入件，每个透镜插入件具有与透镜插入物中的其它透镜插入件不同的透镜。
-
公开(公告)号：US20070272940A1
公开(公告)日：2007-11-29
申请号：US11838301
申请日：2007-08-14
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L23/49844 , H01L33/62 , H01L2224/48227 , H01L2924/01322
摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.
摘要翻译： 半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。 发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。 半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。 第一和第二导电接合焊盘经由第一和第二导电互连元件电连接到第一和第二导电连接焊盘。
-
公开(公告)号：US20070061802A1
公开(公告)日：2007-03-15
申请号：US11348139
申请日：2006-02-06
IPC分类号： G06F9/445
CPC分类号： G06F8/61 , A63F13/10 , A63F13/77 , A63F13/95 , A63F2300/207
摘要： A database is built in a computer system and includes a characteristic set, an installation data set corresponding to the characteristic set, a reference command set and an execution set corresponding to the reference command set. A specified installation data in the installation set is used to automatically and continuously execute a series of installation commands of a PC game when a characteristic of the PC game matches a characteristic in the characteristic set corresponding to the specified installation data. Alternatively, a specified execution is performed when an installation command of the PC game matches a reference command in the reference command set corresponding to the specified execution. The computer system is thus capable of automatically installing thereinto a PC game from a storage medium.
摘要翻译： 数据库内置在计算机系统中，包括特征集，对应于特征集的安装数据集，参考命令集和与参考命令集相对应的执行集。 当PC游戏的特征与对应于指定的安装数据的特征集中的特征匹配时，安装集中的指定安装数据被用于自动并连续地执行PC游戏的一系列安装命令。 或者，当PC游戏的安装命令与对应于指定执行的参考命令集中的参考命令相匹配时，执行指定的执行。 因此，计算机系统能够从存储介质自动地安装到PC游戏中。
-
公开(公告)号：US20060268144A1
公开(公告)日：2006-11-30
申请号：US11140157
申请日：2005-05-27
申请人： Cheng Tan , Piang Seow
发明人： Cheng Tan , Piang Seow
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H01L24/48 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/8592 , H01L2224/85951 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.
摘要翻译： 图像传感器通过将图像传感器附接到基板来封装，在图像传感器或透明盖上形成金属凸块，其中金属凸块以图像传感器的有效区域的周边周围的图案形成。 然后透明盖子在金属凸块处胶合到图像传感器。 使用例如常规的引线接合技术在图像传感器和基板之间形成电连接。 电气连接被封装在环氧树脂中以进行保护。 在一个实施例中，多个图像传感器被封装在同一基板上并通过例如锯切被分离成单独封装的图像传感器。
-
公开(公告)号：US20050077616A1
公开(公告)日：2005-04-14
申请号：US10683489
申请日：2003-10-09
CPC分类号： H01L33/62 , H01L23/36 , H01L24/48 , H01L24/49 , H01L33/64 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.
摘要翻译： 公开了一种具有顶表面和底表面的导热体的电路元件和其上具有电子电路的管芯。 模具包括用于为电子电路供电的第一和第二接触点。 模具与导热体热接触，模头的底表面小于导热体的顶表面。 模具上的第一接触点连接到结合到导热体的顶表面的第一迹线。 封装盖覆盖模具。 第一迹线具有延伸到封装帽外部的第一部分和被封装盖覆盖的第二部分。 导热体优选由铜或铝构成，并且包括在安装模具的第一表面上具有开口的空腔。 模具优选地包括发光装置。
-
公开(公告)号：US20100017330A1
公开(公告)日：2010-01-21
申请号：US11754852
申请日：2007-05-29
申请人： Cheng Tan
发明人： Cheng Tan
CPC分类号： G06Q10/08 , G06Q10/06 , G06Q10/087 , G06Q20/203 , G06Q20/3674
摘要： A method and system are described for protecting a manufactured item from counterfeiting. The manufactured item, which is marked with an identifier, such as a serial number, is associated with a code generator that has secret functions and data for generating verification codes. The manufactured item is then supplied along with the corresponding code generator. Thereafter, the identifier from the manufactured item and the verification code generated by the code generator are used to verify authenticity of the manufactured item.
摘要翻译： 描述了一种用于保护制成品免于假冒的方法和系统。 标有诸如序列号的标识符的制造商品与具有秘密功能的代码生成器和用于生成验证码的数据相关联。 然后将制造的物品与相应的代码生成器一起提供。 此后，使用来自制造项目的标识符和由代码生成器生成的验证码来验证制造物品的真实性。
-
公开(公告)号：US20060057970A1
公开(公告)日：2006-03-16
申请号：US11205625
申请日：2005-08-17
申请人： Patrick Kusbel , Cheng Tan , Troy Curtiss
发明人： Patrick Kusbel , Cheng Tan , Troy Curtiss
CPC分类号： H04B15/04 , H04B15/06 , H04B2215/064 , H04B2215/065
摘要： A system and a method are provided for reducing the effects of spurious frequencies in a wireless communications device. The system comprises a processor having a reference frequency input and a clock having an output connected to the processor input. The clock supplies a clock frequency, or reference frequency, to the processor. The reference frequency is the frequency at which the processor operates. The clock also has an input for selecting a reference frequency to provide to the processor. The system also includes a transceiver having a plurality of selectable communications passbands. If the wireless communications device is a telephone, for example, the transceiver frequency (passband) may change as a function of the mode in which the phone is operating (AMPS, PCS, GSM, CDMA, or W-CDMA). In response to changing operating modes (transceiver passband), the clock frequency is adjusted. The clock frequency is selected so that harmonic frequencies associated with the clock frequency do not substantially interfere with the transceiver passband.
-
公开(公告)号：US06999723B2
公开(公告)日：2006-02-14
申请号：US09998458
申请日：2001-11-29
申请人： Patrick Kusbel , Cheng Tan , Troy Curtiss
发明人： Patrick Kusbel , Cheng Tan , Troy Curtiss
CPC分类号： H04B15/04 , H04B15/06 , H04B2215/064 , H04B2215/065
摘要： A system and a method are provided for reducing the effects of spurious frequencies in a wireless communications device. The system comprises a processor having a reference frequency input and a clock having an output connected to the processor input. The clock supplies a clock frequency, or reference frequency, to the processor. The reference frequency is the frequency at which the processor operates. The clock also has an input for selecting a reference frequency to provide to the processor. The system also includes a transceiver having a plurality of selectable communications passbands. If the wireless communications device is a telephone, for example, the transceiver frequency (passband) may change as a function of the mode in which the phone is operating (AMPS, PCS, GSM, CDMA, or W-CDMA). In response to changing operating modes (transceiver passband), the clock frequency is adjusted. The clock frequency is selected so that harmonic frequencies associated with the clock frequency do not substantially interfere with the transceiver passband.
-
-
-
-
-
-
-
-
-
搜索结果
20 条记录 (耗时 0.02 秒)
