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公开(公告)号：US09796052B2
公开(公告)日：2017-10-24
申请号：US14389668
申请日：2012-03-30
申请人： Teruo Komatsu , Ryo Matsubayashi
发明人： Teruo Komatsu , Ryo Matsubayashi
IPC分类号： B23K35/00 , B23K35/22 , B23K35/02 , H01B1/22 , B22F1/00 , H01B1/02 , H05K1/09 , B23K1/20 , B23K35/30 , B23K35/36 , B22F7/06
CPC分类号： B23K35/025 , B22F1/0018 , B22F1/0062 , B22F7/064 , B23K1/20 , B23K35/302 , B23K35/3612 , H01B1/026 , H01B1/22 , H05K1/092 , H05K2201/0224 , H05K2201/0257 , H05K2201/0272
摘要： The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.
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公开(公告)号：US20150053753A1
公开(公告)日：2015-02-26
申请号：US14389668
申请日：2012-03-30
申请人： Teruo Komatsu , Ryo Matsubayashi
发明人： Teruo Komatsu , Ryo Matsubayashi
CPC分类号： B23K35/025 , B22F1/0018 , B22F1/0062 , B22F7/064 , B23K1/20 , B23K35/302 , B23K35/3612 , H01B1/026 , H01B1/22 , H05K1/092 , H05K2201/0224 , H05K2201/0257 , H05K2201/0272
摘要： The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.
摘要翻译： 本发明解决了提供价格相对低廉并且在结合特性，导热性和电性能方面优异的复合纳米金属糊的问题。 本发明是一种含有铜填料的复合纳米金属浆料，其含有复合纳米金属颗粒，每个复合纳米金属颗粒均包含金属芯和形成在其上的有机涂层。 金属糊包含铜填料，在有机涂层的热分解温度中含有与第一复合纳米金属颗粒不同的第一复合纳米金属颗粒和第二复合纳米金属颗粒作为粘合剂，其中有机涂层的质量比例W1 第一复合纳米金属颗粒中的层在2-13质量％的范围内，第二复合纳米金属颗粒中的有机涂层的质量比例W2在5〜25质量％的范围内，并且这些颗粒满足关系 W1。
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3.发明授权Composite nanometal paste of two-metallic-component type, bonding method, and electronic part 有权复合纳米金属糊状二金属成分型，接合法和电子元件公开(公告)号：US08491998B2
公开(公告)日：2013-07-23
申请号：US13383814
申请日：2009-07-16
申请人： Teruo Komatsu , Ryo Matsubayashi
发明人： Teruo Komatsu , Ryo Matsubayashi
IPC分类号： B32B5/16
CPC分类号： B22F1/0062 , B22F1/0018 , B82Y30/00 , C22C5/06 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2224/8384 , H01L2224/8385 , H01L2224/8485 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/12044 , H01L2924/181 , Y10T428/12896 , Y10T428/25 , Y10T428/256 , Y10T428/2991 , Y10T428/2993 , Y10T428/2995 , Y10T428/2996 , Y10T428/2998 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to conventional lead-rich solders. The composite nanometal paste contains, as metal components, composite metal nanoparticles comprising metal cores with an average particle diameter of d (nm) and an organic coating layer formed around the circumference, and metal filler particles having an average particle diameter of D (nm), and satisfies the first relation d
摘要翻译： 提供了一种复合纳米金属浆料，其在无负载下在惰性气体中烧结时，赋予与常规富铅焊料相同或优异的导电性和导热性的金属层。 复合纳米金属浆料作为金属成分含有平均粒径为d（nm）的金属芯和围绕圆周形成的有机被覆层的复合金属纳米粒子，平均粒径为D（nm）的金属填料粒子， ，并且满足第一关系d
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4.发明申请公开(公告)号：US20120114972A1
公开(公告)日：2012-05-10
申请号：US13383814
申请日：2009-07-16
申请人： Teruo Komatsu , Ryo Matsubayashi
发明人： Teruo Komatsu , Ryo Matsubayashi
CPC分类号： B22F1/0062 , B22F1/0018 , B82Y30/00 , C22C5/06 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2224/8384 , H01L2224/8385 , H01L2224/8485 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/12044 , H01L2924/181 , Y10T428/12896 , Y10T428/25 , Y10T428/256 , Y10T428/2991 , Y10T428/2993 , Y10T428/2995 , Y10T428/2996 , Y10T428/2998 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to conventional lead-rich solders. The composite nanometal paste contains, as metal components, composite metal nanoparticles comprising metal cores with an average particle diameter of d (nm) and an organic coating layer formed around the circumference, and metal filler particles having an average particle diameter of D (nm), and satisfies the first relation d
摘要翻译： 提供了一种复合纳米金属浆料，其在无负载下在惰性气体中烧结时，赋予与常规富铅焊料相同或优异的导电性和导热性的金属层。 复合纳米金属浆料作为金属成分含有平均粒径为d（nm）的金属芯和围绕圆周形成的有机被覆层的复合金属纳米粒子，平均粒径为D（nm）的金属填料粒子， ，并且满足第一关系d
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