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公开(公告)号：US20080168652A1
公开(公告)日：2008-07-17
申请号：US12007040
申请日：2008-01-04
CPC分类号： H05K3/4614 , H05K3/462 , H05K3/4647 , H05K2203/061 , H05K2203/0733 , H05K2203/1327 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
摘要： First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
摘要翻译： 首先，制造单层布线板，其具有在绝缘基材的两侧形成为所需形状的布线层; 以及在所述绝缘基体的一侧上的所述布线层上形成的金属凸块。 然后，准备并堆叠所需数量的单层板。 在这种情况下，准备设置在最上层的板，而不具有金属凸块。 这些板被定位和堆叠，使得相邻板中的一个的金属凸块连接到另一个板的对应的布线层。 此后，将树脂填充到堆叠板之间的间隙中，并且在通过上述步骤获得的多层板的两侧上形成绝缘层，以覆盖除了在布线上的预定位置限定的焊盘区域之外的整个表面 层。
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公开(公告)号：US08096049B2
公开(公告)日：2012-01-17
申请号：US12929090
申请日：2010-12-30
IPC分类号： H01K3/00
CPC分类号： H05K3/4614 , H05K3/462 , H05K3/4647 , H05K2203/061 , H05K2203/0733 , H05K2203/1327 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
摘要： First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
摘要翻译： 首先，制造单层布线板，其具有在绝缘基材的两侧形成为所需形状的布线层; 以及在所述绝缘基体的一侧上的所述布线层上形成的金属凸块。 然后，准备并堆叠所需数量的单层板。 在这种情况下，准备设置在最上层的板，而不具有金属凸块。 这些板被定位和堆叠，使得相邻板中的一个的金属凸块连接到另一个板的对应的布线层。 此后，将树脂填充到堆叠板之间的间隙中，并且在通过上述步骤获得的多层板的两侧上形成绝缘层，以覆盖除了在布线上的预定位置限定的焊盘区域之外的整个表面 层。
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公开(公告)号：US07882627B2
公开(公告)日：2011-02-08
申请号：US12007040
申请日：2008-01-04
IPC分类号： H01K3/00
CPC分类号： H05K3/4614 , H05K3/462 , H05K3/4647 , H05K2203/061 , H05K2203/0733 , H05K2203/1327 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
摘要： First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
摘要翻译： 首先，制造单层布线板，其具有在绝缘基材的两侧形成为所需形状的布线层; 以及在所述绝缘基体的一侧上的所述布线层上形成的金属凸块。 然后，准备并堆叠所需数量的单层板。 在这种情况下，准备设置在最上层的板，而不具有金属凸块。 这些板被定位和堆叠，使得相邻板中的一个的金属凸块连接到另一个板的对应的布线层。 此后，将树脂填充到堆叠板之间的间隙中，并且在通过上述步骤获得的多层板的两侧上形成绝缘层，以覆盖除了布线上的预定位置限定的焊盘区域之外的整个表面 层。
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公开(公告)号：US20110099806A1
公开(公告)日：2011-05-05
申请号：US12929090
申请日：2010-12-30
IPC分类号： H05K3/36
CPC分类号： H05K3/4614 , H05K3/462 , H05K3/4647 , H05K2203/061 , H05K2203/0733 , H05K2203/1327 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
摘要： First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
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公开(公告)号：US07955454B2
公开(公告)日：2011-06-07
申请号：US11516737
申请日：2006-09-07
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/108 , H05K3/381 , H05K2203/0554 , H05K2203/1152 , Y10T156/10 , Y10T156/1057 , Y10T156/1082
摘要： The method for forming wiring includes: laminating a thermosetting resin film and a metallic foil on an insulating substrate where base-layer wiring is formed, a mat surface of the metallic foil facing the resin film, pressing the film and the foil with application of heat; forming an opening in the metallic foil to expose a part of the insulating resin layer in which a via hole is to be formed; forming the via hole in the insulating resin layer by using as a mask the metallic foil; performing a desmear process of the via hole via the opening of the metallic foil; removing the metallic foil; forming an electroless-plated layer that covers the top surface of the insulating resin layer, a side surface of the via hole and a top surface of the base-layer wiring; and forming wiring including an electroplated layer on the electroless-plated layer.
摘要翻译： 形成布线的方法包括：在形成基底布线的绝缘基板上层叠热固性树脂膜和金属箔，金属箔的面向树脂膜的垫表面，施加热量来压制膜和箔 ; 在所述金属箔中形成开口以暴露要形成通孔的绝缘树脂层的一部分; 通过使用金属箔作为掩模在绝缘树脂层中形成通孔; 经由金属箔的开口进行通孔的去污处理; 去除金属箔; 形成覆盖绝缘树脂层的顶面，通孔的侧面和基底布线的顶面的无电镀层; 以及在所述化学镀层上形成包括电镀层的布线。
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公开(公告)号：US20070051459A1
公开(公告)日：2007-03-08
申请号：US11516737
申请日：2006-09-07
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/108 , H05K3/381 , H05K2203/0554 , H05K2203/1152 , Y10T156/10 , Y10T156/1057 , Y10T156/1082
摘要： The method for forming wiring includes: laminating a thermosetting resin film in a semi-cured state and a metallic foil in this order on an insulating substrate where base-layer wiring is formed, a mat surface of the metallic foil facing the resin film, pressing the film and the foil with application of heat; forming an opening in the metallic foil so as to expose a part of the insulating resin layer in which a via hole is to be formed; forming the via hole in the insulating resin layer by irradiating high-energy beams on to insulating resin layer by using as a mask the metallic foil in which the opening is formed; performing a desmear process of the via hole via the opening of the metallic foil; removing the metallic foil by etching; forming an electroless-plated layer that continuously covers the top surface of the insulating resin layer, a side surface of the via hole and a top surface of the base-layer wiring corresponding to the bottom of the via hole; and forming wiring including an electroplated layer on the electroless-plated layer by a semi-additive process.
摘要翻译： 形成布线的方法包括：在形成基底布线的绝缘基板上依次层叠半固化状态的热固性树脂膜和金属箔，金属箔的面向树脂膜的垫表面，压制 薄膜和箔片应用热量; 在金属箔中形成开口以露出要形成通孔的绝缘树脂层的一部分; 通过使用形成开口的金属箔作为掩模，将高能束照射到绝缘树脂层上，从而在绝缘树脂层中形成通孔; 经由金属箔的开口进行通孔的去污处理; 通过蚀刻去除金属箔; 形成连续地覆盖绝缘树脂层的顶面，通路孔的侧面和与通孔的底部对应的基底布线的顶面的无电解镀层; 以及通过半添加工艺在所述化学镀层上形成包括电镀层的布线。
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公开(公告)号：US09839924B2
公开(公告)日：2017-12-12
申请号：US14898305
申请日：2014-07-16
CPC分类号： B05B7/0018 , A47K5/14 , B05B7/0037 , B05B7/0416 , B05B11/0064 , B05B11/0075 , B05B11/02 , B05B11/3059 , B05B11/3087
摘要： In a foamer dispenser, a depressing head includes: a head main unit with a top wall portion arranged above the stem and with an attachment cylindrical portion that extends downwardly from the top wall portion and is attached to the stem; and an exterior cylindrical portion that is provided beneath the top wall portion and surrounds the attachment cylindrical portion and the guide cylindrical portion from an outer side in a radial direction. An inside of the exterior cylindrical portion is communicable with an inside of the cylinder for air through an inside of the guide cylindrical portion. The head main unit and the exterior cylindrical portion are formed as separate entities and are fitted to each other. In an upper end portion of the exterior cylindrical portion, intake holes are formed that penetrate through the exterior cylindrical portion in a radial direction and open toward an upward direction.
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公开(公告)号：US09226668B2
公开(公告)日：2016-01-05
申请号：US12741320
申请日：2008-11-05
CPC分类号： A61B5/02233 , A61B2560/0261
摘要： A blood pressure monitor includes a cuff to be wound around a living body of a subject, a measuring unit for measuring blood pressure with said cuff wound around the living body of said subject, a detecting unit for detecting an inclination angle of said cuff, a specifying unit for specifying a current inclination level among a plurality of predetermined inclination levels upon measurement by said measuring unit, based on a result of detection by said detecting unit, a memory for storing therein the inclination level specified by said specifying unit, in association with blood pressure data measured by said measuring unit, and a notifying unit for providing notification of at least one past inclination level of the plurality of inclination levels stored in said memory and said current inclination level, in association with each other.
摘要翻译： 血压监视器包括被卷绕在被检体的生物体上的袖带，用于测量血压的测量单元，所述袖带缠绕在所述被检体的生物体上，检测单元，用于检测所述袖带的倾斜角， 指定单元，用于基于所述检测单元的检测结果，在由所述测量单元测量的多个预定倾斜度中指定当前倾斜度;存储器，用于在其中存储由所述指定单元指定的倾斜度，与 由所述测量单元测量的血压数据，以及通知单元，用于相互关联地提供存储在所述存储器中的多个倾斜度和所述当前倾斜度的至少一个过去倾斜度的通知。
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公开(公告)号：US08854797B2
公开(公告)日：2014-10-07
申请号：US13410530
申请日：2012-03-02
申请人： Tomohiro Ikeda , Hiroyuki Kato
发明人： Tomohiro Ikeda , Hiroyuki Kato
IPC分类号： H02B1/04 , H01H9/08 , H01M2/34 , H01M2/20 , H01M2/10 , H01H3/04 , H01R13/62 , H01M6/42 , H01H21/30
摘要： A power source circuit shut off apparatus shuts off a circuit of a battery assembly in which plural battery cells connected in series are arranged in parallel. The power source circuit shut off apparatus includes a housing, a pair of bus bars that is arranged in the housing and is connected to the adjacent battery cells respectively, a switch section that is adapted to conduct electrical connection or disconnection between the pair of bus bars, and a retaining member which is formed on the housing and is configured to be retained to a resin frame part of a side surface of the battery cell.
摘要翻译： 电源电路切断装置切断串联连接的多个电池单元并联配置的电池组件的电路。 电源电路切断装置包括壳体，一对母线，其布置在壳体中并分别连接到相邻的电池单元;开关部分，适于在一对母线之间进行电连接或断开 以及保持构件，其形成在壳体上并被构造成保持在电池单元的侧表面的树脂框架部分。
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公开(公告)号：US08834765B2
公开(公告)日：2014-09-16
申请号：US13636101
申请日：2011-03-17
申请人： Junichi Esaki , Hiroyuki Kato , Yasuhiro Matsumoto
发明人： Junichi Esaki , Hiroyuki Kato , Yasuhiro Matsumoto
IPC分类号： B29C45/14
CPC分类号： H01F41/0246 , H01F27/255 , H01F27/323 , H01F41/122 , H01F2017/048 , Y10T29/49073
摘要： [Problem] To provide a method of manufacture for an encased coil body, which is capable of easily manufacturing an encased coil body which is configured so as to be encased in a state where a coil is enclosed within an electrically insulating resin and is also capable of favorably preventing the coil from positional misalignment or deformation at the time of the manufacture.[Means for Solution] The method includes injection-molding a resin covering layer which encases the coil 10 with a thermoplastic resin, in which the injection-molding is carried out such that the injection-molding step is divided into a primary molding step and a secondary molding step, in which the primary molding step includes contacting a primary molding die to an inner circumferential surface of the coil 10 and molding a primary molded body 22-1 which includes an outer circumferential covering portion 46 in a state where the coil 10 is constrained so as to be positioned in a radial direction, and the secondary molding step includes, after the primary molding step, setting the primary molded body 22-1 along with the coil 10 to a secondary molding die and molding a secondary molded body which includes an inner circumferential covering portion.
摘要翻译： 本发明提供一种封装线圈体的制造方法，其能够容易地制造被包围的线圈体，该线圈体被构造成在线圈封闭在电绝缘树脂内的状态下被包围，并且还能够 有利地防止线圈在制造时的位置不对准或变形。 [解决方案]该方法包括用热塑性树脂注射包封线圈10的树脂覆盖层，其中进行注射成型，使得注射成型步骤被分成初级模塑步骤和 二次模塑步骤，其中初级模塑步骤包括使初级模具模具与线圈10的内圆周表面接触，并且在线圈10是状态下模制包括外圆周覆盖部分46的一次模制体22-1 被限制为沿径向定位，并且二次成型步骤在初次模制步骤之后包括将一次成型体22-1与线圈10一起设置到二次模制模具并且模制二次模制体，该二次模制体包括 内圆周覆盖部分。
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