-
公开(公告)号：US20050013554A1
公开(公告)日：2005-01-20
申请号：US10850363
申请日：2004-05-19
CPC分类号： G02B6/4202 , G02B6/4201 , G02B6/4214 , G02B6/4243 , G02B6/4253 , G02B6/4255 , G02B6/4261 , G02B6/428 , G02B6/4292
摘要： Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.
摘要翻译： 具有表面安装的光电子部件和设置有电线的电路板的光电传输和/或接收装置，光电子部件被表面安装在所述电路板上，光电子部件的光轴垂直于电路的平面运行 板。 在一个实施例中，提供了用于接收和定向要耦合到光电子部件的光波导的保持装置，该保持装置直接邻近远离电路板的光电子部件的侧面。 在另一个实施例中，电路板具有切口，并且光在电路板的切口的方向上耦合到光电子部件中或从光电部件流出。
-
公开(公告)号：US07223023B2
公开(公告)日：2007-05-29
申请号：US10850363
申请日：2004-05-19
IPC分类号： G02B6/36
CPC分类号： G02B6/4202 , G02B6/4201 , G02B6/4214 , G02B6/4243 , G02B6/4253 , G02B6/4255 , G02B6/4261 , G02B6/428 , G02B6/4292
摘要： Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.
摘要翻译： 具有表面安装的光电子部件和设置有电线的电路板的光电传输和/或接收装置，光电子部件被表面安装在所述电路板上，光电子部件的光轴垂直于电路的平面运行 板。 在一个实施例中，提供了用于接收和定向要耦合到光电子部件的光波导的保持装置，该保持装置直接邻近远离电路板的光电子部件的侧面。 在另一个实施例中，电路板具有切口，并且光在电路板的切口的方向上耦合到光电子部件中或从光电部件流出。
-
公开(公告)号：US07270488B2
公开(公告)日：2007-09-18
申请号：US10832197
申请日：2004-04-26
IPC分类号： G02B6/36
CPC分类号： G02B6/4206 , G02B6/421 , G02B6/4292
摘要： The invention relates to an optoelectronic transmission and/or reception arrangement. The arrangement includes a transmission and/or reception module containing an optoelectronic transmission and/or reception component, and a plug interface for the coupling of an optical fiber thereto. An optical waveguide section is arranged in the plug interface, and at one of its ends is optically coupled to the transmission and/or reception component. At its other end, the optical waveguide section is configured to be coupled to an optical fiber. The arrangement may further include a lens for optical coupling of the light between the optical waveguide section and the transmission and/or reception component. The lens and the optical waveguide section, in one example, are formed as a prefabricated subassembly, in which the lens is fixedly arranged at a defined distance from one end face of the optical waveguide section.
摘要翻译： 本发明涉及光电传输和/或接收装置。 该装置包括包含光电传输和/或接收部件的传输和/或接收模块以及用于将光纤耦合到其上的插头接口。 光波导部分布置在插头接口中，并且其一端的光耦合到传输和/或接收部件。 在另一端，光波导部分被配置为耦合到光纤。 该装置还可以包括用于在光波导部分和发射和/或接收部件之间光耦合光的透镜。 在一个示例中，透镜和光波导部分形成为预制子组件，其中透镜固定地布置在距离光波导部分的一个端面的限定距离处。
-
公开(公告)号：US20050242447A1
公开(公告)日：2005-11-03
申请号：US11044743
申请日：2005-01-26
申请人： Thomas Killer , Hans-Ludwig Althaus , Melanie Ring
发明人： Thomas Killer , Hans-Ludwig Althaus , Melanie Ring
CPC分类号： H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/83051 , H01L2924/01033 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01S5/0226 , H01S5/02268 , H01L2924/00
摘要： A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.
摘要翻译： 支撑元件和包括支撑元件的半导体元件，其中支撑元件具有至少一个表面，其具有用于接收半导体器件的子区域和至少一个流体密封边界，其布置在表面上并且至少部分地围绕 表面的次区域。 还公开了一种用于在支撑元件的表面上布置半导体器件的方法，其步骤包括：提供支撑元件，该支撑元件具有至少一个具有用于接收半导体器件的子区域的表面和至少一个流体密封边界， 布置在表面上并且至少部分地围绕表面的次级区域，将粘合剂流体引入流体密封边界内，并将半导体器件引入粘合剂流体中。
-
5.发明授权公开(公告)号：US07138661B2
公开(公告)日：2006-11-21
申请号：US10938067
申请日：2004-09-10
IPC分类号： H01L27/15
CPC分类号： H01L31/0203 , G02B6/4201 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.
摘要翻译： 具有光电子换能器装置的光电子部件和电连接到安装在对于特定波长是光学透明的载体基板上的换能器装置的电路。 换能器装置布置在载体基板的前侧，并且通过背面进行光耦合。 电路形成为集成到载体基板中的电路，或者使用混合技术形成在载体基板上，电路的端子触点布置在载体基板的正面上。 具有光电子部件的光电子装置包括至少部分平面形成的安装元件，其通过其一侧连接到部件的外侧，或者集成在其中并且至少延伸至 并且包括用于部件的机械连接的机械接口。
-
6.发明申请公开(公告)号：US20050056851A1
公开(公告)日：2005-03-17
申请号：US10938067
申请日：2004-09-10
IPC分类号： G02B6/42 , H01L23/12 , H01L23/28 , H01L23/50 , H01L29/16 , H01L29/267 , H01L31/0203 , H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , G02B6/4201 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.
摘要翻译： 具有光电子换能器装置的光电子部件和电连接到安装在对于特定波长是光学透明的载体基板上的换能器装置的电路。 换能器装置布置在载体基板的前侧，并且通过背面进行光耦合。 电路形成为集成到载体基板中的电路，或者使用混合技术形成在载体基板上，电路的端子触点布置在载体基板的正面上。 具有光电子部件的光电子装置包括至少部分平面形成的安装元件，其通过其一侧连接到部件的外侧，或者集成在其中并且至少延伸至 并且包括用于部件的机械连接的机械接口。
-
公开(公告)号：US07501585B2
公开(公告)日：2009-03-10
申请号：US11044743
申请日：2005-01-26
申请人： Thomas Killer , Hans-Ludwig Althaus , Melanie Ring
发明人： Thomas Killer , Hans-Ludwig Althaus , Melanie Ring
IPC分类号： H05K1/16
CPC分类号： H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73204 , H01L2224/83051 , H01L2924/01033 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01S5/0226 , H01S5/02268 , H01L2924/00
摘要： A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.
摘要翻译： 支撑元件和包括支撑元件的半导体元件，其中支撑元件具有至少一个表面，其具有用于接收半导体器件的子区域和至少一个流体密封边界，其布置在表面上并且至少部分地围绕 表面的次区域。 还公开了一种用于在支撑元件的表面上布置半导体器件的方法，其步骤包括：提供支撑元件，该支撑元件具有至少一个具有用于接收半导体器件的子区域的表面和至少一个流体密封边界， 布置在表面上并且至少部分地围绕表面的次级区域，将粘合剂流体引入流体密封边界内，并将半导体器件引入粘合剂流体中。
-
公开(公告)号：US07226216B2
公开(公告)日：2007-06-05
申请号：US10836605
申请日：2004-04-29
申请人： Hans Hurt , Thomas Killer , Josef Wittl
发明人： Hans Hurt , Thomas Killer , Josef Wittl
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4204 , G02B6/428 , G02B6/4292 , H01L2224/48137 , H01L2224/49171 , H01L2924/3025 , H01L2924/00
摘要： An optoelectronic transmission and/or reception arrangement with an optical unit having a transmission component and/or a reception component, an electrical circuitry component for the transmission component and/or the reception component, a circuit carrier, on which the components are mounted and contact-connected, and a coupling part for receiving and coupling at least one optical fiber which can be optically coupled to the transmission component and/or the reception component. The electrical contact-connection of the circuit carrier is effected via the coupling part.
摘要翻译： 具有光学单元的光电传输和/或接收装置具有传输部件和/或接收部件，用于传输部件和/或接收部件的电路部件，其上安装有组件并接触的电路载体 以及用于接收和耦合至少一个光纤的耦合部件，所述至少一个光纤可光耦合到传输部件和/或接收部件。 电路载体的电接触连接通过耦合部分实现。
-
9.发明申请公开(公告)号：US20070200748A1
公开(公告)日：2007-08-30
申请号：US11675342
申请日：2007-02-15
申请人： Juergen Hoegerl , Thomas Killer
发明人： Juergen Hoegerl , Thomas Killer
IPC分类号： G01S13/00
CPC分类号： H01Q21/0025 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2223/6677 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48463 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/07802 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01Q21/0087 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device for an ultra-wideband standard for ultra-high-frequency communication includes an ultra-wideband semiconductor chip and a multilayer circuit substrate with at least one lower metal layer and one upper metal layer, in which an ultra-wideband circuit with passive devices is arranged. The lower metal layer has external contact pads on which external contacts are arranged, via which the semiconductor device can be surface-mounted on a circuit board. In addition, the semiconductor device has an antenna which is operatively coupled to the ultra-wideband semiconductor chip via the circuit on the circuit substrate and is arranged above the semiconductor chip and the circuit substrate.
摘要翻译： 用于超高频通信的超宽带标准的半导体器件包括超宽带半导体芯片和具有至少一个下金属层和一个上金属层的多层电路基板，其中具有被动的超宽带电路 设备被安排。 下金属层具有外部接触焊盘，外部接触件布置在其上，半导体器件可以通过该接触垫表面安装在电路板上。 此外，半导体器件具有经由电路基板上的电路可操作地耦合到超宽带半导体芯片的天线，并且布置在半导体芯片和电路基板的上方。
-
10.发明授权Semiconductor component with surface mountable devices and method for producing the same 有权具有表面贴装装置的半导体元件及其制造方法公开(公告)号：US08071433B2
公开(公告)日：2011-12-06
申请号：US12868422
申请日：2010-08-25
申请人： Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
发明人： Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
IPC分类号： H01L21/00 , H01L21/337
CPC分类号： H01L25/165 , H01L21/563 , H01L23/293 , H01L2224/73203 , H05K1/181 , H05K3/305 , H05K2201/10045 , H05K2201/10977 , Y02P70/613
摘要： A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.
摘要翻译： 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.021 秒)