公开(公告)号：US08298929B2

公开(公告)日：2012-10-30

申请号：US12960110

申请日：2010-12-03

申请人： Timothy H. Daubenspeck ,  Gary Lafontant ,  Ekta Misra ,  David L. Questad ,  George J. Scott ,  Krystyna W. Semkow ,  Timothy D. Sullivan ,  Thomas A. Wassick ,  Steven L. Wright

发明人： Timothy H. Daubenspeck ,  Gary Lafontant ,  Ekta Misra ,  David L. Questad ,  George J. Scott ,  Krystyna W. Semkow ,  Timothy D. Sullivan ,  Thomas A. Wassick ,  Steven L. Wright

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： G06F17/5068 ,  G06F2217/12 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13006 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  Y02P90/265 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/014

摘要： Semiconductor structures, methods of manufacture and design structures are provided. The structure includes at least one offset crescent shaped solder via formed in contact with an underlying metal pad of a chip. The at least one offset crescent shaped via is offset with respect to at least one of the underlying metal pad and an underlying metal layer in direct electrical contact with an interconnect of the chip which is in electrical contact with the underlying metal layer.

摘要翻译： 提供半导体结构，制造方法和设计结构。 该结构包括与芯片的下面的金属焊盘接触形成的至少一个偏移月牙形焊料通孔。 至少一个偏移月牙形通孔相对于下面的金属焊盘和下面的金属层中的至少一个与芯片的与下面的金属层电接触的互连直接电接触而偏移。

公开(公告)号：US20120139123A1

公开(公告)日：2012-06-07

申请号：US12960110

申请日：2010-12-03

申请人： Timothy H. Daubenspeck ,  Gary Lafontant ,  Ekta Misra ,  David L. Questad ,  George J. Scott ,  Krystyna W. Semkow ,  Timothy D. Sullivan ,  Thomas A. Wassick ,  Steven L. Wright

发明人： Timothy H. Daubenspeck ,  Gary Lafontant ,  Ekta Misra ,  David L. Questad ,  George J. Scott ,  Krystyna W. Semkow ,  Timothy D. Sullivan ,  Thomas A. Wassick ,  Steven L. Wright

IPC分类号： H01L23/52 ,  G06F17/50 ,  H01L21/44

CPC分类号： G06F17/5068 ,  G06F2217/12 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13006 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  Y02P90/265 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/014

摘要： Semiconductor structures, methods of manufacture and design structures are provided. The structure includes at least one offset crescent shaped solder via formed in contact with an underlying metal pad of a chip. The at least one offset crescent shaped via is offset with respect to at least one of the underlying metal pad and an underlying metal layer in direct electrical contact with an interconnect of the chip which is in electrical contact with the underlying metal layer.

摘要翻译： 提供半导体结构，制造方法和设计结构。 该结构包括与芯片的下面的金属焊盘接触形成的至少一个偏移月牙形焊料通孔。 至少一个偏移月牙形通孔相对于下面的金属焊盘和下面的金属层中的至少一个与芯片的与下面的金属层电接触的互连直接电接触而偏移。

公开(公告)号：US20110206379A1

公开(公告)日：2011-08-25

申请号：US12712939

申请日：2010-02-25

申请人： Russell A. Budd ,  Warren D. Dyckman ,  Gary Lafontant ,  Frank R. Libsch

发明人： Russell A. Budd ,  Warren D. Dyckman ,  Gary Lafontant ,  Frank R. Libsch

IPC分类号： H04B10/00 ,  H01L27/14 ,  G06F17/50 ,  H05K1/18

CPC分类号： H04B10/801 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4279 ,  G02B6/428 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10121

摘要： An apparatus and method for receiving electrical signals and transmitting optical signals includes a substrate having an electrical circuit. An electrical-to-optical module is mounted on the substrate, and the module includes an array of photodetectors communicating with the electrical circuit. The photodetectors may include VCSEL arrays or PD arrays. The module receives electrical signals from the electrical circuit and provides a plurality of corresponding light signals. An electrical transport is embedded in the substrate, and the electrical transport electrically communicates with the array of photodetectors. An optical interface provides electrical communication between an optical fiber and the electrical circuit. A heat transfer device may be positioned adjacent the photodetectors to transfer heat generated by the photodetectors.

摘要翻译： 用于接收电信号和传输光信号的装置和方法包括具有电路的基板。 电光模块安装在基板上，并且模块包括与电路通信的光电检测器阵列。 光电检测器可以包括VCSEL阵列或PD阵列。 该模块从电路接收电信号并提供多个对应的光信号。 电输送器嵌入在基板中，并且电输送与光电检测器阵列电连通。 光接口提供光纤和电路之间的电通信。 传热装置可以位于光电检测器附近以传递由光电检测器产生的热量。