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    Enhanced electromigration resistance in TSV structure and design
    6.
    发明授权
    Enhanced electromigration resistance in TSV structure and design 有权
    TSV结构和设计中增强的电迁移阻力

    公开(公告)号：US08288270B2

    公开(公告)日：2012-10-16

    申请号：US13397004

    申请日：2012-02-15

    申请人： Mukta G Farooq ,  John A Griesemer ,  Gary LaFontant ,  William Francis Landers ,  Timothy Dooling Sullivan

    发明人： Mukta G Farooq ,  John A Griesemer ,  Gary LaFontant ,  William Francis Landers ,  Timothy Dooling Sullivan

    IPC分类号： H01L21/4763

    CPC分类号： H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The embodiments provide a method for reducing electromigration in a circuit containing a through-silicon via (TSV) and the resulting novel structure for the TSV. A TSV is formed through a semiconductor substrate. A first end of the TSV connects to a first metallization layer on a device side of the semiconductor substrate. A second end of the TSV connects to a second metallization layer on a grind side of the semiconductor substrate. A first flat edge is created on the first end of the TSV at the intersection of the first end of the TSV and the first metallization layer. A second flat edge is created on the second end of the TSV at the intersection of the second end of the TSV and the second metallization layer. On top of the first end a metal contact grid is placed, having less than eighty percent metal coverage.

    摘要翻译： 这些实施例提供了一种用于减少包含硅通孔（TSV）的电路中的电迁移的方法以及用于TSV的所得新颖结构。 通过半导体衬底形成TSV。 TSV的第一端连接到半导体衬底的器件侧上的第一金属化层。 TSV的第二端连接到半导体衬底的研磨侧的第二金属化层。 在TSV的第一端和第一金属化层的交叉点的TSV的第一端上形成第一平坦边缘。 在TSV的第二端和第二金属化层的交叉点的TSV的第二端上形成第二平坦边缘。 在第一端的顶部放置金属接触网格，金属覆盖率低于百分之八十。

    OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRICAL SIGNAL INTEGRITY
    9.
    发明申请
    OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRICAL SIGNAL INTEGRITY 审中-公开
    具有改进的低功率，高速电气信号完整性的OPTO-ELECTRONIC模块

    公开(公告)号：US20110206379A1

    公开(公告)日：2011-08-25

    申请号：US12712939

    申请日：2010-02-25

    申请人： Russell A. Budd ,  Warren D. Dyckman ,  Gary Lafontant ,  Frank R. Libsch

    发明人： Russell A. Budd ,  Warren D. Dyckman ,  Gary Lafontant ,  Frank R. Libsch

    IPC分类号： H04B10/00 ,  H01L27/14 ,  G06F17/50 ,  H05K1/18

    CPC分类号： H04B10/801 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4279 ,  G02B6/428 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10121

    摘要： An apparatus and method for receiving electrical signals and transmitting optical signals includes a substrate having an electrical circuit. An electrical-to-optical module is mounted on the substrate, and the module includes an array of photodetectors communicating with the electrical circuit. The photodetectors may include VCSEL arrays or PD arrays. The module receives electrical signals from the electrical circuit and provides a plurality of corresponding light signals. An electrical transport is embedded in the substrate, and the electrical transport electrically communicates with the array of photodetectors. An optical interface provides electrical communication between an optical fiber and the electrical circuit. A heat transfer device may be positioned adjacent the photodetectors to transfer heat generated by the photodetectors.

    摘要翻译： 用于接收电信号和传输光信号的装置和方法包括具有电路的基板。 电光模块安装在基板上，并且模块包括与电路通信的光电检测器阵列。 光电检测器可以包括VCSEL阵列或PD阵列。 该模块从电路接收电信号并提供多个对应的光信号。 电输送器嵌入在基板中，并且电输送与光电检测器阵列电连通。 光接口提供光纤和电路之间的电通信。 传热装置可以位于光电检测器附近以传递由光电检测器产生的热量。