公开(公告)号：US06552694B1

公开(公告)日：2003-04-22

申请号：US09609974

申请日：2000-07-06

申请人： Tomoharu Fujii ,  Shigeru Okamura ,  Tsutomu Higuchi ,  Masatoshi Akagawa

发明人： Tomoharu Fujii ,  Shigeru Okamura ,  Tsutomu Higuchi ,  Masatoshi Akagawa

IPC分类号： H01Q1112

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01L2924/0002 ,  H01Q1/22 ,  H01Q7/00 ,  H01L2924/00

摘要： A semiconductor device with an antenna including one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to the antenna units, wherein the antenna units are formed by pressing or etching a thin metal sheet with substantially the same flat surface size as the semiconductor element, and the antenna units are integrally coupled to the surface of the semicondcutor element. The antenna units are formed in a plurality of layers separated by insulating layers, and the antenna units formed on the respective layers are connected electrically in series with each other.

摘要翻译： 一种具有天线的半导体器件，包括用于发送和接收信号的一个或多个天线单元和与天线单元电连接的半导体元件，其中天线单元通过压制或蚀刻具有基本相同的平坦表面尺寸的薄金属片而形成， 半导体元件和天线单元一体地耦合到半切割元件的表面。 天线单元形成为由绝缘层分隔开的多个层，并且形成在各层上的天线单元彼此串联连接。

公开(公告)号：US06380614B1

公开(公告)日：2002-04-30

申请号：US09602073

申请日：2000-06-23

申请人： Tsutomu Higuchi ,  Tomoharu Fujii ,  Shigeru Okamura ,  Tsuyoshi Sato ,  Takayoshi Wakabayashi ,  Masatoshi Akagawa

发明人： Tsutomu Higuchi ,  Tomoharu Fujii ,  Shigeru Okamura ,  Tsuyoshi Sato ,  Takayoshi Wakabayashi ,  Masatoshi Akagawa

IPC分类号： H01L2302

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81395 ,  H01L2924/00014

摘要： An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

摘要翻译： IC卡包括：具有相应端子部分的平面线圈; 半导体元件，其布置在与所述平面线圈不重叠的位置处，所述半导体元件具有电极端子; 用于将平面线圈的各个端子部分电连接到半导体元件的电极端子的装置; 以及加强框架，其设置在与半导体元件基本相同的面上，使得半导体元件被加强框架包围。

公开(公告)号：US06556175B2

公开(公告)日：2003-04-29

申请号：US09940570

申请日：2001-08-28

申请人： Shigeru Okamura ,  Tomoharu Fujii

发明人： Shigeru Okamura ,  Tomoharu Fujii

IPC分类号： H01Q136

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00

摘要： An antenna for a non-contact type IC card is provided. A plane coil is formed by punching or etching a thin metal plate in such a manner that a conductor line is wound several times on substantially the same surface. The plane coil has respective terminals at innermost and outermost ends. The innermost terminal is provided with accommodation hole, in which a semiconductor element having electrode terminals is arranged. A circuit film comprises an insulating resin film and a circuit pattern formed on the insulating resin film. The circuit pattern electrically connects the electrode terminals of the semiconductor element to the terminals of the plane coil, respectively. At least one projection is integrally formed with the conductor and extending therefrom inwardly or outwardly so as not to contact an adjacent loop of the conductor line. The projection is located at any desired position to be used as a suction pad, an alignment mark or a positioning guide when said plane coil is sucked or positioned.

摘要翻译： 提供了一种用于非接触型IC卡的天线。平面线圈是通过冲压或蚀刻薄金属板而形成的，使得导体线在基本上相同的表面上几次缠绕。 平面线圈在最内侧和最外端具有相应的端子。 最里面的端子设置有容纳孔，其中布置有具有电极端子的半导体元件。 电路膜包括绝缘树脂膜和形成在绝缘树脂膜上的电路图案。 电路图案分别将半导体元件的电极端子与平面线圈的端子电连接。 至少一个突起与导体一体地形成并且从内向内或向外延伸，以便不接触导体线的相邻环。 当所述平面线圈被吸入或定位时，突出部位于任何期望的位置，用作吸盘，对准标记或定位引导件。

公开(公告)号：US06591494B2

公开(公告)日：2003-07-15

申请号：US09940566

申请日：2001-08-28

申请人： Shigeru Okamura ,  Tomoharu Fujii

发明人： Shigeru Okamura ,  Tomoharu Fujii

IPC分类号： H05K330

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/07783 ,  H01L2924/0002 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/4913 ,  H01L2924/00

摘要： A non-contact type IC card includes a plane coil comprising a conductor line wound several times on substantially the same surface. The plane coil has respective terminals at the innermost and outermost ends. A semiconductor element has electrode terminals electrically connected to the terminals of the plane coil, respectively. A resin-filled portion is defined by a part of the circumference of the plane coil where spaces between adjacent loops of conductor line of the plane coil are filled with light-setting resin to maintain predetermined intervals between the adjacent conductors lines of the plane coil.

摘要翻译： 非接触型IC卡包括平面线圈，该平面线圈包括在基本上相同的表面上多次缠绕的导体线。 平面线圈在最内端和最外端具有相应的端子。 半导体元件具有分别与平面线圈的端子电连接的电极端子。 树脂填充部分由平面线圈的圆周的一部分限定，其中平面线圈的导线的相邻环之间的空间用光固化树脂填充，以保持平面线圈的相邻导体线之间的预定间隔。

公开(公告)号：US08405953B2

公开(公告)日：2013-03-26

申请号：US12191454

申请日：2008-08-14

申请人： Tomoharu Fujii ,  Masahiro Sunohara

发明人： Tomoharu Fujii ,  Masahiro Sunohara

IPC分类号： H01G4/002 ,  H01G4/005

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01G4/236 ,  Y10T29/435

摘要： A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other.

摘要翻译： 电容器嵌入式基板包括具有期望厚度的基体材料和一对导体（馈通电极），每个导体（馈通电极）以期望的图案形成，以在其厚度方向上穿透基底材料，并且相对设置有绝缘层 。 一对电极形成为梳形图案，并且以相应的梳齿部彼此啮合的方式相对地设置。

公开(公告)号：US07841076B2

公开(公告)日：2010-11-30

申请号：US11727547

申请日：2007-03-27

申请人： Tomoharu Fujii

发明人： Tomoharu Fujii

IPC分类号： H05K3/30

CPC分类号： H01Q9/0407 ,  H01L23/142 ,  H01L23/49822 ,  H01L2223/6677 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15321 ,  H01Q1/2283 ,  H01Q13/106 ,  H05K1/056 ,  H05K1/16 ,  H05K3/007 ,  H05K3/4644 ,  H05K2203/0152 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/4913 ,  H01L2224/05599

摘要： A multilayer wiring structural body 13 is formed on a surface 57A of a metal plate 57 used as a support plate in the case of forming the multilayer wiring structural body 13, and the metal plate 57 is patterned and a slot antenna 60 is formed.

摘要翻译： 在形成多层布线结构体13的情况下，在用作支撑板的金属板57的表面57A上形成多层布线结构体13，并且金属板57被图案化并形成缝隙天线60。

公开(公告)号：US07791446B2

公开(公告)日：2010-09-07

申请号：US12186317

申请日：2008-08-05

申请人： Tomoharu Fujii ,  Masahiro Sunohara ,  Manabu Nakamura

发明人： Tomoharu Fujii ,  Masahiro Sunohara ,  Manabu Nakamura

IPC分类号： H01F5/00

CPC分类号： H01F17/0006 ,  H01F27/323 ,  H01F41/041 ,  H01F41/122 ,  H01F2017/0046 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/645 ,  H01L28/10 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10T29/4902

摘要： An inductor device formed on a semiconductor substrate includes an inductor body penetrating the semiconductor substrate, taking a spiral shape and having a conductivity, and an insulating film provided between a side surface of the inductor body and the semiconductor substrate.

摘要翻译： 形成在半导体衬底上的电感器件包括穿过半导体衬底的电感体，呈螺旋形并具有导电性，以及设置在电感体侧面和半导体衬底之间的绝缘膜。

公开(公告)号：US07542006B2

公开(公告)日：2009-06-02

申请号：US11754767

申请日：2007-05-29

申请人： Tomoharu Fujii

发明人： Tomoharu Fujii

IPC分类号： H01Q23/00

CPC分类号： H01Q9/42 ,  H01L23/49805 ,  H01L23/5386 ,  H01L23/5388 ,  H01L2924/0002 ,  H01Q23/00 ,  H05K1/16 ,  H05K3/403 ,  H01L2924/00

摘要： An inverse F type antenna is provided and includes first wiring portions provided on an upper face of a board, second wiring portions provided on a lower face of the board, connecting portions electrically connecting the first wiring portions and the second wiring portions, in which the connecting portions are provided at a side face of the board.

摘要翻译： 设置逆F型天线，并且包括设置在基板的上表面上的第一布线部分，设置在基板的下表面上的第二布线部分，电连接第一布线部分和第二布线部分的连接部分，其中 连接部设置在板的侧面。

公开(公告)号：US20080259585A1

公开(公告)日：2008-10-23

申请号：US11847796

申请日：2007-08-30

申请人： Tomoharu Fujii

发明人： Tomoharu Fujii

IPC分类号： H05K7/06

CPC分类号： H05K9/0056 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/19105 ,  H05K9/0083

摘要： An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the antenna.

摘要翻译： 一种电子设备，包括基板，安装在基板上的电子部件，安装在基板上的天线，以及添加有介电常数调整材料的树脂材料，并密封电子部件和天线。

公开(公告)号：US20070279879A1

公开(公告)日：2007-12-06

申请号：US11754767

申请日：2007-05-29

申请人： Tomoharu Fujii

发明人： Tomoharu Fujii

IPC分类号： H05K7/00 ,  H01L23/02 ,  H01L23/48 ,  H01R9/00

CPC分类号： H01Q9/42 ,  H01L23/49805 ,  H01L23/5386 ,  H01L23/5388 ,  H01L2924/0002 ,  H01Q23/00 ,  H05K1/16 ,  H05K3/403 ,  H01L2924/00

摘要： An inverse F type antenna 29 including first wiring portions 41 to 45 provided at an upper face 15A of a board 15, second wiring portions 51 to 56 provided at a lower face 15B of the board 15, connecting portions 61 to 70 electrically connecting the first wiring portions 41 to 45 and the second wiring portions 51 to 56, in which the connecting portions 61 to 70 are provided at a side face 15-4 of the board 15.

摘要翻译： 设置在基板15的上表面15A的第一配线部分41至45的逆F型天线29，设置在电路板15的下表面15B处的第二配线部分51至56，电连接的连接部分61至70 第一配线部分41至45和第二配线部分51至56，其中连接部分61至70设置在板15的侧面15-4处。