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1.发明申请Resin composition, composition for solder resist, and cured article obtained therefrom 审中-公开树脂组合物，阻焊剂组合物和由其获得的固化物公开(公告)号：US20050004288A1
公开(公告)日：2005-01-06
申请号：US10485004
申请日：2002-08-06
申请人： Hiroo Koyanagi , Toru Ozaki , Minoru Yokoshima
发明人： Hiroo Koyanagi , Toru Ozaki , Minoru Yokoshima
IPC分类号： C08F283/10 , C08F285/00 , C08F290/06 , C08F290/14 , C08G59/16 , C08G59/42 , C08G59/62 , C08L51/04 , C08L63/00 , C08L63/10 , G03F7/027 , G03F7/038 , H05K1/00 , H05K3/28 , C08J3/00
CPC分类号： G03F7/0388 , C08F283/10 , C08F285/00 , C08F290/064 , C08F290/14 , C08G59/1461 , C08G59/4284 , C08G59/4292 , C08G59/625 , C08L51/04 , C08L63/00 , C08L63/10 , G03F7/027 , G03F7/038 , H05K3/287 , H05K3/4676 , C08L2666/02 , C08L2666/14 , C08L2666/08
摘要： A resin composition which is excellent in photosensitively and developability, gives a cured article excellent in flexibility, soldering heat resistance, resistance to thermal deterioration, and resistance to electroless gold plating, and is suitable especially for use in forming solder resists and interlayer dielectrics. The resin composition is characterized by containing an oligomer (A) obtained by reacting the following ingredients (a) to (d): an epoxy resin having at least two epoxy groups per molecule, a compound having two hydroxy groups and one carboxy group per molecule, a carboxy group per molecule, a carboxylated rubbery polymer, and a monobasic acid having an unsatuated group.
摘要翻译： 具有优异的光敏性和显影性的树脂组合物，具有柔软性，焊接耐热性，耐热劣化性和耐化学镀金的固化物，特别适用于形成阻焊剂和层间绝缘体。 树脂组合物的特征在于含有通过使下列成分（a）〜（d）反应得到的低聚物（A）：每分子具有至少2个环氧基的环氧树脂，每分子具有2个羟基和1个羧基的化合物 ，每分子羧基，羧基化橡胶状聚合物和具有不饱和基团的一元酸。
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2.发明申请Maleimido-bearing compounds resin composition containing the same and cured articles thereof 失效含有马来酰亚氨基化合物的树脂组合物含有相同的固化物公开(公告)号：US20050009947A1
公开(公告)日：2005-01-13
申请号：US10497437
申请日：2002-12-26
申请人： Toru Ozaki , Hiroo Koyanagi , Minoru Yokoshima
发明人： Toru Ozaki , Hiroo Koyanagi , Minoru Yokoshima
CPC分类号： C08F290/06 , C08F20/30 , C08F20/36 , C08F22/40
摘要： The present invention provides (meth)acrylate compounds bearing a specific maleimide group and resin compositions containing said compounds that can be cured by irradiation of light in a practical dose even when a photoinitiator is not used or used in a smaller amount than that of the prior art, and cured articles of the resin compositions.
摘要翻译： 本发明提供具有特定马来酰亚胺基团的（甲基）丙烯酸酯化合物和含有所述化合物的树脂组合物，即使不使用或者以比现有的那些更少的量使用光引发剂，也可以通过实际剂量的光照射而固化 艺术和固化物品。
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3.发明授权Maleimido-bearing compounds resin composition containing the same and cured articles thereof 失效含有马来酰亚氨基化合物的树脂组合物含有相同的固化物公开(公告)号：US07169829B2
公开(公告)日：2007-01-30
申请号：US10497437
申请日：2002-12-26
申请人： Toru Ozaki , Hiroo Koyanagi , Minoru Yokoshima
发明人： Toru Ozaki , Hiroo Koyanagi , Minoru Yokoshima
IPC分类号： C07D207/00 , C07D209/00 , C07D207/02
CPC分类号： C08F290/06 , C08F20/30 , C08F20/36 , C08F22/40
摘要： The present invention provides (meth)acrylate compounds bearing a specific maleimide group and resin compositions containing said compounds that can be cured by irradiation of light in a practical dose even when a photoinitiator is not used or used in a smaller amount than that of the prior art, and cured articles of the resin compositions.
摘要翻译： 本发明提供具有特定马来酰亚胺基团的（甲基）丙烯酸酯化合物和含有所述化合物的树脂组合物，即使不使用或者以比现有的那些更少的量使用光引发剂，也可以通过实际剂量的光照射而固化 艺术和固化物品。
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4.发明授权公开(公告)号：US06716892B1
公开(公告)日：2004-04-06
申请号：US09914878
申请日：2001-09-05
IPC分类号： C08L6310
CPC分类号： G03F7/0388 , C08F283/006 , C08F283/10 , C08F290/00 , C08F290/06 , C08F290/147 , C08G18/6254 , C08G18/672 , C08G18/683 , C08L63/10 , C09D175/04 , G03F7/027 , H05K3/287 , Y10S428/901 , Y10T428/24917 , Y10T428/31551 , C08G18/42 , C08L75/04
摘要： The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.
摘要翻译： 本发明涉及一种新的氨基甲酸酯低聚物（A）和包含（A）和可以用水稀释的不饱和基团的多元羧酸树脂（B）的树脂组合物，并且提供固化产物是优异的，并且适用于 阻焊剂和层间介电层，因为固化物的柔软性，耐焊锡性等优异，并且可以用有机溶剂或稀碱溶液显影; 适用于抗蚀剂或覆盖层的感光性树脂组合物; 和由此获得的感光膜。
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5.发明授权公开(公告)号：US07361450B2
公开(公告)日：2008-04-22
申请号：US10505600
申请日：2003-02-25
CPC分类号： C09D167/07 , C08F290/06 , C08F290/061 , C08G63/668 , C08G63/91 , C08L67/07 , G02B6/138 , Y10S430/109 , Y10S430/117 , Y10S525/921
摘要： A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.
摘要翻译： 基本上由通过使多元醇（a）与四元酸二酐（b）的反应产物的聚酯（c）与具有烯键式不饱和基团的化合物（d）反应得到的产物的光敏树脂（A）和 分子中的环氧基; 通过使感光性树脂（A）与二 - 或三 - 碱性单酸酐（e）反应得到的碱溶性感光性树脂（AA） 通过将上述感光性树脂与稀释剂（XX），交联剂（B）和/或光聚合引发剂（C）并入而制备的感光性树脂组合物; 组合物的固化产物; 和配备这些产品的物品。 树脂和树脂组合物提供适合于形成光波导的固化物，加工性，透明性，显影性，密合性，耐焊接性等优异。
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6.发明申请公开(公告)号：US20050153230A1
公开(公告)日：2005-07-14
申请号：US10505600
申请日：2003-02-25
IPC分类号： C08F290/06 , C08G63/20 , C08G63/668 , C08G63/91 , C08L67/06 , C08L67/07 , C09D167/07 , G02B6/138 , G03C1/76
CPC分类号： C09D167/07 , C08F290/06 , C08F290/061 , C08G63/668 , C08G63/91 , C08L67/07 , G02B6/138 , Y10S430/109 , Y10S430/117 , Y10S525/921
摘要： A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.
摘要翻译： 基本上由通过使多元醇（a）与四元酸二酐（b）的反应产物的聚酯（c）与具有烯属不饱和基团的化合物（d）反应得到的产物的光敏树脂（A）和 分子中的环氧基; 通过使感光性树脂（A）与二 - 或三 - 碱性单酸酐（e）反应得到的碱溶性感光性树脂（AA） 通过将上述感光性树脂与稀释剂（XX），交联剂（B）和/或光聚合引发剂（C）并入而制备的感光性树脂组合物; 组合物的固化产物; 和配备这些产品的物品。 树脂和树脂组合物提供适合于形成光波导的固化物，加工性，透明性，显影性，密合性，耐焊接性等优异。
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公开(公告)号：US20070161100A1
公开(公告)日：2007-07-12
申请号：US10597799
申请日：2005-02-08
IPC分类号： B09C1/10
摘要： Disclosed is a photosensitive resin composition comprising a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1). In the formula, R1 to R8 independently represents a hydrogen atom, a C1-C4 alkyl group or a halogen atom.
摘要翻译： 公开了包含可溶于碱性水溶液的树脂（A），交联剂（B），光聚合引发剂（C）和固化剂（D））的感光性树脂组合物，其中固化剂（D）为环氧化合物 通过使含有不少于80％由下式（1）表示的四苯乙烷衍生物的化合物缩水甘油化得到。 在该式中，R 1至R 8独立地表示氢原子，C 1 -C 4 - C 4 - 烷基 基团或卤素原子。
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公开(公告)号：US20090029848A1
公开(公告)日：2009-01-29
申请号：US11988248
申请日：2006-07-06
申请人： Hiroo Koyanagi , Makoto Uchida , Shigeru Moteki
发明人： Hiroo Koyanagi , Makoto Uchida , Shigeru Moteki
IPC分类号： B01J37/00
CPC分类号： B01J37/345 , B01J31/0267 , B01J31/06 , B01J37/0045 , B01J2231/14 , C08F2/44 , C08F2/48 , C08F2/50 , C08G59/18 , C08G59/68 , Y10T428/2982 , Y10T428/2984 , Y10T428/2985 , Y10T428/2987 , Y10T428/2989
摘要： A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B).
摘要翻译： 一种微粒硬化催化剂的制造方法，其特征在于，包括以下步骤：将含有环氧树脂硬化催化剂（A）的液体组合物，具有烯键式不饱和基团（B）的单体和光聚合引发剂（C） 以形成微粒; 并且当微粒漂浮时，用高能射线照射微粒，从而实现具有烯属不饱和基团（B）的单体的聚合。
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公开(公告)号：US07863345B2
公开(公告)日：2011-01-04
申请号：US11988248
申请日：2006-07-06
申请人： Hiroo Koyanagi , Makoto Uchida , Shigeru Moteki
发明人： Hiroo Koyanagi , Makoto Uchida , Shigeru Moteki
IPC分类号： C08F2/50 , C08F2/46 , C08J3/28 , B05D5/00 , B05D1/00 , B05D1/02 , C08K9/10 , B01J13/04 , B01J13/20 , B01J13/02 , B01J13/14
CPC分类号： B01J37/345 , B01J31/0267 , B01J31/06 , B01J37/0045 , B01J2231/14 , C08F2/44 , C08F2/48 , C08F2/50 , C08G59/18 , C08G59/68 , Y10T428/2982 , Y10T428/2984 , Y10T428/2985 , Y10T428/2987 , Y10T428/2989
摘要： A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B).
摘要翻译： 一种微粒硬化催化剂的制造方法，其特征在于，包括以下步骤：将含有环氧树脂硬化催化剂（A）的液体组合物，具有烯键式不饱和基团（B）的单体和光聚合引发剂（C） 以形成微粒; 并且当微粒漂浮时，用高能射线照射微粒，从而实现具有烯属不饱和基团（B）的单体的聚合。
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公开(公告)号：US5361999A
公开(公告)日：1994-11-08
申请号：US74433
申请日：1993-06-09
申请人： Seiichi Sakato , Yukio Yamashita , Chikai Fujitaka , Kunihiko Matsui , Isamu Nagayoshi , Tadahiko Nagase , Hiroo Koyanagi , Yuuji Nagasawa
发明人： Seiichi Sakato , Yukio Yamashita , Chikai Fujitaka , Kunihiko Matsui , Isamu Nagayoshi , Tadahiko Nagase , Hiroo Koyanagi , Yuuji Nagasawa
CPC分类号： E02F3/965 , E04G23/08 , E04G2023/086
摘要： A crusher-is disposed at a distal end of an operating boom of a construction vehicle. The crusher permits the breaking of a crushed mass of natural stone by means of a breaking force occurring between a stationary jaw body and a movable jaw body as the movable jaw body is closed toward the stationary jaw body. A flat auxiliary member is replaceably disposed on the stationary jaw body opposing the movable jaw body so as to break the crushed mass into smaller pieces. The distal end of the stationary jaw body projects longer than the distal end of the movable jaw body to facilitate the raking out of the crushed masses obtained in a blasting operation.
摘要翻译： 破碎机设置在施工车辆的操作起重臂的远端。 破碎机允许通过在可动夹爪体向静止颚体关闭的同时，通过在固定颚体和可动夹爪体之间产生的断裂力来破碎天然石块的破碎物质。 平坦的辅助构件可替换地设置在与可动钳口体相对的静止颚骨体上，以将破碎的质量破碎成较小的块。 静止颚体的前端比可动颚体的前端突出得更长，以便于从爆破作业中获得的粉碎物质甩出。
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