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    Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof
    3.
    发明申请
    Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof 有权
    橡胶改性聚酰胺树脂，环氧树脂组合物及其固化产品

    公开(公告)号：US20090071697A1

    公开(公告)日：2009-03-19

    申请号：US12083529

    申请日：2006-10-26

    申请人： Kazunori Ishikawa ,  Makoto Uchida ,  Shigeru Moteki

    发明人： Kazunori Ishikawa ,  Makoto Uchida ,  Shigeru Moteki

    IPC分类号： H05K1/00 ,  C08G69/08 ,  C08L77/06 ,  B32B27/06

    CPC分类号： C08G59/48 ,  C08G59/4284 ,  C08G59/54 ,  C08G59/621 ,  C08L53/00 ,  C08L63/00 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/285 ,  Y10T428/31529 ,  C08L2666/22 ,  C08L2666/24 ,  H01L2924/00

    摘要： The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2), —(CH2—CH═CH—CH2)X—  (B-1) —(CH2—CH═CH—CH2)Y—(CH2—CH(CN))Z—  (B-2) (wherein, each of x, y and z is an average value and 0.01≦z/(y+z)≦0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.

    摘要翻译： 本发明涉及一种含酚羟基的橡胶改性聚酰胺树脂，其分子中含有具有由下式（A）表示的结构的含酚羟基的芳族聚酰胺链段（其中m和n分别为 平均值，Ar表示二价芳族基团）和选自下式（B-1）或（B-2）的丁二烯（共）聚合物链段，<？在线公式描述=“在线公式” 末端=“铅”→>（CH2-CH-CH-CH2）X-（B-1）<？在线公式描述=“在线公式”end =“tail”？> - （CH2-CH-CH-CH2）Y-（CH2-CH（CN））Z-（B-2）<？line line line line line line -formulae description =“In-line Formulas”end =“tail”？>（其中，x，y和z各自为平均值，0.01 <= z /（y + z）<= 0.13，x表示正数 数量为5〜200，y + z为10〜200的正数），以及含有所述树脂，特别是环氧树脂组合物的树脂组合物; 所述环氧树脂组合物的固化物的柔软性，耐热性和电特性优异，特别是在高温高湿下。

    Heat-Resistant Adhesive
    4.
    发明申请
    Heat-Resistant Adhesive 审中-公开
    耐热粘合剂

    公开(公告)号：US20120288725A1

    公开(公告)日：2012-11-15

    申请号：US13575614

    申请日：2011-03-10

    申请人： Ryutaro Tanaka ,  Makoto Uchida ,  Shigeru Moteki ,  Yasumasa Akatsuka

    发明人： Ryutaro Tanaka ,  Makoto Uchida ,  Shigeru Moteki ,  Yasumasa Akatsuka

    IPC分类号： C09J177/00 ,  B32B15/08

    CPC分类号： B32B15/01 ,  C08G69/265 ,  C08G69/32 ,  C08K3/013 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00 ,  C08L77/10 ,  C08L2666/22 ,  C09D177/06 ,  C09D177/10 ,  C09J163/00 ,  C09J177/06 ,  C09J177/10 ,  H01L2924/0002 ,  Y10T428/31681 ,  H01L2924/00

    摘要： Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)

    摘要翻译： 公开了一种耐热粘合剂，其包括：具有由下式（1）表示的结构的酚羟基的芳族聚酰胺树脂（A）（式中，m和n各自表示平均值，满足关系式：0.005 ＆nlE; n /（m + n）<1，m + n是大于0但等于或小于200的整数，Ar 1表示二价芳族基团，Ar 2表示具有酚羟基的二价芳基 ，Ar 3表示二价芳香族基团），环氧树脂（B），固化催化剂（C），无机填料（D），以及作为任意成分的成分（A）以外的环氧树脂固化剂， 其中组分（D）的含量相对于组分（A）至（C）和环氧树脂固化剂的总量相对于100质量份为任意成分为30〜950质量份。 当电路等和散热板彼此粘合时，粘合剂的固化层不仅具有高耐热性和高粘合性，而且具有高导热性，并且还具有高导热性 绝佳的保温性能。 此外，固化的粘合剂是阻燃剂，因此粘合剂作为高功能半导体周边材料是非常有用的。

    Flame-retardant epoxy resin composition and cured product obtained therefrom
    6.
    发明申请
    Flame-retardant epoxy resin composition and cured product obtained therefrom 有权

    公开(公告)号：US20060003165A1

    公开(公告)日：2006-01-05

    申请号：US11148471

    申请日：2005-06-09

    申请人： Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

    发明人： Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

    IPC分类号： B32B27/38 ,  C08L63/00 ,  B32B33/00

    CPC分类号： C08L63/00 ,  Y10T428/31511 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31725 ,  C08L2666/20

    摘要： The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, 1 and m are averages, satisfying the formula: m/(1+m) =0.01; and 1+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: -ph(R1)n- or -ph(R2)n-X-ph(R3)n-, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO2 or a single bond)

    Primer resin for semiconductor device and semiconductor device
    7.
    发明授权
    Primer resin for semiconductor device and semiconductor device 失效
    用于半导体器件和半导体器件的底漆树脂

    公开(公告)号：US08410620B2

    公开(公告)日：2013-04-02

    申请号：US12733635

    申请日：2008-09-18

    申请人： Makoto Uchida ,  Shigeru Moteki ,  Ryutaro Tanaka ,  Hiromi Morita

    发明人： Makoto Uchida ,  Shigeru Moteki ,  Ryutaro Tanaka ,  Hiromi Morita

    IPC分类号： H01L23/29

    CPC分类号： C08L79/08 ,  C08G73/10 ,  C08G73/1046 ,  C08G73/106 ,  C08L63/00 ,  C08L2666/22 ,  C09J5/02 ,  C09J163/00 ,  C09J179/08 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3′,4′-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3′,4′-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4′-hydroxydiphenylsulfone, 4,4′-diamino-3,3′5,5′-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.

    摘要翻译： 本发明涉及一种半导体器件用底漆树脂，其包含下述式（1）表示的聚酰胺树脂：（其中，R1表示选自均苯四酸，3,4，...的四价芳香族四羧酸残基 '，4'-二苯基醚四羧酸，2,3,6,7-萘四甲酸和3,4,3'，4'-二苯甲酮四羧酸，R2表示选自以下的至少一种二价二胺残基： 的二氨基-4,4'-羟基二苯基砜，4,4'-二氨基-3,3'5,5'-四乙基二苯基甲烷和1,3-双 - （氨基苯氧基）苯，n为重复数，表示正数 10至1000），并具有包括铜或42合金的引线框架，在包括铜或42合金的引线框架和密封树脂的固化产物之间具有所述底漆树脂层的半导体器件和含有 说底线 树脂; 并且所述半导体器件在所述引线框与密封树脂组合物的固化产物之间具有非常改善的粘合性，并且还具有优异的耐热性和低吸湿性。

    Copper foil with primer resin layer and laminated sheet using the same
    8.
    发明申请
    Copper foil with primer resin layer and laminated sheet using the same 审中-公开
    具有底漆树脂层的铜箔和使用其的层压片

    公开(公告)号：US20100233476A1

    公开(公告)日：2010-09-16

    申请号：US12308308

    申请日：2007-06-19

    申请人： Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto ,  Shigeru Moteki ,  Mitsuyo Nishitoh

    发明人： Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto ,  Shigeru Moteki ,  Mitsuyo Nishitoh

    IPC分类号： B32B15/088 ,  C08L79/04 ,  C08L81/06

    CPC分类号： H05K3/386 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2457/08 ,  C08G73/10 ,  C08G73/1046 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1082 ,  C09D5/002 ,  C09D179/08 ,  C09J179/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2804

    摘要： The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1): (wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone or/and 4,4′-diamino-3,3′,5,5′-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strength and are suitable for flexible printed wiring boards.

    摘要翻译： 本发明涉及一种具有底漆树脂层的铜箔，该底漆树脂层提高了不进行粗糙化处理的铜箔表面与基材树脂之间的粘合强度，使用该底漆树脂层和使用其的层叠片材，其特征在于，使用下述式 1）:(式中，R 1表示作为二羧酸二酐成分的残留基的四价芳香族基团（均苯四酸酐，3,3'，4,4'-联苯四羧酸二酐，3,3'，4,4 二苯甲酮酸二酐或2,3,6,7-萘四羧酸二酐），R2表示作为二胺成分（1,3-双 - （3-氨基苯氧基）苯，3,3-双（3-氨基苯氧基）苯的残基的二价芳香族基团， 3'-二氨基-4,4'-二羟基二苯基砜或/和4,4'-二氨基-3,3'，5,5'-四乙基二苯基甲烷），n1表示重复数）作为底漆树脂; 并且具有所述聚酰亚胺层作为底漆的铜箔和层压片具有高粘合强度并且适用于柔性印刷线路板。

    Process for producing a double-sided flexible printed board and double-sided flexible printed board
    9.
    发明申请
    Process for producing a double-sided flexible printed board and double-sided flexible printed board 审中-公开
    生产双面柔性印刷板和双面柔性印刷板的工艺

    公开(公告)号：US20090056982A1

    公开(公告)日：2009-03-05

    申请号：US11918975

    申请日：2006-04-28

    申请人： Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

    发明人： Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

    IPC分类号： H05K1/00 ,  B32B38/00

    CPC分类号： H05K1/0346 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T156/10

    摘要： [Problems] To provide a process for producing a printed board having sufficient heat resistance. [Means for Solving Problems] The process for double-sided flexible printed board production comprising: a step in which a varnish comprising an aromatic resin represented by the following formula (1), an epoxy resin, and an organic solvent is directly applied to a metal foil; a step in which the solvent is removed to form a resin layer; and a step in which another foil is applied to the resin-layer side and the resin layer is cured. (In the formula, m and n are average value, m+n is a positive number of 2-200, and n is a positive number of 0.1 or larger; Ar1 and Ar3 each is a divalent aromatic group; and Ar2 is a divalent residue having a phenolic hydroxy group.)

    摘要翻译： [问题]提供一种具有足够的耐热性的印刷电路板的制造方法。 解决问题的方法本发明的双面柔性印刷电路板的制造方法，其特征在于，包括：将由下述式（1）表示的芳香族树脂，环氧树脂和有机溶剂构成的清漆直接涂布在 金属箔 除去溶剂以形成树脂层的步骤; 并且将另一箔施加到树脂层侧并树脂层固化的步骤。 （式中，m和n为平均值，m + n为2〜200的正数，n为0.1以上的正数; Ar 1和Ar 3分别为二价芳香族基团，Ar 2为二价 具有酚羟基的残基）

    Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof
    10.
    发明申请
    Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof 审中-公开
    纤维包含热固性聚酰胺树脂组合物，无纺织物及其生产方法

    公开(公告)号：US20120178332A1

    公开(公告)日：2012-07-12

    申请号：US13395972

    申请日：2010-10-22

    申请人： Makoto Uchida ,  Yasumasa Akatsuka ,  Kazunori Ishikawa ,  Shigeru Moteki

    发明人： Makoto Uchida ,  Yasumasa Akatsuka ,  Kazunori Ishikawa ,  Shigeru Moteki

    IPC分类号： D04H1/728 ,  C08L77/00 ,  D02G3/02 ,  B29C47/00 ,  B82Y30/00

    CPC分类号： D04H1/549 ,  C08L63/00 ,  C08L77/10 ,  D01D5/0007 ,  D01F6/80 ,  D01F6/90 ,  D04H1/587 ,  D04H1/728 ,  Y10T428/298 ,  Y10T442/626 ,  C08L2666/20 ,  C08L2666/22

    摘要： The present invention relates to a fiber comprising a heat curable polyamide resin composition containing both a) a phenolic hydroxy group-containing polyamide and b) an epoxy resin having two or more epoxy groups in one molecule, a nanofiber comprising said resin composition obtained by electrospinning method, a nonwoven fabric obtained by applying heat treatment to a laminate of said nanofiber, a method for producing said nanofiber by electrospinning method and a heat curable polyamide resin composition for fiber. A nonwoven fabric can be obtained only by subjecting a deposit of the nanofiber obtained by electrospinning method to heat treatment, nanofibers in the obtained nonwoven fabric are bonded to each other by heat-curing, and the nonwoven fabric has such characteristics that its mechanical strength, heat resistance and chemical resistance are excellent and that it has a high strength.

    摘要翻译： 本发明涉及包含含有a）含酚羟基的聚酰胺和b）在一分子中具有两个或更多个环氧基的环氧树脂的热固化性聚酰胺树脂组合物的纤维，包含通过静电纺丝得到的所述树脂组合物的纳米纤维 方法，通过对所述纳米纤维的层压体进行热处理获得的无纺布，通过静电纺丝法生产所述纳米纤维的方法和用于纤维的热固化性聚酰胺树脂组合物。 通过将通过静电纺丝法得到的纳米纤维的沉积物进行热处理，可以得到无纺布，通过热固化将得到的无纺布中的纳米纤维彼此接合，无纺布的机械强度， 耐热性和耐化学性优异，强度高。