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公开(公告)号：US06783640B2
公开(公告)日：2004-08-31
申请号：US10050787
申请日：2002-01-18
IPC分类号： C23C1434
CPC分类号： C23C14/0042 , C23C14/544
摘要： In a sputtering method for forming a film on a substrate in a film forming space while monitoring emission intensity of plasma, the method comprises the steps of detecting a thickness of the film formed on the substrate; comparing a detected value with a preset value of the film thickness; and deciding a target value of the emission intensity in accordance with a compared result. With the method, a transparent conductive film is formed which has high uniformity in film thickness, sheet resistance and transmittance and hence has superior characteristics.
摘要翻译： 在监测等离子体的发光强度的同时，在成膜空间的基板上形成膜的溅射方法中，该方法包括以下步骤：检测在基板上形成的膜的厚度; 将检测值与膜厚的预设值进行比较; 并根据比较结果决定发光强度的目标值。 通过该方法，形成了透明导电膜，其膜厚度，薄层电阻和透射率均匀性高，因此具有优异的特性。
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公开(公告)号：US20090095420A1
公开(公告)日：2009-04-16
申请号：US12327428
申请日：2008-12-03
申请人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
发明人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
IPC分类号： H01L21/3065 , B05C9/08 , H01L21/302
CPC分类号： H01L21/67017 , C23C16/24 , C23C16/4412 , C23C16/545 , H01J37/3244 , H01J37/32834 , H01J37/32844 , Y02C20/30 , Y02P70/605
摘要： There is disclosed an exhaust processing process of a processing apparatus for processing a substrate or a film, which comprises after the processing of the substrate or the film, introducing a non-reacted gas and/or a by-product into a trap means comprising a filament comprised of a high-melting metal material comprising as a main component at least one of tungsten, molybdenum and rhenium; and processing the non-reacted gas and/or the by-product inside the trap means. This makes it possible to prevent lowering in exhaust conductance, to lengthen the maintenance cycle of the processing apparatus, and to provide a high-quality product (processed substrate or film).
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3.发明授权Method and apparatus for forming deposition film, and method for treating substrate 失效用于形成沉积膜的方法和装置及其处理方法公开(公告)号：US06811816B2
公开(公告)日：2004-11-02
申请号：US10195543
申请日：2002-07-16
IPC分类号： C23C1600
CPC分类号： C23C14/564 , C23C14/562 , H01L31/20 , Y02E10/50
摘要： A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.
摘要翻译： 气体吸附构件设置在与成膜室连通的空间中，并且沉积膜沉积，同时连续地供给从该构件释放的气体成分，从而能够以良好的再现性在基板上形成高品质和均匀的沉积膜。
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公开(公告)号：US07501305B2
公开(公告)日：2009-03-10
申请号：US11874352
申请日：2007-10-18
IPC分类号： H01L21/20
CPC分类号： H01L21/67253 , C23C16/24 , C23C16/545 , H01L31/03685 , H01L31/03762 , H01L31/076 , H01L31/1824 , H01L31/202 , Y02E10/545 , Y02E10/548 , Y02P70/521
摘要： A method for forming a deposited film containing microcrystalline silicon on a moving substrate by plasma-enhanced CVD includes forming a deposited film containing microcrystalline silicon on a moving substrate by plasma-enhanced CVD under conditions such that when a deposited film having a thickness of 300 nm or more is formed on a substrate while the substrate is in a stationary state, an area of the microcrystalline silicon region in which an intensity of Raman scattering attributed to a crystalline substance in the deposited film is equal to or higher than three times an intensity of Raman scattering attributed to an amorphous is 50% or more of the total area based on the area of the microcrystalline silicon region and the area of a region composed of the amorphous.
摘要翻译： 通过等离子体增强CVD在移动基板上形成含有微晶硅的沉积膜的方法包括通过等离子体增强CVD在移动的衬底上形成含有微晶硅的沉积膜，使得当厚度为300nm的沉积膜 以上，在基板处于静止状态的同时，在基板上形成有由析出膜中的结晶物质引起的拉曼散射强度的微晶硅区域的面积等于或高于 归因于非晶体的拉曼散射基于微晶硅区域的面积和由无定形构成的区域的面积为总面积的50％以上。
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5.发明授权Exhaust processing method, plasma processing method and plasma processing apparatus 失效排气处理方法，等离子体处理方法和等离子体处理装置公开(公告)号：US07211708B2
公开(公告)日：2007-05-01
申请号：US09822191
申请日：2001-04-02
申请人： Takeshi Shishido , Shotaro Okabe , Masahiro Kanai , Yuzo Koda , Yasuyoshi Takai , Tadashi Hori , Koichiro Moriyama , Hidetoshi Tsuzuki , Hiroyuki Ozaki
发明人： Takeshi Shishido , Shotaro Okabe , Masahiro Kanai , Yuzo Koda , Yasuyoshi Takai , Tadashi Hori , Koichiro Moriyama , Hidetoshi Tsuzuki , Hiroyuki Ozaki
CPC分类号： H01J37/32844 , C23C14/564 , C23C16/4412 , Y02C20/30 , Y02P70/605
摘要： A chemical-reaction inducing means is provided in an exhaust line connecting a processing space for subjecting a substrate or a film to plasma processing to an exhaust means, and at least either an unreacted gas or byproduct exhausted from the processing space are caused to chemically react without allowing plasma in the processing space to reach the chemical-reaction inducing means, thereby improving the processing ability of the chemical-reaction inducing means to process the unreacted gas or byproduct.
摘要翻译： 化学反应诱发装置设置在连接用于对衬底或膜进行等离子体处理的处理空间到排气装置的排气管线中，并且至少从处理空间排出的未反应气体或副产物发生化学反应 不允许处理空间中的等离子体到达化学反应诱导装置，从而提高化学反应诱导装置处理未反应气体或副产物的处理能力。
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6.发明申请PROCESSING APPARATUS, EXHAUST PROCESSING PROCESS AND PLASMA PROCESSING PROCESS 审中-公开加工设备，排气加工过程和等离子体处理工艺公开(公告)号：US20090084500A1
公开(公告)日：2009-04-02
申请号：US12326238
申请日：2008-12-02
申请人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
发明人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
CPC分类号： H01L21/67017 , C23C16/24 , C23C16/4412 , C23C16/545 , H01J37/3244 , H01J37/32834 , H01J37/32844 , Y02C20/30 , Y02P70/605
摘要： There is disclosed an exhaust processing process of a processing apparatus for processing a substrate or a film, which comprises after the processing of the substrate or the film, introducing a non-reacted gas and/or a by-product into a trap means comprising a filament comprised of a high-melting metal material comprising as a main component at least one of tungsten, molybdenum and rhenium; and processing the non-reacted gas and/or the by-product inside the trap means. This makes it possible to prevent lowering in exhaust conductance, to lengthen the maintenance cycle of the processing apparatus, and to provide a high-quality product (processed substrate or film).
摘要翻译： 公开了一种处理衬底或膜的处理装置的废气处理过程，其包括在处理基板或膜之后，将未反应的气体和/或副产物引入陷阱装置， 由包含钨，钼和铼中的至少一种作为主要成分的高熔点金属材料构成的长丝; 以及处理陷阱装置内的未反应气体和/或副产物。 这使得可以防止排气电导降低，延长加工设备的维护周期，并且提供高质量的产品（经处理的基板或膜）。
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公开(公告)号：US20080096305A1
公开(公告)日：2008-04-24
申请号：US11874352
申请日：2007-10-18
IPC分类号： H01L21/00
CPC分类号： H01L21/67253 , C23C16/24 , C23C16/545 , H01L31/03685 , H01L31/03762 , H01L31/076 , H01L31/1824 , H01L31/202 , Y02E10/545 , Y02E10/548 , Y02P70/521
摘要： A method for forming a deposited film containing microcrystalline silicon on a moving substrate by plasma-enhanced CVD includes forming a deposited film containing microcrystalline silicon on a moving substrate by plasma-enhanced CVD under conditions such that when a deposited film having a thickness of 300 nm or more is formed on a substrate while the substrate is in a stationary state, an area of the microcrystalline silicon region in which an intensity of Raman scattering attributed to a crystalline substance in the deposited film is equal to or higher than three times an intensity of Raman scattering attributed to an amorphous is 50% or more of the total area based on the area of the microcrystalline silicon region and the area of a region composed of the amorphous.
摘要翻译： 通过等离子体增强CVD在移动基板上形成含有微晶硅的沉积膜的方法包括通过等离子体增强CVD在移动的衬底上形成含有微晶硅的沉积膜，使得当厚度为300nm的沉积膜 以上，在基板处于静止状态的同时，在基板上形成有由析出膜中的结晶物质引起的拉曼散射强度的微晶硅区域的面积等于或高于 归因于非晶体的拉曼散射基于微晶硅区域的面积和由无定形构成的区域的面积为总面积的50％以上。
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8.发明申请EXHAUST PROCESSING METHOD, PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS 审中-公开排气处理方法，等离子体处理方法和等离子体处理装置公开(公告)号：US20070169890A1
公开(公告)日：2007-07-26
申请号：US11694889
申请日：2007-03-30
申请人： TAKESHI SHISHIDO , Shotaro Okabe , Masahiro Kanai , Yuzo Koda , Yasuyoshi Takai , Tadashi Hori , Koichiro Moriyama , Hidetoshi Tsuzuki , Hiroyuki Ozaki
发明人： TAKESHI SHISHIDO , Shotaro Okabe , Masahiro Kanai , Yuzo Koda , Yasuyoshi Takai , Tadashi Hori , Koichiro Moriyama , Hidetoshi Tsuzuki , Hiroyuki Ozaki
IPC分类号： H01L21/306 , C23C16/00
CPC分类号： H01J37/32844 , C23C14/564 , C23C16/4412 , Y02C20/30 , Y02P70/605
摘要： A chemical-reaction inducing means is provided in an exhaust line connecting a processing space for subjecting a substrate or a film to plasma processing to an exhaust means, and at least either an unreacted gas or byproduct exhausted from the processing space are caused to chemically react without allowing plasma in the processing space to reach the chemical-reaction inducing means, thereby improving the processing ability of the chemical-reaction inducing means to process the unreacted gas or byproduct.
摘要翻译： 化学反应诱发装置设置在连接用于对衬底或膜进行等离子体处理的处理空间到排气装置的排气管线中，并且至少从处理空间排出的未反应气体或副产物发生化学反应 不允许处理空间中的等离子体到达化学反应诱导装置，从而提高化学反应诱导装置处理未反应气体或副产物的处理能力。
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公开(公告)号：US20090114155A1
公开(公告)日：2009-05-07
申请号：US12327403
申请日：2008-12-03
申请人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
发明人： Tadashi Sawayama , Yasushi Fujioka , Masahiro Kanai , Shotaro Okabe , Yuzo Kohda , Tadashi Hori , Koichiro Moriyama , Hiroyuki Ozaki , Yukito Aota , Atsushi Koike , Mitsuyuki Niwa , Yasuyoshi Takai , Hidetoshi Tsuzuki
IPC分类号： C23C16/46
CPC分类号： H01L21/67017 , C23C16/24 , C23C16/4412 , C23C16/545 , H01J37/3244 , H01J37/32834 , H01J37/32844 , Y02C20/30 , Y02P70/605
摘要： There is disclosed an exhaust processing process of a processing apparatus for processing a substrate or a film, which comprises after the processing of the substrate or the film, introducing a non-reacted gas and/or a by-product into a trap means comprising a filament comprised of a high-melting metal material comprising as a main component at least one of tungsten, molybdenum and rhenium; and processing the non-reacted gas and/or the by-product inside the trap means. This makes it possible to prevent lowering in exhaust conductance, to lengthen the maintenance cycle of the processing apparatus, and to provide a high-quality product (processed substrate or film).
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公开(公告)号：US07112264B2
公开(公告)日：2006-09-26
申请号：US10606956
申请日：2003-06-27
申请人： Hidetoshi Tsuzuki , Noboru Toyama , Yasuyoshi Takai , Ryo Hayashi , Yuichi Sonoda , Masumitsu Iwata , Yusuke Miyamoto
发明人： Hidetoshi Tsuzuki , Noboru Toyama , Yasuyoshi Takai , Ryo Hayashi , Yuichi Sonoda , Masumitsu Iwata , Yusuke Miyamoto
CPC分类号： C25D7/0671 , C25D5/028
摘要： A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive. By holding the conductive portion of the film-deposition suppression device and the conductive substrate at substantially the same potential, film deposition on the other surface of the conductive substrate is suppressed.
摘要翻译： 电镀装置包括用于保持至少含有金属离子的电镀槽的电镀容器，用于输送长导电性基板并将长导电性基材浸渍在电镀槽中的输送装置，设置在镀浴中的面对电极， 导电基板的一个表面，通过在导电基板和对置电极之间施加电压在导电基板的一个表面上进行电镀的电压施加装置和固定地设置在电镀槽中的成膜抑制装置，使得 至少一部分成膜抑制装置接近导电基板的短边缘。 靠近导电基板的短边缘的薄膜沉积抑制装置的至少一部分是导电的。 通过将成膜抑制装置的导电部分和导电基板保持在基本相同的电位，抑制导电基板的另一个表面上的成膜。
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