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    Method of removing smear from via holes
    1.
    发明授权
    Method of removing smear from via holes 失效
    从通孔去除涂片的方法

    公开(公告)号：US06766811B2

    公开(公告)日：2004-07-27

    申请号：US10213619

    申请日：2002-08-07

    申请人： Toshihisa Shimo ,  Kyoko Kumagai ,  Toshiki Inoue ,  Yoshifumi Kato ,  Takashi Yoshida ,  Masanobu Hidaka

    发明人： Toshihisa Shimo ,  Kyoko Kumagai ,  Toshiki Inoue ,  Yoshifumi Kato ,  Takashi Yoshida ,  Masanobu Hidaka

    IPC分类号： H01L21302

    CPC分类号： H05K3/0055 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2203/0796 ,  H01L2924/00

    摘要： An aqueous solution containing sulfuric acid and hydrogen peroxide is used for a soft etchant in a soft etching step in a smear removing process performed prior to a catalyst applying process for chemical copper plating after formation of via holes through an insulating layer of a multi-layer substrate by irradiation of laser. The concentration of sulfuric acid is 2.4 times or less than the concentration of hydrogen peroxide. Preferably, the concentration of sulfuric acid is in a range of 9 to 90 g/l, and the concentration of sulfuric acid is lower than the concentration of hydrogen peroxide. More preferably, the concentration of sulfuric acid is in a range of 9 to 18 g/l, and the concentration of hydrogen peroxide is in a range of 33 to 38.5 g/l. As a result, smear can be certainly removed without excessively etching a conductive layer in the smear removing process.

    摘要翻译： 含硫酸和过氧化氢的水溶液在软蚀刻步骤中用于软蚀刻剂，在用于化学镀铜的催化剂施加过程之后，在通过多层绝缘层形成通孔之后， 基板通过激光照射。 硫酸的浓度是过氧化氢浓度的2.4倍以下。 优选地，硫酸的浓度在9〜90g / l的范围内，硫酸的浓度低于过氧化氢的浓度。 更优选的是，硫酸的浓度为9〜18g / l，过氧化氢的浓度为33〜38.5g / l。 结果，在涂抹去除过程中，可以肯定地除去涂层而不过度蚀刻导电层。

    RESIN BOARD TO BE SUBJECTED TO OZONE TREATMENT, WIRING BOARD, AND METHOD OF MANUFACTURING THE WIRING BOARD
    2.
    发明申请
    RESIN BOARD TO BE SUBJECTED TO OZONE TREATMENT, WIRING BOARD, AND METHOD OF MANUFACTURING THE WIRING BOARD 审中-公开
    要经受臭氧处理，接线板的树脂板和制造接线板的方法

    公开(公告)号：US20100059259A1

    公开(公告)日：2010-03-11

    申请号：US12531886

    申请日：2008-05-21

    申请人： Takeshi Bessho ,  Kyoko Kumagai ,  Takashi Yoshida ,  Manabu Osamura ,  Toshihisa Shimo

    发明人： Takeshi Bessho ,  Kyoko Kumagai ,  Takashi Yoshida ,  Manabu Osamura ,  Toshihisa Shimo

    IPC分类号： H05K1/09 ,  C08G18/00 ,  C25D5/34 ,  H01B13/00

    CPC分类号： C23C18/2086 ,  C23C18/1653 ,  C23C18/1694 ,  C23C18/2006 ,  C23C18/2033 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/087

    摘要： A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

    摘要翻译： 一种树脂板，由至少一种具有与臭氧溶液侵蚀不同程度的树脂的混合物中的至少一种组成，以及分子中具有不同程度的多种成分的树脂 用臭氧水处理对臭氧溶液的腐蚀的敏感性，形成重整层，催化剂金属被重整层吸附，形成进行电镀处理的树脂金属复合层。 在树脂板中，可能被臭氧溶液侵蚀的成分或成分溶解在臭氧溶液中，在成分和成分之间形成有数毫米级的孔或间隙 这是/不太可能被臭氧解决方案所侵蚀。 随着电镀沉积在孔隙或间隙中，由于锚定效应，粘合强度得到改善。 因此，即使在树脂 - 金属复合层的厚度为10〜200nm的情况下，也能够提高镀膜的附着强度。

    IN-LIQUID PLASMA FILM-FORMING APPARATUS, ELECTRODE FOR IN-LIQUID PLASMA, AND FILM-FORMING METHOD USING IN-LIQUID PLASMA
    5.
    发明申请
    IN-LIQUID PLASMA FILM-FORMING APPARATUS, ELECTRODE FOR IN-LIQUID PLASMA, AND FILM-FORMING METHOD USING IN-LIQUID PLASMA 有权
    液体等离子体成膜装置，液体等离子体电极和使用液体等离子体的成膜方法

    公开(公告)号：US20110229656A1

    公开(公告)日：2011-09-22

    申请号：US12671773

    申请日：2009-03-02

    申请人： Kenji Shibata ,  Toshihisa Shimo ,  Kyoko Kumagai ,  Hidetaka Hayashi ,  Shinya Okuda ,  Shinfuku Nomura ,  Hiromichi Toyota

    发明人： Kenji Shibata ,  Toshihisa Shimo ,  Kyoko Kumagai ,  Hidetaka Hayashi ,  Shinya Okuda ,  Shinfuku Nomura ,  Hiromichi Toyota

    IPC分类号： H05H1/48

    CPC分类号： C23C16/509 ,  C23C16/26 ,  C23C16/4485 ,  H01J37/32357

    摘要： In an in-liquid plasma film-forming apparatus having: a vessel 1 being capable of accommodating a substrate “S” and a liquid “L” including raw material therein; an electrode 2 for in-liquid plasma, electrode 2 which is disposed in the vessel 1; an electric power device 3 for supplying electricity to the electrode 2 for in-liquid plasma; the electrode 2 for in-liquid plasma is equipped with: a main electrode 21 having a discharging end 22; an auxiliary electrode 26 not only facing the discharging end 22 but also being disposed between the discharging end 22 and the substrate “S” that face each other; and a plasma generating unit 29 having a space that is demarcated by a surface 22a of the discharging end 22 and a surface 26a of the auxiliary electrode 26 facing the surface 22a, and being for generating plasma by means of electricity being supplied to the main electrode 21. And, a decomposed component of the raw material is deposited onto a surface of the substrate “S” by contacting the plasma, which has generated at the plasma generating unit 29, with the substrate “S.”By means of the present construction, it becomes feasible to generate plasma in liquid without ever using a second electrode that serves as a substrate.

    摘要翻译： 在液体等离子体成膜装置中，具有容纳基材“S”的容器1和包含原料的液体“L” 用于液体内等离子体的电极2，设置在容器1中的电极2; 用于向用于液体内等离子体的电极2供电的电力装置3; 用于液体内等离子体的电极2装备有：具有放电端22的主电极21; 辅助电极26不仅面向放电端22，而且还设置在放电端22和彼此相对的衬底“S”之间; 以及等离子体产生单元29，其具有由排放端22的表面22a和辅助电极26的面向表面22a的表面26a划分的空间，并且用于通过向主电极供电的方式产生等离子体 并且，通过使在等离子体产生单元29产生的等离子体与基板“S”接触，将原料的分解成分沉积在基板“S”的表面上。借助于本构造 在不用使用作为基板的第二电极的情况下，可以在液体中产生等离子体。

    Method for production of electroless plating material
    8.
    发明授权
    Method for production of electroless plating material 有权
    化学镀材料的生产方法

    公开(公告)号：US08563093B2

    公开(公告)日：2013-10-22

    申请号：US12881524

    申请日：2010-09-14

    申请人： Manabu Osamura ,  Toshihisa Shimo ,  Kyoko Kumagai ,  Isami Kato ,  Takeshi Bessho ,  Takeaki Maeda

    发明人： Manabu Osamura ,  Toshihisa Shimo ,  Kyoko Kumagai ,  Isami Kato ,  Takeshi Bessho ,  Takeaki Maeda

    IPC分类号： B05D3/04 ,  B05D3/00 ,  C08J7/18 ,  G21H5/00

    CPC分类号： C23C18/26 ,  C23C18/204 ,  C23C18/2086

    摘要： A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

    摘要翻译： 本发明的无电解电镀材料的制造方法是制造具有通过无电解电镀而被镀覆的表面的无电解电镀材料的方法，包括臭氧处理工序，其中，由 使树脂与含有臭氧的溶液接触以在材料体的表面形成改性层，以及表面层去除步骤，其中在臭氧处理步骤之后，用紫外线照射材料体的表面 以去除改性层的表层。