公开(公告)号：US20110048641A1

公开(公告)日：2011-03-03

申请号：US12871096

申请日：2010-08-30

申请人： Toshimasa SUGIMURA ,  Akinori Nishio ,  Kazuyuki Kiuchi

发明人： Toshimasa SUGIMURA ,  Akinori Nishio ,  Kazuyuki Kiuchi

IPC分类号： B32B38/10

CPC分类号： B32B38/10 ,  B32B2038/1891 ,  B32B2310/028 ,  B32B2310/04 ,  B32B2310/0825 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T156/1121 ,  Y10T156/1137 ,  Y10T156/1142 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1922 ,  Y10T156/1939

摘要： The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by bonding a surface protection tape to the surface of the object to be cut, and cutting the surface protection tape together with the object to be cut in a dicing process and, after the dicing process, easily separating and removing the protection tape from individual chips. To this end, there is provided a method in which a dicing surface protection tape is bonded to a surface of an object to be cut, the tape is cut together with the object to be cut, and then the dicing surface protection tape is removed with the object to be cut inclined.

摘要翻译： 本发明旨在提供一种用于通过将表面保护带粘合到待切割物体的表面上来保护被切割物体的表面由于由于灰尘等的附着而引起的污染的方法，包括切割废料 并且在切割工艺中切割表面保护带与待切割的物体，并且在切割处理之后，容易地将保护带从各个芯片分离和移除。 为此，提供了一种方法，其中切割表面保护带粘合到被切割物体的表面，将带与待切割的物体一起切割，然后切割表面保护带被用 要切割的对象倾斜。

公开(公告)号：US08337656B2

公开(公告)日：2012-12-25

申请号：US12736804

申请日：2009-05-01

申请人： Akinori Nishio ,  Kazuyuki Kiuchi

发明人： Akinori Nishio ,  Kazuyuki Kiuchi

IPC分类号： B32B38/10

CPC分类号： C09J133/10 ,  C09J7/29 ,  C09J2433/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1142 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/2495

摘要： To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.

摘要翻译： 提供一种保护地面，薄而易碎的被粘物翘曲的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上除去，而不损坏和污染易碎的被粘物。 粘合片5包括依次布置的基底层A，压敏粘合剂层A，基底层B和粘合剂层B，其中：基底层A具有 在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。 压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比 每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

公开(公告)号：US20100243159A1

公开(公告)日：2010-09-30

申请号：US12743523

申请日：2008-11-17

申请人： Akinori Nishio ,  Kazuyuki Kiuchi

发明人： Akinori Nishio ,  Kazuyuki Kiuchi

IPC分类号： C09J5/00 ,  B32B7/10 ,  B32B7/12

CPC分类号： B29C53/32 ,  B29C63/0013 ,  B29K2995/0049 ,  B29L2009/00 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/30 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B37/12 ,  B32B37/144 ,  B32B2038/1891 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/02 ,  B32B2264/101 ,  B32B2270/00 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/518 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2405/00 ,  B32B2457/00 ,  C09J7/29 ,  C09J2201/162 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1917 ,  Y10T156/1978 ,  Y10T428/24942 ,  Y10T428/2848

摘要： A pressure sensitive adhesive sheet according to the present invention is a resin laminate, including a high thermally shrinkable base layer having relatively high thermal shrinkage ratio, having a ratio (A:B) of the thermal shrinkage ratio in a main shrinkage direction [A (%)] to the shrinkage ratio in a direction perpendicular to the main shrinkage direction [B (%)] of 1:1 to 10:1, and a low thermally shrinkable base layer having relatively low thermal shrinkage ratio, the high and low thermally shrinkable base layers bonded to each other via a self-adhesive layer, wherein the resin laminate bends toward the high thermally shrinkable base layer side when heated from any one direction and can automatically curl from one terminal unidirectionally to form a tubular roll by further heating. The pressure sensitive adhesive sheet can be separated from an adherend smoothly when heated from any one direction. Thus, it can be used, for example, as a pressure sensitive adhesive sheet for semiconductor wafer polishing.

摘要翻译： 根据本发明的压敏粘合片是具有热收缩率相对较高的热收缩性高的基层，其主收缩方向的热收缩率的比（A:B）为[A（B） ％）]相对于主收缩方向[B（％）]垂直的方向的收缩率为1:1〜10:1，热收缩率比较低的热收缩性低的基底层，高，低热收缩率 通过自粘合层彼此粘合的可收缩的基底层，其中当从任何一个方向加热时，树脂层压板朝向高热收缩基底层弯曲，并且可以通过进一步加热自动地从一个端子卷曲形成管状辊。 当从任何一个方向加热时，压敏粘合片可以平滑地与被粘物分离。 因此，其可以用作例如半导体晶片研磨用压敏粘合片。

公开(公告)号：US20110067808A1

公开(公告)日：2011-03-24

申请号：US12736804

申请日：2009-05-01

申请人： Akinori Nishio ,  Kazuyuki Kiuchi

发明人： Akinori Nishio ,  Kazuyuki Kiuchi

IPC分类号： B32B38/10 ,  C09J7/02 ,  B32B27/30

CPC分类号： C09J133/10 ,  C09J7/29 ,  C09J2433/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1142 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/2495

摘要： To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend.The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.

摘要翻译： 提供一种保护地面，薄而脆弱的被粘物从“翘曲”的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上去除而不损坏和污染易碎的被粘物。 粘合片5包括依次布置的基底层A，粘合剂层A，基底层B和压敏粘合剂层B，其中：基底层A具有 在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。 压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比 每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

公开(公告)号：US20110220268A1

公开(公告)日：2011-09-15

申请号：US13130731

申请日：2009-11-19

申请人： Akinori Nishio ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

发明人： Akinori Nishio ,  Kazuyuki Kiuchi ,  Tomokazu Takahashi

IPC分类号： B32B38/10 ,  C09J7/02 ,  B32B7/06 ,  B32B37/02 ,  B32B37/14

CPC分类号： H01L21/67132 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/51 ,  B32B2405/00 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6836 ,  H01L24/27 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention aims to provide a surface protection tape for use in a dicing step, which protects a surface of a material to be cut from staining owing to attachment of dust and the like such as shavings by sticking the surface protection tape on the surface of the material to be cut in the dicing step and cutting the tape together with the material to be cut, and which is easily peeled and removed from individual chips after the dicing step. There is provided a surface protection tape for dicing to be stuck on a surface of a material to be cut and to be cut together with the material to be cut, which includes a contractible film layer that contracts in at least one axis direction by a stimulus and laminated thereon a restriction layer that restricts the contraction of the contractible film layer, and which is peeled off with undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when the stimulus that causes the contraction is applied.

摘要翻译： 本发明的目的在于提供一种用于切割步骤的表面保护带，其通过将表面保护带粘附在表面上而保护被切割材料的表面免受灰尘等的附着，例如刮屑 在切割步骤中切割的材料和切割材料一起切割，并且在切割步骤之后容易地从各个芯片剥离和去除。 提供了一种表面保护带，用于切割以粘贴在待切割材料的表面上并与待切割的材料一起切割，其包括通过刺激在至少一个轴向收缩的收缩膜层 并且在其上层压限制层，该限制层限制收缩膜层的收缩，并且在一个方向上从一个端部进行自发轧制或相对的两个端部朝向中心剥离，以形成一个或两个圆柱形辊，当 导致收缩的刺激被应用。

公开(公告)号：US20110195248A1

公开(公告)日：2011-08-11

申请号：US13125418

申请日：2009-10-15

申请人： Kazuyuki Kiuchi ,  Akinori Nishio

发明人： Kazuyuki Kiuchi ,  Akinori Nishio

IPC分类号： B32B7/00

CPC分类号： H01L21/6836 ,  B32B5/18 ,  B32B7/10 ,  B32B7/12 ,  B32B25/08 ,  B32B25/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B2266/0242 ,  B32B2266/0278 ,  B32B2274/00 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/516 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/546 ,  B32B2307/732 ,  C09J7/29 ,  C09J2201/162 ,  C09J2467/006 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/269

摘要： The pressure-sensitive adhesive sheet with spontaneously rolling property of the invention is a pressure-sensitive adhesive sheet comprising a contractible film layer, an elastic layer, a rigid film layer, an intermediate layer, and a pressure-sensitive adhesive layer satisfying the following requirements and laminated in this order, which is capable of undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when a stimulus causing a contraction is applied: the elastic layer having a thickness of from 15 to 150 μm and a shear modulus at 80° C. of from 1×104 Pa to 5×106 Pa, the intermediate layer having a shear modulus at 23° C. of from 1×104 Pa to 4×107 Pa, and the pressure-sensitive adhesive layer having a pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesion reducing treatment (180° peeling, vs. silicon mirror wafer, tensile rate: 300 mm/minute) of 6.5 N/10 mm or less.

摘要翻译： 本发明的具有自发轧制性的压敏粘合片是包含可收缩膜层，弹性层，刚性膜层，中间层和满足以下要求的压敏粘合剂层的压敏粘合片 并且当施加引起收缩的刺激时，能够在一个方向上从一个端部进行自发轧制或从相对的两个端部朝向中心进行层压，以形成一个或两个圆柱形辊;弹性层具有 厚度为15〜150μm，80℃下的剪切模量为1×10 4 Pa〜5×10 6 Pa，中间层的23℃剪切模量为1×10 4 Pa〜4×10 7 Pa和粘合降低处理后的粘合剂层或压敏粘合剂层的压敏粘合强度的粘合剂层（180°剥离，相对于硅胶） n镜片，拉伸速度：300mm /分钟）为6.5N / 10mm以下。

公开(公告)号：US07910206B2

公开(公告)日：2011-03-22

申请号：US11937525

申请日：2007-11-09

申请人： Kazuyuki Kiuchi ,  Akira Shoji ,  Akinori Nishio ,  Kunio Nagasaki

发明人： Kazuyuki Kiuchi ,  Akira Shoji ,  Akinori Nishio ,  Kunio Nagasaki

IPC分类号： B32B7/12 ,  B32B9/00

CPC分类号： B32B1/08 ,  B32B25/14 ,  B32B27/08 ,  C09J7/29 ,  C09J2201/162 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S428/906 ,  Y10T428/1328 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848

摘要： The present invention relates to a self-rolling pressure-sensitive adhesive sheet, including a shrinkable film layer; a restriction layer disposed on a side of the shrinkable film layer; and a pressure-sensitive adhesive layer disposed on the side of the restriction layer which is opposite to the side on which the shrinkable film layer is disposed. The self-rolling pressure-sensitive adhesive sheet is a releasable pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesiveness decreasing treatment has a pressure-sensitive adhesive power (180° C. peeling, against a silicon mirror wafer, tensile speed: 300 mm/min) of 6.5 N/10 mm or less, and in which the self-rolling pressure-sensitive adhesive sheet rolls up in one direction from an end to form one tubular roll or rolls up from two opposing ends toward a center of the two opposing ends to form two tubular rolls, when the self-rolling pressure-sensitive sheet is stimulated to induce the contraction of the shrinkable film layer.

摘要翻译： 本发明涉及包含可收缩膜层的自动压敏粘合片; 限制层，设置在可收缩膜层的一侧; 以及设置在限制层的与设置有可收缩膜层的一侧相对的一侧的压敏粘合剂层。 自动压敏粘合片是粘合剂降低处理之后的粘合剂层或粘合剂层具有压敏粘合力（180℃）的可剥离压敏粘合片 剥离硅镜片，拉伸速度：300mm /分钟）为6.5N / 10mm以下，其中自动压敏粘合剂片材从端部向一个方向卷起形成一个管状辊 或者当自动压敏压敏片被刺激以引起可收缩膜层的收缩时，从两个相对端向两个相对端的中心卷起形成两个管状辊。

公开(公告)号：US20110117706A1

公开(公告)日：2011-05-19

申请号：US13000395

申请日：2009-10-09

申请人： Akinori Nishio ,  Kazuyuki Kiuchi ,  Masayuki Yamamoto ,  Naoki Ishii

发明人： Akinori Nishio ,  Kazuyuki Kiuchi ,  Masayuki Yamamoto ,  Naoki Ishii

IPC分类号： H01L21/56 ,  B29C65/56

CPC分类号： H01L21/67132

摘要： A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape.

摘要翻译： 将其中安装有蛇形形状的冷却管的冷却板以堆叠方式放置在卡盘台的后表面上，用于吸持保持半导体晶片的后表面。 冷却剂通过冷却管循环，从而冷却卡盘台。 当卡盘台被冷却时，半导体晶片被吸住。 另外，在卡盘台被冷却的同时将保护带接合到半导体晶片。 也就是说，在保护带的接合期间，保护带通过预先冷却的半导体晶片被间接冷却而与半导体晶片的表面接合，同时直接接触到卡盘台。

公开(公告)号：US20100252185A1

公开(公告)日：2010-10-07

申请号：US12754858

申请日：2010-04-06

申请人： Kazuyuki Kiuchi ,  Akinori Nishio

发明人： Kazuyuki Kiuchi ,  Akinori Nishio

IPC分类号： B32B38/10 ,  C09J7/02 ,  C09J5/06

CPC分类号： H01L21/6836 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T428/14

摘要： The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer.

摘要翻译： 本发明提供一种可除去的压敏粘合片，其包括：能够通过热刺激自发卷起的自动滚压压敏粘合片，所述自动压敏粘合片包括第一压敏粘合剂层， 依次层叠第一刚性膜层，弹性层和热收缩膜层; 以及第二压敏粘合剂层和第二刚性膜层，其顺序层叠在自动压敏粘合片的热收缩膜层侧，其中第二压敏粘合剂层可从热收缩膜层移除 或者第二刚性膜层可从第二压敏粘合剂层移除。

公开(公告)号：US20110200744A1

公开(公告)日：2011-08-18

申请号：US13093940

申请日：2011-04-26

申请人： Takamasa HIRAYAMA ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Yukio Arimitsu ,  Daisuke Shimokawa ,  Tomoko Kishimoto

发明人： Takamasa HIRAYAMA ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Yukio Arimitsu ,  Daisuke Shimokawa ,  Tomoko Kishimoto

IPC分类号： B05D5/10 ,  B05D1/12

CPC分类号： H01L21/6836 ,  C08K7/22 ,  C09J7/29 ,  C09J7/385 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2205/11 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T83/0405 ,  Y10T428/25

摘要： The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

摘要翻译： 本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10〜38μm， 并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。 本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。