摘要:
A gas generator includes a holder made of metal having assembled thereto a cup filled with a gas generating agent and an igniter for burning the gas generating agent. The holder includes a body part, and an igniter fixing engagement part and a cup fixing engagement part projecting from the body part. These engagement parts are bent, so that the igniter and the cup are fixed by crimping to the holder. The engagement parts are both finish shaped by forging processing. A metal flow appearing in superficial layers of the engagement parts extends continuously from the body part through the engagement parts to return to the body part, without being divided in surfaces of the engagement parts.
摘要:
A gas generator includes a holder made of metal having assembled thereto a cup filled with a gas generating agent and an igniter for burning the gas generating agent. The holder includes a body part, and an igniter fixing engagement part and a cup fixing engagement part projecting from the body part. These engagement parts are bent, so that the igniter and the cup are fixed by crimping to the holder. The engagement parts are both finish shaped by forging processing. A metal flow appearing in superficial layers of the engagement parts extends continuously from the body part through the engagement parts to return to the body part, without being divided in surfaces of the engagement parts.
摘要:
Provided is a test apparatus that tests a device under test, comprising a pattern generating section that generates a test pattern for testing the device under test; a signal supplying section that supplies the device under test with a test signal corresponding to the test pattern; a trigger generating section that supplies a trigger signal to an external instrument connected to the device under test; and a synchronization control section that outputs, to the trigger generating section, a synchronization signal instructing generation of the trigger signal, based on at least a portion of the test pattern generated by the pattern generating section.
摘要:
A position alignment apparatus aligns a photosensitive substrate and a mask (projection image) at high speed and with high precision. The apparatus has a projection optical system for projecting a pattern image on a mask or reticle onto a photosensitive substrate, a detector for detecting a two-dimensional misalignment of a projected pattern image and a wafer, and means for moving the wafer along orthogonal x- and y-axis directions and for rotating the wafer along a rotational direction within a plane defined by the x- and y-axis directions so as to eliminate the misalignment, wherein the detector has first detecting means with an optical system for detecting at least a misalignment of the wafer along the x-axis direction through the projection lens, and second detecting means with an optical system separate from the projection lens and for detecting at least a misalignment of the wafer along a rotational direction.
摘要:
An exposure apparatus for exposing a photomask pattern onto a photosensitive substrate via a plurality of optical systems includes a source of illumination for irradiating the photomask pattern with beams of light adapted to pass through the pattern and optical systems onto the substrate. A scanning mechanism for synchronously scanning the photomask pattern with the beams of light is included to transfer the pattern to the substrate. A plurality of illumination intensity measuring devices is provided for substantially simultaneously measuring the illumination intensities of the beams of light passing through the optical systems.
摘要:
An exposure apparatus is used for reproducing a mask pattern of a semiconductor device or the like onto a photosensitive substrate using a holography. The holography is utilized also in a process for alignment between a mask pattern hologram and an exposure region of the substrate. The pattern hologram is recorded to a recording medium by interference between an object wave from the pattern and a reference wave, and a second hologram is formed to the medium by diffraction light from an alignment mark formed on the mask. Prior to reconstruction of the pattern image, reconstruction light from the second hologram, illuminated with a reconstruction wave, is irradiated onto the substrate arranged in place of the mask. A reproduction image of the alignment mark on the substrate surface illuminated with the reconstruction light is measured, and relative displacement between the medium and the substrate is detected from a result of the measurement. The relative positional relationship between the medium and the substrate is corrected in accordance with the displacement information, and, thereafter, the surface is exposed with a reconstruction image of the pattern hologram.
摘要:
An alignment system includes an element bearing a plurality of patterns on the surface thereof, the plurality of patterns being arranged in a predetermined direction, a stage for holding the element, scanning means for scanning the plurality of patterns of the element held by the stage in the predetermined direction and making position signals indicative of the positions of the plurality of patterns in the predetermined direction on the element, and operation means for operating and putting out a signal indicative of a position which is in a predetermined relation with the positions of the plurality of patterns in the predetermined direction, on the basis of the position signals.
摘要:
In an exposure apparatus for manufacturing semiconductor devices, a pattern on a photomask is aligned with a plurality of patterns formed on a wafer in a manner that detects and corrects misalignment, including, inter alia, rotational errors, not only between a photomask and a wafer, but also between a photomask and individual chips formed on the wafer, so that pattern matching is attained with very high accuracy. Apparatus for achieving this result employs different arrangements of alignment marks together with optical systems and positional adjustment devices.
摘要:
This invention relates to an exposure apparatus for synchronously scanning a mask and a photosensitive substrate with respect to a plurality of projection optical systems, thereby properly transferring an entire pattern area on the mask onto the photosensitive substrate. A plurality of sets of mask-side reference marks and substrate-side reference marks are arranged at positions corresponding to each other on the mask surface and the photosensitive substrate surface and at least at two positions conjugate with the plurality of projection optical systems. The displacement amount between an image of a mask-side reference mark or a substrate-side reference mark formed on the corresponding substrate-side reference mark or mask-side reference mark through the projection optical system and the position of the substrate-side reference mark and the mask-side reference mark is measured. The imaging characteristics of the plurality of projection optical systems are corrected in accordance with the displacement amount.
摘要:
Alignment of a mask with a projection-type exposing apparatus and alignment of the mask with a substrate are provided. Plural exposure areas of the substrate are exposed by light of a predetermined wavelength, which is also used for alignment purposes to reduce alignment error due to aberration of a projection optical system. A first alignment mark is disposed in a first area between adjacent exposure areas of the substrate. The mask has a main area, a second area in which a second mark is disposed, and a third area in which a third mark is disposed, the second area being outside of the main area and the third area being inside the second area. An illuminating device has a first status in which the second and third areas are illuminated simultaneously and has a second status in which the third area is illuminated, a first area adjacent to one of the exposure areas also being illuminated when the illuminating device has the second status. In the first status, a first detector detects the position of an image of the second mark formed by an objective optical system. In the second status, a second detector detects displacement between images of the first and third marks formed by the objective optical system and produces a detection signal. The mask is displaced relative to the substrate in response to the detection signal, so that the images of the first and third marks assume a predetermined relationship.